公开(公告)号：US4592959A

公开(公告)日：1986-06-03

申请号：US673011

申请日：1984-11-19

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: C08K5/09 ,  C08L83/04 ,  H01B3/46 ,  B32B9/06

CPC classification number: H01B3/46 ,  C08K5/09 ,  C08L83/04 ,  Y10S428/901 ,  Y10T428/31663

Abstract: A method of extending the shelf-life of an uncured silicone resin formulation which includes a primary amine therein comprises adding an acid to the formulation in a molar quantity approximately equal to the number of moles of primary amine present in the formulation, said acid being volatile at or below the curing temperature of the resin formulation.

Abstract translation: 包括伯胺在内的未固化的有机硅树脂配方的保质期的方法包括以约等于制剂中存在的伯胺的摩尔数的摩尔量向制剂中加入酸，所述酸是挥发性的 处于或低于树脂制剂的固化温度。

公开(公告)号：US4508758A

公开(公告)日：1985-04-02

申请号：US453004

申请日：1982-12-27

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: C08L83/00 ,  C08L83/04 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  B05D5/12

CPC classification number: H01L21/56 ,  H01L23/296 ,  H01L2924/0002 ,  Y10T29/49146

Abstract: In the manufacture of encapsulated hybrid circuits from a substrate having a plurality of such circuits contained thereon, individual devices are first mounted on the circuit, encapsulant having a yield point stress and viscosity so as not to creep or flow is applied around the periphery of each circuit on the substrate so as to form a wall or dam around each such circuit except for the bonding pads for external connection of each circuit, a second encapsulant is then flow coated over the circuit and devices contained thereon within the previously formed wall such that the second encapsulant is retained within the wall. The encapsulants are then cured or dried and the individual encapsulated circuit can then be further processed such as by separating the individual circuits on the substrate and applying external connectors to the bonding pads.

Abstract translation: 在从包含多个这样的电路的基板制造封装的混合电路中，首先将单独的器件安装在电路上，具有屈服点应力和粘度的密封剂，以便不会蠕变或流动施加在每个 电路，以便除了用于每个电路的外部连接的接合焊盘之外围绕每个这样的电路形成一个壁或坝，然后将第二密封剂流过涂覆在电路上，并且其上装载在先前形成的壁内的装置，使得 第二密封剂保留在壁内。 然后将密封剂固化或干燥，然后可以进一步处理单个封装的电路，例如通过分离衬底上的各个电路并将外部连接器施加到接合焊盘。

公开(公告)号：US4171240A

公开(公告)日：1979-10-16

申请号：US900367

申请日：1978-04-26

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: G03F7/42 ,  H05K3/00 ,  H05K3/28 ,  B29C17/08

CPC classification number: G03F7/422 ,  H05K3/288 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/0786 ,  H05K2203/0789 ,  H05K2203/0796 ,  H05K3/002

Abstract: A method of removing a cured epoxy from a surface is disclosed. The method comprises treating at least the epoxy with a suitable swelling agent to swell the epoxy. The swelled epoxy is then treated with an oxidizing agent to oxidize the swelled epoxy. The oxidized epoxy is then treated with an etchant comprising sulfuric acid to remove the epoxy from the surface.

Abstract translation: 公开了从表面除去固化的环氧树脂的方法。 该方法包括用合适的溶胀剂处理至​​少环氧树脂以溶胀环氧树脂。 然后用氧化剂处理溶胀的环氧化物以氧化溶胀的环氧树脂。 然后用包含硫酸的蚀刻剂处理氧化的环氧树脂以从表面除去环氧树脂。