Method and apparatus for display screen shield replacement

    公开(公告)号:US10220537B2

    公开(公告)日:2019-03-05

    申请号:US13790212

    申请日:2013-03-08

    申请人: Saxum LLC

    发明人: Teo Chong Teck

    摘要: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

    SiC wafer producting method
    42.
    发明授权

    公开(公告)号:US10201907B2

    公开(公告)日:2019-02-12

    申请号:US15821045

    申请日:2017-11-22

    申请人: DISCO CORPORATION

    发明人: Kazuya Hirata

    摘要: An SiC wafer producing method includes setting a focal point of a pulsed laser beam to a single crystal SiC inside an ingot at a predetermined depth from an end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced. The pulsed laser beam is applied to the ingot, thereby forming a small circular modified portion on a c-plane present in the ingot at the predetermined depth, in which the modified portion is a region where SiC has been decomposed into Si and C. A separation layer is formed for separating the wafer from the ingot, the separation layer being composed of a plurality of continuous modified portions and a plurality of cracks isotropically formed on the c-plane so as to extend from each modified portion.

    Entry sheet for drilling
    43.
    发明授权

    公开(公告)号:US10159153B2

    公开(公告)日:2018-12-18

    申请号:US14389170

    申请日:2013-03-22

    摘要: The present invention provides an entry sheet for drilling excellent in hole position accuracy compared with the conventional entry sheet for drilling. Such an entry sheet for drilling is an entry sheet for drilling comprising metallic support foil and a layer comprising a resin composition formed on at least one surface of the metallic support foil, in which the resin composition contains a resin and 70 parts by mass to 130 parts by mass of molybdenum disulfide based on 100 parts by mass of the resin, and the layer comprising the resin composition has a thickness in a range from 0.02 to 0.3 mm.

    SiC WAFER PRODUCING METHOD
    46.
    发明申请

    公开(公告)号:US20180154543A1

    公开(公告)日:2018-06-07

    申请号:US15833556

    申请日:2017-12-06

    申请人: DISCO CORPORATION

    发明人: Kazuya Hirata

    IPC分类号: B26F3/00 H01L29/16 B26D7/08

    摘要: A SiC wafer producing method produces an SiC wafer from a single crystal SiC ingot. The method includes a separation layer forming step of setting a focal point of a pulsed laser beam having a transmission wavelength to single crystal SiC inside the ingot at a predetermined depth from an end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the pulsed laser beam to the ingot, thereby forming a plurality of modified portions on a c-plane present in the ingot at the predetermined depth and also forming cracks isotropically on the c-plane so as to extend from each modified portion, each modified portion being a region where SiC has been decomposed into Si and C, the modified portions and the cracks constituting a separation layer along which the wafer is to be separated from the ingot.

    Device and Method for the Ultrasonic Cutting of Workpieces

    公开(公告)号:US20180111284A1

    公开(公告)日:2018-04-26

    申请号:US15848625

    申请日:2017-12-20

    发明人: Stefan FISCHER

    IPC分类号: B26D7/08 B26D5/00

    摘要: A cutting guide device for ultrasonic cutting of workpieces is provided. The cutting guide device includes a cutting edge with a cutting edge longitudinal axis held in the cutting guide device, an ultrasound generator which oscillates the cutting edge, a control unit which controls movement of the cutting edge on a cutting path, and a first force measuring device which measures an actual lateral force on the cutting edge transverse to the cutting edge longitudinal axis and transverse to the cutting direction. The first force measuring device sends actual lateral force measurement values to the control unit, which changes at least one cutting parameter based on the measured actual lateral force. A method for using the ultrasonic cutting device is also provided.