Abstract:
The present invention relates to methods and devices that support mobility of a client across a campus, particularly mobility across VLANs and subnets, while preserving the client's assigned IP address. Both layer 2 and layer 3 packets are supported. Mobility support most clearly applies to wireless clients, but could apply to other kinds of mobile connections, even to wired connections. A smart server is adapted to support multiple VLANs and to modify and redirect packets in sessions with a client that moves from one VLAN to another, preserving the client's assigned IP address. Two or more smart servers, in cooperation with a smart manger, modify packets and tunnel them between smart servers when a client that moves from one VLAN to another and from one smart server to another, again preserving the client's assigned IP address. A similar approach applies to support mobility of a client that moves between subnets that are supervised by two smart servers, with the second smart server acting on behalf of the first smart server and tunneling packets back and forth to the first smart server. Particular aspects of the present invention are described in the claims, specification and drawings.
Abstract:
An apparatus and method for processing an integrated circuit employing optical interference fringes. During processing, light is directed on the integrated circuit and based upon the detection of interference fringes, further processing may be controlled. One implementation involves charged particle beam processing of an integrated circuit as function of detection of interference fringes. A charged particle beam trench milling operation is performed in or on the substrate of an integrated circuit. Light is directed on the floor of the trench. When the floor approaches the underlying circuit structures, some light is reflected from the floor of the trench and some light penetrates the substrate and is reflected off the underlying circuit structures. Interference fringes may be formed from the constructive or destructive interference between the light reflected from the floor and the light from the circuit structures. Processing may be controlled as function of the detection of interference fringes.
Abstract:
Methods are provided for fabricating a semiconductor light-emitting diode (LED) device by providing an LED wafer assembly having an LED stack and selectively roughening and/or texturing a light-emitting surface of the LED stack's n-doped layer. In this manner, light extraction from the LED device is improved.
Abstract:
A data playing system for a video platform and a method of the same are provided. The data playing system for a video platform includes: a rear end information generating unit having an operating interface to provide, edit and generate an announced data; a signal frequency-dividing unit for extracting at least one video signal containing video data therein and the announced data of the rear end information generating unit, and for loading the announced data of the rear end information generating unit into the video signal; and a user end outputting unit for extracting and playing the video signal to represent the announced data of the rear end information generating unit and the video data.
Abstract:
A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.
Abstract:
A mechanism for suppressing grinding-cutting vibration comprises a C-shaped base, a fixed support seat, a clamp device and a vibration absorber. Based on vibration absorbing principle of the vibration theory, the clamp device is connected to the movable cutting machine, so as to move along with the cutting machine during the machining operation, and the clamp force applied to clamp the workpiece is adjustable. By such arrangements, the vibration energy produced at the time of cutting the workpiece can be transferred to the vibration absorber through the clamp device, and then a part of the vibration energy will be absorbed by the vibration absorber, thus achieving the objective of reducing vibration of the cut position.
Abstract:
Localized trenches or access holes are milled in a semiconductor substrate to define access points to structures of an integrated circuit intended for circuit editing. A conductor is deposited, such as with a focused ion beam tool, in the access holes and a localized heat is applied to the conductor for silicide formation, especially at the boundary between a semiconductor structure, such as diffusion regions, and the deposited conductor. Localized heat may be generated at the target location through precise laser application, current generation through the target location, or a combination thereof.
Abstract:
A method of detecting optical disc error information on an optical disc, for applying in an optical disc drive, the method comprising: first, detecting whether the optical disc is blank, if not, perform the following: checking whether a seek error occurred, if yes, recording a seek error mark; while reading a data region, recording data error information, the data error information comprises an error count, and a corresponding data error location; finally, outputting the optical disk error information according to the data error information and the seek error mark.
Abstract:
A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system.