公开(公告)号：US20070090643A1

公开(公告)日：2007-04-26

申请号：US11466737

申请日：2006-08-23

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: F16L27/00

CPC classification number: F16L27/093 ,  F16L33/03 ,  F28F3/12 ,  F28F9/0256

Abstract: A pipe fitting includes a first pipework with a hollow interior, a casing pipe sheathed onto the first pipework, a stopping portion disposed at an end of the first pipework, a first junction disposed at another end of the first pipework and interconnected to the interior, at least one penetrating hole disposed on the first pipework and interconnected with the interior, and two first washers with an interval apart such that the penetrating hole is situated between the two first washers. The casing pipe has a circular sheath and a cold water junction disposed on an external wall of the circular sheath, and the circular sheath has a circular sheath hole sheathed onto the first pipework, such that the internal wall of the circular sheath is in a close contact with the two first washers and the cold water junction is interconnected with the interior of the first pipework.

Abstract translation: 管配件包括具有中空内部的第一管道，套在第一管道上的套管，设置在第一管道末端的止挡部分，设置在第一管道的另一端并互连到内部的第一连接点， 设置在第一管道上并与内部相互连接的至少一个穿孔，以及间隔开的两个第一垫圈，使得穿透孔位于两个第一垫圈之间。 套管具有圆形护套和设置在圆形护套的外壁上的冷水接合点，圆形护套具有套在第一管道上的圆形护套孔，使得圆形护套的内壁处于闭合状态 与两个第一洗涤器和冷水接头的接触与第一管道的内部相互连接。

公开(公告)号：US20060262505A1

公开(公告)日：2006-11-23

申请号：US11399333

申请日：2006-04-07

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: H05K7/20

CPC classification number: H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2275/085 ,  G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the first cover and the second cover are formed with a receiving portion corresponding to each other, respectively. The receiving portions are adapted to be connected to the conduit connectors. A channel portion is formed between the first cover and the second cover for receiving one end of the heat pipe. With the above arrangement, the present invention can perform the heat dissipations of different heat-generating elements simultaneously to make the heat-generating elements operate under acceptable working temperatures. Further, the present invention can be widely used in the heat dissipation of compact electronic products.

Abstract translation: 安装在电子发热元件上的水冷散热器包括水冷头部件和至少一个热管。 水冷头部件包括第一盖和连接到第一盖的第二盖。 第一盖和第二盖的两端分别形成有彼此对应的接收部。 接收部分适于连接到导管连接器。 通道部分形成在第一盖和第二盖之间，用于接收热管的一端。 通过上述结构，本发明可以同时进行不同的发热元件的散热，使得发热元件在可接受的工作温度下工作。 此外，本发明可广泛用于紧凑型电子产品的散热。

公开(公告)号：US06425191B1

公开(公告)日：2002-07-30

申请号：US09837815

申请日：2001-04-18

Applicant: Rong-Hui Kao ,  Ming-Dar Guo ,  Jih-Churng Twu ,  Tsung-Chieh Tsai ,  Chia-Chun Cheng

Inventor： Rong-Hui Kao ,  Ming-Dar Guo ,  Jih-Churng Twu ,  Tsung-Chieh Tsai ,  Chia-Chun Cheng

IPC: F26B300

CPC classification number: H01L21/67034

Abstract: An apparatus and a method for reducing solvent residue in a solvent-type dryer for drying semiconductor wafers have been disclosed. The apparatus is constructed by a tank body, a wafer carrier, an elevator means, a tank cover, a solvent vapor conduit and an exhaust means. The exhaust means is provided for fluid communication with a compartment in the tank cover such that any residual solvent vapor or any organic residue in the compartment left from the wafer drying cycle can be evacuated to a factory exhaust system. The present invention novel method for reducing solvent or organic residue in the dryer can be carried out, after the removal of the dried wafers from the dryer, by evacuating the compartment in the tank cover for a time period of between about 30 sec. and about 300 sec. until all residual solvent vapor or organic residue is evacuated.

Abstract translation: 已经公开了用于干燥半导体晶片的溶剂型干燥器中用于还原溶剂残留物的装置和方法。 该装置由罐体，晶片载体，电梯装置，罐盖，溶剂蒸气导管和排气装置构成。 提供排气装置用于与罐盖中的隔室流体连通，使得离开晶片干燥循环的隔室中的任何残留溶剂蒸气或任何有机残余物可被排空到工厂排气系统。 本发明的用于还原干燥机中的溶剂或有机残留物的新方法可以在从干燥器中除去干燥的晶片之后，通过将储罐盖中的隔室抽空约30秒的时间来进行。 约300秒 直到所有残留的溶剂蒸气或有机残余物被抽空。

公开(公告)号：US20080225486A1

公开(公告)日：2008-09-18

申请号：US11847667

申请日：2007-08-30

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: H05K7/20

CPC classification number: H01L23/427 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system.

Abstract translation: 散热装置包括MOSFET散热器，南桥散热器，北桥散热器和水阻塞连接器。 在每个散热器之间设置一个热管，以将这些散热器串联连接。 此外，北桥散热器具有散热底板和安装在散热底板的一半部分上的散热体。 此外，水封连接器包括中空基座和设置在基座的两个位置并彼此连通的两个连接管。 水封连接器的底座连接到北桥散热器的散热底板的另一半部分。 当使用水冷时，水封连接器的两个连接管可以与水冷循环系统串联连接。

公开(公告)号：US20080012294A1

公开(公告)日：2008-01-17

申请号：US11466733

申请日：2006-08-23

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: F16L27/00

CPC classification number: F16L27/093

Abstract: A pipe connector includes a pipe-connecting piece hollowed in its interior, a pipe-covering piece covered on the pipe-connecting piece, and a sealing piece detachably provided on the outside of one end of the pipe-covering piece. The pipe-connecting piece has a first connecting port for communicating with its interior. At least one through hole is provided on the pipe-connecting piece for communicating with its interior. Further, two leakage-proof washers are provided at an interval with the through hole disposed therebetween. The pipe-covering piece has an annular sheath and a second connecting port provided on the outer wall of the annular sheath. The annular sheath is covered on the pipe-connecting piece to allow its inner wall to tightly contact with the two leakage-proof washers, so that the second connecting port is in communication with the interior of the pipe-connecting piece.

Abstract translation: 管连接器包括在其内部中空的管连接件，覆盖在管连接件上的管覆盖件和可拆卸地设置在管覆盖件的一端的外侧上的密封件。 管连接件具有用于与其内部连通的第一连接口。 至少一个通孔设置在管连接件上，用于与内部连通。 此外，两个防漏垫圈间隔设置有通孔。 管道覆盖件具有环形护套和设置在环形护套的外壁上的第二连接口。 环形护套被覆盖在管连接件上，以允许其内壁与两个防漏垫圈紧密接触，使得第二连接口与管连接件的内部连通。

公开(公告)号：US06878578B1

公开(公告)日：2005-04-12

申请号：US10134823

申请日：2002-04-26

Applicant: Jih-Churng Twu ,  Tsung-Chieh Tsai ,  Roung-Hui Kao ,  Chia-Chun Cheng

Inventor： Jih-Churng Twu ,  Tsung-Chieh Tsai ,  Roung-Hui Kao ,  Chia-Chun Cheng

IPC: H01L21/28 ,  H01L21/306 ,  H01L21/336 ,  H01L21/8238 ,  H01L29/51

CPC classification number: H01L21/28211 ,  H01L21/02052 ,  H01L21/823857 ,  H01L29/51 ,  H01L29/6659

Abstract: A continuous and integrated cleaning/preparation process is described to condition a silicon surface for the formation of a high quality ultra thin gate oxide described. The process is conducted with the wafer surface immersed in an aqueous solution the composition of which is varied continuously according to the steps of the process. The process includes the initial removal of contaminants and particulates followed by the removal of a native oxide. Next the silicon surface is dressed in the present of both HF and ozone by removing a thin surface layer. Any interfacial contamination or surface structural defects which lay under the native oxide are thereby removed. Next a high quality chemical oxide is grown by the action of the ozone in the aqueous bath. The chemical oxide is found to be of higher purity and structural quality than native oxide and provides a superior passivation of the active surface prior to gate oxidation. The chemical oxide is incorporated into the final gate oxide and, because of it's high quality, results in improved device performance of the final gate oxide.

Abstract translation: 描述了连续且集成的清洁/制备方法以调节硅表面以形成所述的高质量超薄栅极氧化物。 该工艺是将晶片表面浸入水溶液中进行的，该水溶液的组成根据该方法的步骤连续变化。 该方法包括初始去除污染物和微粒，然后除去天然氧化物。 接下来，通过去除薄的表面层，将硅表面穿过HF和臭氧的现在。 由此除去在天然氧化物之下的任何界面污染物或表面结构缺陷。 接下来，通过臭氧在水浴中的作用生长高质量的化学氧化物。 发现化学氧化物具有比天然氧化物更高的纯度和结构质量，并且在栅极氧化之前提供优异的活性表面钝化。 化学氧化物被结合到最终的栅极氧化物中，并且由于其高质量，导致最终栅极氧化物的器件性能的提高。

公开(公告)号：US07852630B2

公开(公告)日：2010-12-14

申请号：US12191532

申请日：2008-08-14

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: H05K7/20 ,  H01L23/34 ,  F28F7/00 ,  F25B21/02

CPC classification number: F25B21/00 ,  F25B2321/021 ,  F25B2321/0252 ,  F25D23/006 ,  F28D15/0233 ,  F28D15/0275 ,  H01L23/38 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y02B30/66 ,  H01L2924/00

Abstract: A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided.

Abstract translation: 散热装置包括基座，第一热管，第一散热器，第二热管，热电冷却器和第二散热器。 第一热管包括第一端和第二端。 第一热管的第一端连接到基座。 第一热管的第二端连接到第一散热器的底部。 第二热管包括第一端和第二端。 第二热管的第一端连接到基座。 第二热管的第二端连接到热电冷却器的顶端。 第二散热器安装在热电冷却器的底部并且位于第一散热器的一侧。 热电冷却器空间与发热元件分开。 因此，在冷却过程中由热电冷却器产生的水不会扩散到发热元件，并且可以避免发热元件的短路。

公开(公告)号：US20060238985A1

公开(公告)日：2006-10-26

申请号：US11403949

申请日：2006-04-14

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating assembly includes a first cover and a second cover securely connected to the first cover. The first cover has a substantially U-shaped configuration and two first tube connecting portions formed on two ends thereof and a first arcuate path defined therein. The second cover has a substantially U-shaped configuration and two second tube connecting portions formed on two ends thereof to correspond to the two first tube connecting portions to respectively define a first tube receiving space to securely receive therein an inlet pipe and a second tube receiving space to securely receive therein an outlet pipe and a second arcuate path defined therein to correspond to the first arcuate path.

Abstract translation: 散热组件包括第一盖和牢固地连接到第一盖的第二盖。 第一盖具有基本上U形的构造，并且形成在其两端上的两个第一管连接部和限定在其中的第一弧形路径。 第二盖具有基本上U形的构造，并且两个第二管连接部形成在其两端上，以对应于两个第一管连接部分，以分别限定第一管容纳空间，以牢固地容纳入口管和第二管接收 空间以可靠地容纳其中限定在其中的出口管和第二弧形路径，以对应于第一弧形路径。

公开(公告)号：US06647998B2

公开(公告)日：2003-11-18

申请号：US09885772

申请日：2001-06-20

Applicant: Jih-Churng Twu ,  Ming-Dar Guo ,  Tsung-Chieh Tsai ,  Sheng-Hsiung Tseng ,  Wei-Ming You ,  Yao-Pin Huang ,  Chia-Chun Cheng ,  Chin-Hsiung Ho ,  Ming Te More

Inventor： Jih-Churng Twu ,  Ming-Dar Guo ,  Tsung-Chieh Tsai ,  Sheng-Hsiung Tseng ,  Wei-Ming You ,  Yao-Pin Huang ,  Chia-Chun Cheng ,  Chin-Hsiung Ho ,  Ming Te More

IPC: B08B310

CPC classification number: H01L21/67034 ,  Y10S134/902

Abstract: An electrostatic charge-free solvent-type dryer for drying semiconductor wafers after a wet bench process is disclosed in a preferred embodiment and in an alternate embodiment. In the preferred embodiment, the electrostatic charge-free solvent-type dryer is constructed by a tank body, a wafer carrier, an elevator means, a tank cover and a conduit for feeding the flow of solvent vapor. At least one of the tank cover, the conduit for feeding the flow of solvent vapor and the plurality of partition plates is fabricated of a non-electrostatic material such that electrostatic charge is not generated in the flow of solvent vapor. In the alternate embodiment, a deionizer is further provided in the tank cavity for producing a flux of positive ions to neutralize any negative ions that are possibly produced in the flow of solvent vapor.

公开(公告)号：US20130107547A1

公开(公告)日：2013-05-02

申请号：US13281430

申请日：2011-10-26

Applicant: Chia-Chun Cheng ,  Lei-Lei Liu

Inventor： Chia-Chun Cheng ,  Lei-Lei Liu

IPC: F21V29/00 ,  F28D15/04

CPC classification number: F21V29/51 ,  F21V29/713 ,  F21V29/763 ,  F21Y2105/00 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating module includes a first heat conducting plate, a second heat conducting plate and at least one heat pipe. The second heat conducting plate is disposed opposite to the first heat conducting plate. Each of the at least one heat pipe includes a first fixing portion, a first curved portion, a second fixing portion, a second curved portion and a connecting portion. The first fixing portion is positioned on the first heat conducting plate and the second fixing portion is positioned on the second heat conducting plate. The first curved portion is curved and extended from the first fixing portion. The second curved portion is curved and extended from the second fixing portion. The connecting portion is connected between the first curved portion and the second curved portion. At least parts of the first curved portion and at least parts of the second curved portion are not coplanar.

Abstract translation: 散热模块包括第一导热板，第二导热板和至少一个热管。 第二导热板与第一导热板相对设置。 所述至少一个热管中的每一个包括第一固定部分，第一弯曲部分，第二固定部分，第二弯曲部分和连接部分。 第一固定部位于第一导热板上，第二固定部位于第二导热板上。 第一弯曲部分从第一固定部分弯曲并延伸。 第二弯曲部分从第二固定部分弯曲并延伸。 连接部分连接在第一弯曲部分和第二弯曲部分之间。 第一弯曲部分的至少部分和第二弯曲部分的至少部分不共面。