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公开(公告)号：US11806771B2
公开(公告)日：2023-11-07
申请号：US16443019
申请日：2019-06-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chengyuan Luo
CPC classification number: B21D11/02 , B29C70/74 , C23C14/042 , B29K2705/00 , B29K2905/00 , H10K71/00 , H10K71/166
Abstract: Embodiments of the present disclosure provide a manufacturing method of a mask plate. The manufacturing method of the mask includes: embedding a shaping mold in a mask region of a mask sheet; fixing the mask sheet with the shaping mold; performing a stretching process on the mask sheet fixed with the shaping mold; and separating the mask sheet from the shaping mold to form the mask.
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公开(公告)号：US20220328584A1
公开(公告)日：2022-10-13
申请号：US17851123
申请日：2022-06-28
Applicant: BOE Technology Group Co., Ltd.
Inventor： Chengyuan Luo , Qing Dai
Abstract: This disclosure relates to the field of display technologies, and discloses a display substrate, a method for fabricating the same, and a display device. The display substrate includes: a substrate, and a plurality of pixels and a pixel definition layer on the substrate, wherein the pixels include long sides and short sides; and the pixel definition layer includes long-side sections adjacent to the long sides, and short-side sections adjacent to the short sides, wherein heights of the long-side sections are greater than heights of the short-side sections.
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53.发明授权公开(公告)号：US11342541B2
公开(公告)日：2022-05-24
申请号：US16332502
申请日：2018-10-25
Applicant: BOE Technology Group Co., Ltd.
Inventor： Chengyuan Luo
Abstract: A method of fabricating a light emitting display panel. The method includes providing a substrate having a display area and a peripheral area, the substrate including a pixel definition layer for defining a plurality of subpixel apertures for a light emitting layer in the display area; attaching a solvent vapor compensation reservoir to the peripheral area of the substrate, the solvent vapor compensation reservoir having one or more ink droplet receiving grooves configured to receive an ink droplet and a connection layer, the solvent vapor compensation reservoir removably attached to the peripheral area of the substrate through the connection layer; dispensing ink droplets into the plurality of subpixel apertures and the one or more ink droplet receiving grooves; drying the ink droplets dispensed into the plurality of subpixel apertures and the one or more ink droplet receiving grooves; and removing the solvent vapor compensation reservoir from the substrate.
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公开(公告)号：US11251403B2
公开(公告)日：2022-02-15
申请号：US16332499
申请日：2018-04-28
Applicant: BOE Technology Group Co., Ltd.
Inventor： Chengyuan Luo
IPC: H01L51/52 , H01L27/142 , H01L51/56
Abstract: The present application provides display substrate having a display area and a peripheral area. The display substrate includes a base substrate; a plurality of light emitting elements on the base substrate and in the display area; an encapsulating layer on a side of the plurality of light emitting elements distal to the base substrate to encapsulate the plurality of light emitting elements; and a first barrier layer on the base substrate and in the peripheral area and forming a first enclosure substantially surrounding a first area. The first barrier layer includes an up-conversion material configured to convert an incident light into an ultraviolet light. The encapsulating layer includes a first organic encapsulating sub-layer on the base substrate.
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55.发明授权公开(公告)号：US11228017B2
公开(公告)日：2022-01-18
申请号：US16111512
申请日：2018-08-24
Applicant: BOE Technology Group Co., Ltd.
Inventor： Chengyuan Luo
Abstract: The present disclosure provides a packaging cover plate, a method for manufacturing the same and a light emitting diode display, the packaging cover plate includes a cover plate body and a groove structure disposed on a first surface of the cover plate body, wherein the cover plate body comprises a flexible ceramic material, and the groove structure is filled with an adhesive material and a thermally conductive material. The packaging cover plate provided by the present disclosure has a bending property while having a barrier to water and oxygen, and does not undergo a shape change due to thermal expansion and contraction under a change of the ambient temperature. In addition, the present disclosure can improve the adhesion between the package cover plate and the packaging adhesive and improve the heat dissipation effect.
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Patent Agency Ranking
56.发明申请公开(公告)号：US20200273815A1
公开(公告)日：2020-08-27
申请号：US16553365
申请日：2019-08-28
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chengyuan Luo
IPC: H01L23/00 , H01L27/12 , H01L23/34 , H01L23/427 , H01L23/26
Abstract: The disclosure relates to an array substrate and a method for fabricating an array substrate. The array substrate includes a base substrate, a cover layer on the base substrate, an opening at least partially passing through the cover layer, a stress buffer structure adjacent to the opening and on a side of the cover layer facing the base substrate, wherein the stress buffer structure includes a phase change material, wherein a height of a portion of the cover layer on the phase change material is lower than a height of a portion of the cover layer adjacent to the phase change material.
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公开(公告)号：US10326105B2
公开(公告)日：2019-06-18
申请号：US15309511
申请日：2016-02-23
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chengyuan Luo
Abstract: The present disclosure provides a packaging assembly and a manufacturing method thereof. The packaging assembly comprising a first substrate, a second substrate arranged opposite to the first substrate, an electronic device located between the first substrate and the second substrate, a protective layer covering the electronic device, and a bonding layer for bonding the first substrate and the second substrate so as to realize surface-to-surface packaging. The packaging assembly further comprising an isolation layer located between the bonding layer and the protective layer and adhered to both them, wherein an adhesion force between the material for forming the isolation layer and that for forming the bonding layer is smaller than an adhesion force between the material for forming the protective layer and that for forming the bonding layer.
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公开(公告)号：US20170033163A1
公开(公告)日：2017-02-02
申请号：US14436069
申请日：2014-07-14
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiqiang Jiao , Shibo Jiao , Chengyuan Luo
CPC classification number: H01L27/322 , H01L27/3218 , H01L51/5268 , H01L51/56
Abstract: The invention provides a display apparatus and a method for manufacturing the same, relates to the field of display technology, and solves the problem of low display luminance due to the existing display apparatus being affected by other film layers. A display apparatus comprises a light emitting unit and further comprises several layers of thin film located in the light emission path of the light emitting unit, and at least one of the several layers of thin film has nanoparticles.
Abstract translation: 本发明提供了一种显示装置及其制造方法，涉及显示技术领域，并且解决了由于现有的显示装置受到其他胶片层的影响而导致的低显示亮度的问题。 显示装置包括发光单元，并且还包括位于发光单元的发光路径中的若干层薄膜，并且多层薄膜中的至少一层具有纳米颗粒。
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公开(公告)号：US20150349288A1
公开(公告)日：2015-12-03
申请号：US14761844
申请日：2014-09-28
Applicant: BOE Technology Group Co., Ltd.
Inventor： Chengyuan Luo , Chun-jan Wang
CPC classification number: H01L51/525 , H01L51/5237 , H01L51/5246 , H01L51/5259 , H01L51/56 , H01L2227/323
Abstract: Embodiments of the invention disclose a light emitting display panel. The light emitting display panel comprises a cover plate, a substrate disposed opposite to each other, a plurality of light emitting devices located between the cover plate and the substrate, and a packaging structure surrounding the light emitting devices. The packaging structure comprises at least three rows of protruded frames and a first packaging material which is located between adjacent protruded frames, wherein four sides of each of the protruded frames are looped and the at least three rows of protruded frames are adjacent to and embedded in each other in an inward and outward direction. Adjacent ones of the at least three rows of protruded frames are alternately disposed on the cover plate and the substrate and protrude in opposite directions, and non-adjacent ones of the at least three rows of protruded frames are disposed on the same one of the cover plate and the substrate and protrude in the same direction. In the above light emitting display panel, resin adhesive or desiccant is filled in gaps between the frames so as to prolong an invasion path of water vapor and oxygen gas spatially, an effect of preventing water vapor and oxygen gas is thus increased. The light emitting display panel has advantages of good sealing property, simple manufacturing process and the like.
Abstract translation: 本发明的实施例公开了一种发光显示面板。 发光显示面板包括盖板，彼此相对布置的基板，位于盖板和基板之间的多个发光器件以及围绕发光器件的封装结构。 包装结构包括至少三排突出框架和位于相邻突出框架之间的第一包装材料，其中每个突出框架的四个侧面环绕，并且至少三排突出框架邻近并嵌入 彼此在向内和向外的方向。 所述至少三排突出框架中的相邻的突出框架交替地设置在所述盖板和所述基板上并且沿相反方向突出，并且所述至少三排突出框架中的不相邻的突出框架布置在所述盖板 板和基板并沿相同的方向突出。 在上述发光显示面板中，树脂粘合剂或干燥剂填充在框架之间的间隙中，以便在空间上延长水蒸气和氧气的侵入路径，从而提高了防止水蒸气和氧气的效果。 发光显示面板具有密封性好，制造工艺简单等优点。
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公开(公告)号：US20250124876A1
公开(公告)日：2025-04-17
申请号：US18577444
申请日：2023-03-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chengyuan Luo , Pan Xu , Ying Han , Donghui Zhao , Guangshuang Lv , Xing Zhang , Miao Liu , Xing Yao , Cheng Xu
IPC: G09G3/3266 , H10K59/131
Abstract: The present disclosure provides a circuitry structure and a display substrate. The circuitry structure includes a base substrate, and a functional transistor and a signal transmission line arranged on the base substrate. The functional transistor includes a first conductive connection member, a first electrode, a second electrode, at least two gate electrode patterns and at least one active pattern. Orthogonal projections of the first electrode, the second electrode and the at least two gate electrode patterns onto the base substrate at least partially overlap with an orthogonal projection of the active pattern onto the base substrate, and first ends of the gate electrode patterns are coupled to each other. The first conductive connection member is arranged at a layer different from the gate electrode pattern, and coupled to second ends of the gate electrode patterns. The signal transmission line is coupled to the first conductive connection member.
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