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公开(公告)号：US20200025569A1
公开(公告)日：2020-01-23
申请号：US16511152
申请日：2019-07-15
Applicant: STMicroelectronics S.r.l.
IPC: G01C19/72
Abstract: A device includes an optical resonator having four ports including a first port, a second port, a third port, and a fourth port. A first electronic circuit is configured to calculate a first information representative of a power difference between optical signals supplied by two of the four ports. A method of operating a device is also disclosed.
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532.发明申请公开(公告)号：US20200025567A1
公开(公告)日：2020-01-23
申请号：US16243876
申请日：2019-01-09
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V.
Inventor： Carlo Valzasina , Huantong Zhang , Matteo Fabio Brunetto , Gert Ingvar Andersson , Erik Daniel Svensson , Nils Einar Hedenstierna
IPC: G01C19/5776 , G01C19/5719 , G01C19/574
Abstract: A gyroscope includes a substrate, a first structure, a second structure and a third structure elastically coupled to the substrate and movable along a first axis. The first and second structure are arranged at opposite sides of the third structure with respect to the first axis A driving system is configured to oscillate the first and second structure along the first axis in phase with one another and in phase opposition with the third structure. The first, second and third structure are provided with respective sets of sensing electrodes, configured to be displaced along a second axis perpendicular to the first axis in response to rotations of the substrate about a third axis perpendicular to the first axis and to the second axis.
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公开(公告)号：US20200024132A1
公开(公告)日：2020-01-23
申请号：US16207035
申请日：2018-11-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Lorenzo Baldo , Enri Duqi , Flavio Francesco Villa
Abstract: A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.
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公开(公告)号：US10541079B2
公开(公告)日：2020-01-21
申请号：US16267811
申请日：2019-02-05
Applicant: STMicroelectronics S.r.l.
Inventor： Vincenzo Palumbo , Gabriella Ghidini , Enzo Carollo , Fabrizio Fausto Renzo Toia
IPC: H01F27/28 , H01F27/32 , H01L23/522 , H01L23/64 , H01L27/08 , H01F41/063 , H01L23/66
Abstract: An integrated transformer includes a primary winding and a secondary winding each having a spiral planar arrangement coils. A dielectric portion of dielectric material is interposed between the primary winding and the secondary winding. A field plate winding is electrically coupled with the primary winding. The field plate winding includes at least one field plate coil having a first lateral extension greater than a second lateral extension of a primary outer coil of the primary winding. The field plate coil is superimposed in plan view to the primary outer coil of the primary winding.
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公开(公告)号：US10535535B2
公开(公告)日：2020-01-14
申请号：US16020757
申请日：2018-06-27
Applicant: STMicroelectronics S.r.l.
Inventor： Fabio Marchisi
IPC: H01L21/48 , H01L21/56 , H01L23/367 , H01L23/498 , H01L23/00
Abstract: A semiconductor product such as an integrated circuit includes a laminar plastic substrate having first and second opposed surfaces and through holes extending through the substrate, electrically and/or thermally conductive material balls inserted in the through holes at the first surface of the substrate, and one or more semiconductor chips mounted at the first surface of the substrate, the semiconductor chip(s) electrically and/or thermally coupled with electrically and/or thermally conductive material balls inserted in the through holes.
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Patent Agency Ranking
公开(公告)号：US10531211B2
公开(公告)日：2020-01-07
申请号：US16135624
申请日：2018-09-19
Applicant: STMicroelectronics S.r.l.
Inventor： Edoardo Botti , Marco Raimondi
Abstract: A diagnostic circuit is used for detecting the load status of an audio amplifier. The audio amplifier includes two output terminals for connection to a speaker. The diagnostic circuit may include a first circuit, which configured to generate a first signal indicating whether a signal provided via the two output terminals comprises an audio signal. A second circuit can be configured to detect a first measurement signal being indicative for the output current provided via the two output terminals, and to compare the first measurement signal with at least one threshold in order to generate a second signal indicating whether the output current has a low current amplitude profile or a high current amplitude profile. A third circuit can be configured to generate a diagnostic signal as a function of the first and the second signal.
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公开(公告)号：US10527512B2
公开(公告)日：2020-01-07
申请号：US15783894
申请日：2017-10-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Alberto Pagani , Bruno Murari , Marco Ferrera , Domenico Giusti , Daniele Caltabiano
Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.
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538.发明申请公开(公告)号：US20190386953A1
公开(公告)日：2019-12-19
申请号：US16557507
申请日：2019-08-30
Applicant: STMicroelectronics S.r.l.
Inventor： Francesco Caserta
Abstract: A method for transmitting an Internet Protocol (IP) data packet from a first device to a second device, includes: transmitting a message from the first device to a telephone number associated with the second device; receiving the message at the second device and, in response to the message, determining a first IP address of the first device and transmitting a first IP packet from the second device to the first IP address; receiving the first IP packet at the first device and determining a source IP address of the first IP packet; and transmitting a second IP packet from the first device to the source IP address of the first IP packet.
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公开(公告)号：US20190386816A1
公开(公告)日：2019-12-19
申请号：US16433847
申请日：2019-06-06
Applicant: STMicroelectronics S.r.l.
Inventor： Rosalino Critelli , Giuseppe Guarnaccia
Abstract: A cryptographic method includes providing memory locations for storing encrypted data. The memory locations have respective addresses and are accessible via a communication bus. The method includes receiving over the communication bus access requests to the memory locations, wherein the access requests include burst requests for access to respective sets of the memory locations starting from respective start addresses, and calculating as a function of the start addresses encryption/decryption cryptographic masks based on cryptographic keys. Plain text data is received for encryption and the method includes applying the cryptographic masks to the plain text data to obtain therefrom encrypted data, and including the encrypted data into output data for transmission over the communication bus.
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公开(公告)号：US10510955B2
公开(公告)日：2019-12-17
申请号：US15953921
申请日：2018-04-16
Inventor： Pierre Morin , Michel Haond , Paola Zuliani
Abstract: A phase change memory includes an L-shaped resistive element having a first part that extends between a layer of phase change material and an upper end of a conductive via and a second part that rests at least partially on the upper end of the conductive via and may further extend beyond a peripheral edge of the conductive via. The upper part of the conductive via is surrounded by an insulating material that is not likely to adversely react with the metal material of the resistive element.
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