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公开(公告)号:US3306471A
公开(公告)日:1967-02-28
申请号:US36855064
申请日:1964-05-19
申请人: DEVOL GEORGE C
发明人: DEVOL GEORGE C
IPC分类号: B25J9/04 , G05B19/16 , G05B19/27 , G05B19/418 , G05B19/42 , G05B19/425
CPC分类号: B25J9/045 , G05B19/16 , G05B19/27 , G05B19/4182 , G05B19/42 , G05B19/425 , G05B2219/36497 , G05B2219/36498 , G05B2219/40006 , G05B2219/45083 , Y02P90/083 , Y10T409/300896
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公开(公告)号:US3128645A
公开(公告)日:1964-04-14
申请号:US2304660
申请日:1960-04-18
发明人: ANTHONY MYRON L
CPC分类号: B23Q3/15546 , G05B19/128 , G05B19/27 , G05B2219/50249 , Y10S40/913 , Y10S279/90 , Y10T29/5105 , Y10T279/21 , Y10T483/134 , Y10T483/1755
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公开(公告)号:US3031902A
公开(公告)日:1962-05-01
申请号:US81523059
申请日:1959-05-22
发明人: PARSKE CHARLES A , HANSEN JOHN A
CPC分类号: G05B19/27 , B23Q16/065 , B24B47/06 , F15B21/08 , G05B19/0405 , Y10T74/1429 , Y10T74/1447 , Y10T74/1476 , Y10T74/1488
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公开(公告)号:US11181882B2
公开(公告)日:2021-11-23
申请号:US15627112
申请日:2017-06-19
申请人: THE BOEING COMPANY
发明人: Vivek Kapila , Stephen Dostert
摘要: A computer-implemented method is disclosed that is usable during production of an assembly using at least a first machine tool. The method comprises retrieving a predetermined production plan for the assembly, wherein the predetermined production plan comprises a plurality of operations using the first machine tool; acquiring input data to determine a production deviation from the predetermined production plan; determining, responsive to determining the production deviation, a modified production plan for the assembly by substituting one or more substitute operations for one or more of the plurality of operations of the predetermined production plan; and transmitting instructions to the first machine tool corresponding to the one or more substitute operations of the modified production plan.
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45.
公开(公告)号:US10859996B2
公开(公告)日:2020-12-08
申请号:US16237039
申请日:2018-12-31
申请人: Sony Corporation
发明人: Yosuke Muraki , Fumitaka Otsuka
摘要: To provide a microchip-type optical measuring apparatus which is able to automatically perform position adjustment of a microchip with respect to an optical axis of laser with high accuracy.A microchip-type optical measuring apparatus includes an irradiation detection unit which detects light generated by irradiating a microchip with laser, a position adjustment unit which changes a relative position of the microchip with respect to the irradiation detection unit, and a control unit which outputs a movement signal for a position in which an integrated value or an average value of a detected intensity of the light in a preset region becomes high to the position adjustment unit.
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公开(公告)号:US10725445B2
公开(公告)日:2020-07-28
申请号:US15473246
申请日:2017-03-29
申请人: Safe Tek, LLC
发明人: Michael Graves , Joseph Graves
IPC分类号: G06T7/60 , G05B19/27 , G05B19/4061 , G05B19/4063 , G06T7/50 , G06T7/90 , H04L29/08
摘要: A control system for monitoring operation of an industrial machine includes a processor and a tangible, non-transitory, computer-readable memory communicating with the processor. The tangible, non-transitory computer-readable memory includes instructions that, in response to execution by the processor, cause the processor to perform operations including: receiving image data from an imaging device that monitors an image zone around the industrial machine, analyzing the image data, generating, based upon the analyzing, operational data associated with the industrial machine, and transmitting the operational data to a display that is communicatively coupled to the control system.
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47.
公开(公告)号:US10343327B2
公开(公告)日:2019-07-09
申请号:US15325509
申请日:2015-07-02
申请人: SIDEL PARTICIPATIONS
发明人: Pierrick Protais
IPC分类号: B29C49/12 , B29C49/48 , B29C49/78 , B29K67/00 , B29L31/00 , G05B19/27 , B29K105/00 , G05B19/406
摘要: Disclosed is a method for parametrizing a facility for producing containers including: a mold having a movable mold bottom, a movable drawing rod and an electric machine coupled with the rod; from a configuration in which the rod is in a raised position and in the bottom in an extended position, operating the electric machine as a motor; assessing the resultant of the axial forces on the rod; when a variation is detected in the resultant of the forces, assigning an initial position to the rod; controlling the movement of the mold bottom towards the retracted position thereof; assigning to the rod the corresponding so-called final position of the rod; and calculating the difference between the final position and the initial position.
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公开(公告)号:US10331105B2
公开(公告)日:2019-06-25
申请号:US15013244
申请日:2016-02-02
IPC分类号: G05B19/19 , G05B19/27 , G05B19/406 , B25J9/16
摘要: A machine which repetitively performs an operation, or operations, on mass-produced parts which are subject to part-to-part variations compensates for such variations by self-adjustment of its operation, or operations, at a location, or locations, where an operation, or operations, is, or are, performed.
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公开(公告)号:US20190041825A1
公开(公告)日:2019-02-07
申请号:US16054595
申请日:2018-08-03
发明人: Philipp Rost , Elmar Schafers , Jurgen Reiser
IPC分类号: G05B19/404 , G05B13/04 , G05B19/27 , G05B19/402 , G05B19/408 , G05B19/4103
摘要: A control device of a machine tool includes a position controller and a model of a position-controlled axis. The position controller receives a position setpoint value, a corresponding actual position value and a compensation value; determines therefrom a resulting value; determines based on the resulting value an actuating signal; and outputs the actuating signal to the position-controlled axis. The position and/or the orientation of the tool relative to the workpiece are adjusted based on the actuating signal. A sequence of successive control errors is stored, in a storage device and read out sequentially in accordance with a sequence of the position setpoint values and supplied to the model. The model determines from the read-out control error a respective compensation value which is then supplied to the position controller, while simulating the mechanically dynamic behavior of the position-controlled axis.
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公开(公告)号:US10185299B2
公开(公告)日:2019-01-22
申请号:US15124692
申请日:2015-03-11
IPC分类号: G05B19/27 , G05B19/401
摘要: A method and apparatus for treating a circumferential edge of a part are described. The method includes the steps of (1) mapping the circumferential edge of the part with a measuring device, either directly or differentially from a known shape profile; and (2) using the measured data to more accurately follow the circumferential edge of the part during subsequent treatment processing steps, thereby improving the accuracy of the treatment process and compared with a non-mapped treatment process.
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