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公开(公告)号：US20210344339A1
公开(公告)日：2021-11-04
申请号：US17226535
申请日：2021-04-09
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Renald BOULESTIN
IPC: H03K17/687
Abstract: A device operate by alternating between first and second phases of operation. The device includes a first transistor and a first circuit. The first circuit operates to: couple a first conduction terminal of the first transistor to an output node of the device and a second conduction terminal of the first transistor to a first node of application of a potential during each first phase; and couple the first terminal of the first transistor to a second node of application of a potential and the second conduction terminal of the first transistor to the output node during each second phase of operation.
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公开(公告)号：US20210343609A1
公开(公告)日：2021-11-04
申请号：US17378398
申请日：2021-07-16
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Olivier Franiatte , Richard Rembert
IPC: H01L23/04 , H01L21/56 , H01L23/538 , H01L23/498
Abstract: A cover for an integrated circuit package includes a central plate and a peripheral frame surrounding the central plate. The peripheral frame is vertically spaced from and parallel to the central plate. The peripheral frame includes through openings formed therein. The cover can be used to package a semiconductor chip that is mounted to a substrate.
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公开(公告)号：US20210328403A1
公开(公告)日：2021-10-21
申请号：US17229710
申请日：2021-04-13
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Fabien QUERCIA , Jean-Michel RIVIERE
IPC: H01S5/02345 , H01L23/00
Abstract: Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.
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公开(公告)号：US11114404B2
公开(公告)日：2021-09-07
申请号：US16704082
申请日：2019-12-05
Inventor： Romain Coffy , Patrick Laurent , Laurent Schwartz
Abstract: An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.
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公开(公告)号：US20210273548A1
公开(公告)日：2021-09-02
申请号：US17187478
申请日：2021-02-26
Inventor： Alexandre Pons , Jean Camiolo , Meriem Mersel
Abstract: An embodiment of the present disclosure relates to a power supply interface comprising: a converter delivering a first DC voltage; a resistor connected between the converter and an output terminal of the interface delivering a second DC voltage; a first circuit delivering a second signal representative of a difference between the second DC voltage and a voltage threshold when a first signal is in a first state, and at a default value otherwise; a second circuit delivering a third signal representative of a value of a current in first resistor multiplied by a gain of the third circuit, and modifying the gain based on the second signal; and a third circuit configured to deliver a signal for controlling the converter based at least on the third signal.
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Patent Agency Ranking
公开(公告)号：US20210265949A1
公开(公告)日：2021-08-26
申请号：US17180748
申请日：2021-02-20
Abstract: An embodiment of the present disclosure relates to a device comprising an electronic circuit; an oscillation circuit comprising a quartz crystal, configured to provide a clock signal to the electronic circuit; and a heater configured to increase the temperature of the quartz crystal.
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公开(公告)号：US20210263579A1
公开(公告)日：2021-08-26
申请号：US17184027
申请日：2021-02-24
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Jean Camiolo , Cedric Force , Christophe Cochard , Alexandre Pons
IPC: G06F1/3206 , H02J1/08 , G06F13/38 , G06F13/42
Abstract: The present disclosure relates to an interface comprising: a terminal for delivering a DC voltage; a comparator for delivering a first signal representative of a comparison of the DC voltage with a high threshold; a comparator for delivering a second signal representative of a comparison of the DC voltage with a low threshold; and a circuit configured to: deliver successive pairs of values of high and low thresholds for a time period after the DC voltage crosses a first value of the low threshold; modify successive pairs of values of the thresholds based on the first and second signals to determine values of thresholds surrounding the DC voltage; and determining a current value of the DC voltage based on the values of thresholds surrounding the DC voltage.
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公开(公告)号：US20210255291A1
公开(公告)日：2021-08-19
申请号：US17177608
申请日：2021-02-17
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Cedric Tubert
IPC: G01S7/497 , G01S7/4865 , G01S17/36
Abstract: An embodiment device for synchronizing the emission and the reception of a light signal for a time-of-flight sensor comprises a power-control circuit configured to generate and transmit a power signal based on a control signal for controlling the sensor, the power signal being configured to supply power to an array of pixels of the sensor, a production module for producing a synchronization signal, which module is configured to produce the synchronization signal based on the control signal, and a switch configured to supply power to a light source of a device for emitting the light signal, the production module being further configured to transmit the synchronization signal to the switch such that the time taken to produce and transmit the synchronization signal and the time taken to generate and transmit the power signal are identical.
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公开(公告)号：US11094726B2
公开(公告)日：2021-08-17
申请号：US16829837
申请日：2020-03-25
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Laurent Simony
IPC: H01L27/146 , H04N5/369
Abstract: A global shutter pixel includes a first transistor and a first switch series-connected between a first node of application of a potential and an internal node of the pixel. A control terminal of the first transistor is coupled to a floating diffusion node of the pixel. At least two assemblies are coupled to the internal node, where each assembly is formed of a capacitor series-connected with a second switch coupling the capacitor to the internal node. A second transistor has a control terminal connected to the internal node and a first conduction terminal coupled to an output node of the pixel. The pixel operation is controlled to store an initialization voltage from the floating diffusion on one of the capacitors and a pixel integration voltage from the floating diffusion on another of the capacitors.
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公开(公告)号：US20210247212A1
公开(公告)日：2021-08-12
申请号：US17171726
申请日：2021-02-09
Applicant: STMicroelectronics SA , STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Rousset) SAS
Inventor： Laurent Beyly , Olivier Richard , Kenichi Oku
Abstract: An embodiment of the present disclosure relates to a method of detection of a touch contact by a sensor including a first step of comparison of a voltage with a first voltage threshold; and a second step of comparison of the voltage with a second voltage threshold, the second step being implemented if the first voltage threshold has been reached within a duration shorter than a first duration threshold, the second voltage threshold being higher than the first voltage threshold.
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