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公开(公告)号:US20200164647A1
公开(公告)日:2020-05-28
申请号:US16630020
申请日:2017-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Si-lam Choy , Michael W Cumbie , Chien-Hua Chen , Jeffrey R Pollard
Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.
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公开(公告)号:US20200164645A1
公开(公告)日:2020-05-28
申请号:US16629120
申请日:2017-07-26
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W Cumbie , Anthony Fuller , Chien-Hua Chen , Zhen Yi Li
Abstract: Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.
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公开(公告)号:US10319657B2
公开(公告)日:2019-06-11
申请号:US15546846
申请日:2015-03-27
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W Cumbie
Abstract: A circuit package panel containing a packaging of epoxy mold compounds and a circuit device in the packaging, wherein the packaging comprises, at least one hybrid layer of a first epoxy mold compound and a second epoxy mold compound of a different composition.
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公开(公告)号:US09895888B2
公开(公告)日:2018-02-20
申请号:US15303316
申请日:2014-04-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W Cumbie , Diane R Hammerstad
IPC: B41J2/14
CPC classification number: B41J2/1433 , B41J2/1404 , B41J2002/14419 , B41J2202/20
Abstract: In one example, a fluid flow structure includes a fluid dispensing micro device embedded in a molding having a channel therein through which fluid may flow directly to the device. The device contains multiple fluid ejectors and multiple fluid chambers each near an ejector. Each chamber has an inlet through which fluid from the channel may enter the chamber and an outlet through which fluid may be ejected from the chamber. A perimeter of the channel surrounds the inlets but is otherwise unconstrained in size by the size of the device.
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公开(公告)号:US09844946B2
公开(公告)日:2017-12-19
申请号:US15234223
申请日:2016-08-11
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W Cumbie
CPC classification number: B41J2/17526 , B41J2/14072 , B41J2/14145 , B41J2/1433 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1607 , B41J2/1628 , B41J2/1637 , B41J2/17553 , B41J2002/14362 , B41J2002/14419 , B41J2202/20
Abstract: In one example, a molded printhead includes a printhead die in a molding having a channel therein through which fluid may pass directly to a back part of the die. The front part of the die is exposed outside the molding surrounding the die. Electrical connections are made between terminals at the front part of the die and contacts to connect to circuitry external to the printhead.
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公开(公告)号:US11780227B2
公开(公告)日:2023-10-10
申请号:US17312360
申请日:2019-06-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael W Cumbie , Michael G Groh
CPC classification number: B41J2/1639 , B41J2/14016 , B41J2/14201 , B41J2/1601 , B41J2/1607 , B41J2/1625 , B41J2/18
Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.
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公开(公告)号:US11577456B2
公开(公告)日:2023-02-14
申请号:US16495472
申请日:2017-05-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W Cumbie
IPC: B29C64/209 , B33Y30/00 , B29D99/00 , B41J2/14 , B41J2/16
Abstract: Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.
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公开(公告)号:US11478793B2
公开(公告)日:2022-10-25
申请号:US16605619
申请日:2017-10-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Viktor Shkolnikov , Chien-Hua Chen , Michael W Cumbie
Abstract: In an example implementation, a microfluidic device includes a first layer with a first microfluidic channel and a second layer with a second microfluidic channel. The first and second channels are adjacent to one another at a channel intersection, and a conductive membrane valve extends across and covers the channel intersection to separate the first and second channels. The microfluidic device includes a conductive trace to open the membrane valve and join the first and second channels by supplying an electric current to heat and melt a thinned region of the membrane valve.
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公开(公告)号:US11433670B2
公开(公告)日:2022-09-06
申请号:US16958607
申请日:2019-04-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W Cumbie , Chien-Hua Chen , Randy Hoffman
Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.
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公开(公告)号:US11305537B2
公开(公告)日:2022-04-19
申请号:US16607204
申请日:2018-03-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Galen Cook , Garrett E Clark , Michael W Cumbie , James R Przybyla , Richard Seaver , Frank D Derryberry , Si-Iam J Choy
Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.
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