公开(公告)号：US20190236434A1

公开(公告)日：2019-08-01

申请号：US15928813

申请日：2018-03-22

Applicant: CompoSecure, LLC

Inventor： Adam Lowe

IPC: G06K19/077 ,  G06K19/02

Abstract: A transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from an origin on the card periphery to a terminus in the opening. The card has a greater flex resistance than a card having a comparative discontinuity with the terminus and the origin the same distance from a line defined by a first long side of the card periphery in an absence of one or more strengthening features. Strengthening features include a discontinuity wherein one of the terminus or the origin are located relatively closer to the first long side of the card periphery than the other, a plurality of discontinuities wherein fewer than all extend from the card periphery to the opening, a self-supporting, non-metal layer disposed on at least one surface of the card, or one or more ceramic reinforcing tabs surrounding the opening.

公开(公告)号：US10318859B2

公开(公告)日：2019-06-11

申请号：US15976612

申请日：2018-05-10

Applicant: COMPOSECURE, LLC

Inventor： Adam Lowe ,  John Herslow ,  Luis Dasilva ,  Brian Nester

IPC: H01Q1/22 ,  G06K19/077 ,  H01L23/66 ,  H01Q1/38

Abstract: A card having a metal layer and an opening or cut-out region in the metal layer, with a dual-interface integrated circuit (IC) module disposed in the opening or cut-out region. A ferrite layer is disposed below the metal layer and a booster antenna is attached to the ferrite layer. A vertical hole extends beneath the IC module through the ferrite layer. The booster antenna may be physically connected to the IC module or may be configured to inductively couple to the IC module. In some embodiments, the IC may be disposed in or on a non-conductive plug disposed within the opening or cut-out region, or the vertical hole may have a non-conductive lining, or a connector may be disposed between the booster antenna and the IC module in the vertical hole.

公开(公告)号：US10289944B2

公开(公告)日：2019-05-14

申请号：US15742813

申请日：2015-07-08

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/07 ,  G06K19/077

Abstract: A dual interface smart card having a metal layer includes an SC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.

公开(公告)号：US20190073578A1

公开(公告)日：2019-03-07

申请号：US16124711

申请日：2018-09-07

Applicant: CompoSecure, LLC

Inventor： Adam Lowe ,  Syeda Hussain

IPC: G06K19/077 ,  G06K19/06

Abstract: A transaction card and a process of making the transaction card are described. The transaction card includes a core having first and second faces, a core thickness therebetween, and an opening, and embedded electronics disposed in the opening.

公开(公告)号：US12208599B2

公开(公告)日：2025-01-28

申请号：US17166080

申请日：2021-02-03

Applicant: CompoSecure, LLC

Inventor： Adam Lowe

IPC: B32B3/30 ,  B32B15/00 ,  B32B15/20 ,  B32B33/00 ,  B42D25/00 ,  B42D25/373 ,  B44C1/14 ,  B44D5/00 ,  G06K19/02 ,  G06K19/077 ,  B42D25/415 ,  B42D25/445 ,  C23C22/52 ,  C23C22/63 ,  G06K19/04

Abstract: A non-provisioned card having a front side and a back side, and at least one visible surface that is patinated or activated to promote patination.

公开(公告)号：US20240054311A1

公开(公告)日：2024-02-15

申请号：US18383996

申请日：2023-10-26

Applicant: CompoSecure, LLC

Inventor： Adam Lowe

IPC: G06K19/077

CPC classification number: G06K19/0772 ,  G06K19/07718

Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.

公开(公告)号：US20230419328A1

公开(公告)日：2023-12-28

申请号：US18037465

申请日：2021-11-17

Applicant: CompoSecure, LLC

Inventor： Adam Lowe ,  Todd Nuzum

IPC: G06Q20/40 ,  G06Q20/34 ,  G06Q20/32 ,  G06Q20/02

CPC classification number: G06Q20/4018 ,  G06Q20/353 ,  G06Q20/3278 ,  G06Q20/023

Abstract: Systems, methods, transaction cards, mobile devices, processors, and computer memory programmed with machine-readable instructions, for providing a dynamic Card Verification Value (dCVV) to a user of a transaction card. A mobile device associated with the user and with the transaction card initiates a non-payment near field communication (NFC) with the transaction card, receives a message from the transaction card in the non-payment NFC communication, transmits a prompt to an IP address or web address over a global computer information network, and receives a secure communication from containing the dCVV from a server accessible from the IP address or web address in response to the prompt. The dCVV code is then provided to the user. In embodiments, the non-payment NFC may be initiated via a card tap, a user interface, or a communication from a website.

公开(公告)号：US11842240B2

公开(公告)日：2023-12-12

申请号：US17502790

申请日：2021-10-15

Applicant: CompoSecure, LLC

Inventor： Adam Lowe

IPC: G06K19/06 ,  G06K19/07 ,  G06K19/077

CPC classification number: G06K19/0723 ,  G06K19/07773

Abstract: A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.

公开(公告)号：US11501128B2

公开(公告)日：2022-11-15

申请号：US17101092

申请日：2020-11-23

Applicant: CompoSecure, LLC

Inventor： Adam Lowe ,  Syeda Hussain

IPC: G06K19/077 ,  G06K19/06 ,  G06K19/02

Abstract: A transaction card is described. The transaction card includes a non-plastic layer, one or more embedded electronics, a fill layer, and one or more additional layers. The non-plastic layer has first and second faces and a thickness therebetween, and at least a first opening in the first face. The one or more embedded electronic components are disposed in or adjacent the first opening. The fill layer is in contact with the embedded electronic components, disposed in portions of the first opening not occupied by the embedded electronics. The one or more additional layers are disposed over the fill layer.

公开(公告)号：US11315002B2

公开(公告)日：2022-04-26

申请号：US17101096

申请日：2020-11-23

Applicant: CompoSecure, LLC

Inventor： Adam Lowe ,  Syeda Hussain

IPC: G06K19/077 ,  G06K19/06 ,  G06K19/02

Abstract: A process for making a transaction card defined by a plurality of layers is described. The process includes providing a first portion of the card, the first portion comprising a non-plastic layer having first and second faces and a thickness therebetween; forming an opening in the non-plastic layer, the opening defined through the first face; disposing embedded electronics in the opening; providing a second portion of the card; and providing a fill disposed in portions of the opening not occupied by the embedded electronics and attaching the first portion of the card to the second portion of the card.