FLUIDIC EJECTION DIES WITH ENCLOSED CROSS-CHANNELS

    公开(公告)号:US20200164647A1

    公开(公告)日:2020-05-28

    申请号:US16630020

    申请日:2017-07-31

    Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.

    Fluid flow structure
    54.
    发明授权

    公开(公告)号:US09895888B2

    公开(公告)日:2018-02-20

    申请号:US15303316

    申请日:2014-04-22

    CPC classification number: B41J2/1433 B41J2/1404 B41J2002/14419 B41J2202/20

    Abstract: In one example, a fluid flow structure includes a fluid dispensing micro device embedded in a molding having a channel therein through which fluid may flow directly to the device. The device contains multiple fluid ejectors and multiple fluid chambers each near an ejector. Each chamber has an inlet through which fluid from the channel may enter the chamber and an outlet through which fluid may be ejected from the chamber. A perimeter of the channel surrounds the inlets but is otherwise unconstrained in size by the size of the device.

    Molded panels
    57.
    发明授权

    公开(公告)号:US11577456B2

    公开(公告)日:2023-02-14

    申请号:US16495472

    申请日:2017-05-01

    Abstract: Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.

    Microfluidic devices
    58.
    发明授权

    公开(公告)号:US11478793B2

    公开(公告)日:2022-10-25

    申请号:US16605619

    申请日:2017-10-30

    Abstract: In an example implementation, a microfluidic device includes a first layer with a first microfluidic channel and a second layer with a second microfluidic channel. The first and second channels are adjacent to one another at a channel intersection, and a conductive membrane valve extends across and covers the channel intersection to separate the first and second channels. The microfluidic device includes a conductive trace to open the membrane valve and join the first and second channels by supplying an electric current to heat and melt a thinned region of the membrane valve.

    Nozzle arrangements and supply channels

    公开(公告)号:US11305537B2

    公开(公告)日:2022-04-19

    申请号:US16607204

    申请日:2018-03-12

    Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.

Patent Agency Ranking