公开(公告)号：US20230179457A1

公开(公告)日：2023-06-08

申请号：US17538803

申请日：2021-11-30

Applicant: STMICROELECTRONICS, INC.

Inventor： Andrea Lorenzo VITALI

IPC: H04L27/06

CPC classification number: H04L27/06

Abstract: An electronic device receives wireless signals encoded with data in an amplitude-shift keying format. The electronic device passes the wireless signals through a low-pass filter. The low-pass filter has a cutoff frequency between a first frequency associated with data values of a first type and a second frequency associated with data values of a second type. The low-pass filter has the effect of changing the wireless signal from the amplitude-shift keying format to an on-off keying format without losing the data. The electronic device decodes the data from the wireless signal in the on-off keying format.

公开(公告)号：US20230036201A1

公开(公告)日：2023-02-02

申请号：US17811804

申请日：2022-07-11

Applicant: STMICROELECTRONICS, INC.

Inventor： Ian Harvey Juralbal ARELLANO

IPC: H01L23/495 ,  H01L23/31

Abstract: A semiconductor package device having a porous copper adhesion promoter layer is provided. The porous copper adhesion promoter layer developed via de-metallization of the intermetallic compound layer grown after the thermal treatment of a thin metal layer plated on the copper base material. The highly selective de-metallization of the intermetallic compound layer ensures that the plated surfaces are not affected and does not create wire-bondability issues. The porous copper layer solves the delamination between the carrier and the epoxy molding compound by providing mechanical interlock features. Further, increasing the surface area of contact between the carrier and the epoxy molding compound improves the mechanical interlock features.

公开(公告)号：US20230032490A1

公开(公告)日：2023-02-02

申请号：US17884492

申请日：2022-08-09

Applicant: STMICROELECTRONICS, INC.

Inventor： Cheng PENG ,  Xiaoyong YANG

IPC: B25J9/16 ,  B25J19/02

Abstract: A robotic device including one or more proximity sensing systems coupled to various portions of a robot body. The proximity sensing systems detect a distance of an object about the robot body and the robotic device reacts based on the detected distance. The proximity sensing systems obtain a three-dimensional (3D) profile of the object to determine a category of the object. The distance of the object is detected multiple times in a sequence to determine a movement path of the object.

公开(公告)号：US11557548B2

公开(公告)日：2023-01-17

申请号：US17137262

申请日：2020-12-29

Applicant: STMICROELECTRONICS, INC.

Inventor： Aaron Cadag ,  Lester Joseph Belalo ,  Ela Mia Cadag

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A semiconductor package formed utilizing multiple etching steps includes a lead frame, a die, and a molding compound. The lead frame includes leads and a die pad. The leads and the die pad are formed from a first conductive material by the multiple etching steps. More specifically, the leads and the die pad of the lead frame are formed by at least three etching steps. The at least three etching steps including a first etching step, a second undercut etching step, and a third backside etching step. The second undercut etching step forming interlocking portions at an end of each lead. The end of the lead is encased in the molding compound. This encasement of the end of the lead with the interlocking portion allows the interlocking portion to mechanically interlock with the molding compound to avoid lead pull out. In addition, by utilizing at least three etching steps the leads can be formed to have a height that is greater than the die pad of the lead frame. This differential in height reduces the span of wires used to form electrical connections within the semiconductor package. These reductions in the span of the wires reduces the chances of wire to wire and wire to die short circuiting because the wire sweep of the wires is reduced when the molding compound is placed.

公开(公告)号：US11507654B2

公开(公告)日：2022-11-22

申请号：US16994484

申请日：2020-08-14

Applicant: STMICROELECTRONICS, INC.

Inventor： Maurizio Gentili ,  Massimo Panzica

IPC: G06F21/53 ,  G06F21/56 ,  G06F13/28 ,  G06F13/24 ,  H04L29/06 ,  G06F21/57 ,  H04L9/40 ,  G06F21/74 ,  G06F21/79

Abstract: A secure engine method includes providing an embedded microcontroller in an embedded device, the embedded microcontroller having internal memory. The method also includes providing a secure environment in the internal memory. The secure environment method recognizes a boot sequence and restricts user-level access to the secure environment by taking control over the secure environment memory. Taking such control may include disabling DMA controllers, configuring at least one memory controller for access to the secure environment, preventing the execution of instructions fetched from outside the secure environment, and only permitting execution of instructions fetched from within the secure environment. Secure engine program instructions are then executed to disable interrupts, perform at least one secure operation, and re-enable interrupts after performing the at least one secure operation. Control over the secure environment memory is released, which can include clearing memory, re-enabling DMA controllers, and restoring memory controller parameters.

公开(公告)号：US20220320014A1

公开(公告)日：2022-10-06

申请号：US17845867

申请日：2022-06-21

Applicant: STMICROELECTRONICS, INC.

Inventor： Ian Harvey ARELLANO

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L21/48

Abstract: In various embodiments, the present disclosure provides semiconductor devices, packages, and methods. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and an encapsulant on the die pad and the lead. A plurality of cavities extends into at least one of the die pad or the lead to a depth from a surface of the at least one of the die pad or the lead. The depth is within a range from 0.5 μm to 5 μm. The encapsulant extends into the plurality of cavities. The cavities facilitate improved adhesion between the die pad or lead and the encapsulant, as the cavities increase a surface area of contact with the encapsulant, and further increase a mechanical interlock with the encapsulant, as the cavities may have a rounded or semi-spherical shape.

公开(公告)号：US20220293498A1

公开(公告)日：2022-09-15

申请号：US17688013

申请日：2022-03-07

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics, Inc.

Inventor： Fulvio Vittorio FONTANA ,  Davide Maria BENELLI ,  Jefferson Sismundo TALLEDO

IPC: H01L23/495 ,  H01L23/16 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor device, such as a Quad-Flat No-lead (QFN) package, includes a semiconductor chip arranged on a die pad of a leadframe. The leadframe has an array of electrically-conductive leads around the die pad. The leads in the array have distal ends facing away from the die pad as well as recessed portions at an upper surface of the leads. Resilient material, such as low elasticity modulus material, is present at the upper surface of the leads and filling the recessed portions. An insulating encapsulation is molded onto the semiconductor chip. The resilient material is sandwiched between the insulating encapsulation and the distal ends of the leads. This resilient material facilitates flexibility of the leads, making them suited for reliable soldering to an insulated metal substrate.

公开(公告)号：US11407098B2

公开(公告)日：2022-08-09

申请号：US16696772

申请日：2019-11-26

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS, INC.

Inventor： Marco Bianco ,  Lorenzo Bracco ,  Mahesh Chowdhary ,  Roberto Mura ,  Stefano Paolo Rivolta ,  Federico Rizzardini

IPC: B25F5/00 ,  B23B45/00 ,  G01C19/00

Abstract: A device for generating a control signal based on the linear movement of a linear member is provided. The device includes a linear member, a rotatable member, a first inertial measurement unit (IMU) coupled to the rotatable member and a second IMU having a fixed position. The device also includes a processing circuit which uses sensing signals from the IMUS to determine an attitude of the first IMU referenced to the second IMU and generate a control signal based on the attitude.

公开(公告)号：US11348863B2

公开(公告)日：2022-05-31

申请号：US16706414

申请日：2019-12-06

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: In various embodiments, the present disclosure provides semiconductor packages, devices, and methods. In one embodiment, a device includes a die pad, leads that are spaced apart from the die pad, and a semiconductor die on the die pad. The semiconductor die has a first surface and a second surface opposite the first surface. The second surface faces the die pad. An encapsulant is provided on the semiconductor die, the die pad and the leads, and the encapsulant has a first surface opposite the die pad and the leads, and a second surface opposite the first surface. The second surface of the encapsulant extends between the die pad and an adjacent lead. The second surface of the encapsulant is spaced apart from the first surface of the encapsulant by a first distance, and an exposed surface of the die pad is spaced apart from the first surface of the encapsulant by a second distance that is greater than the first distance.

公开(公告)号：US20220128360A1

公开(公告)日：2022-04-28

申请号：US17571973

申请日：2022-01-10

Applicant: STMicroelectronics, Inc.

Inventor： Yamu HU ,  Deyou FANG ,  David MCCLURE ,  Huantong ZHANG ,  Naren K. SAHOO

IPC: G01C19/5719 ,  H04L27/38

Abstract: A microelectromechanical system (MEMS) gyroscope sensor has a sensing mass and a quadrature error compensation control loop for applying a force to the sensing mass to cancel quadrature error. To detect fault, the quadrature error compensation control loop is opened and an additional force is applied to produce a physical displacement of the sensing mass. A quadrature error resulting from the physical displacement of the sensing mass in response to the applied additional force is sensed. The sensed quadrature error is compared to an expected value corresponding to the applied additional force and a fault alert is generated if the comparison is not satisfied.