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    Previous layer nuisance reduction through oblique illumination
    52.
    发明授权
    Previous layer nuisance reduction through oblique illumination 有权

    公开(公告)号：US10818005B2

    公开(公告)日：2020-10-27

    申请号：US16293599

    申请日：2019-03-05

    Applicant: KLA—Tencor Corporation

    Inventor： Jingshan Zhong ,  Bjorn Brauer ,  Lisheng Gao

    IPC: G06T7/00 ,  G06F30/398

    Abstract: Methods and systems for determining a layer on which a defect detected on a wafer is located are provided. One method includes detecting defects on a wafer by directing light to the wafer at first and second angles of incidence and determining locations of the defects on the wafer based on the output corresponding to the defects. For one of the defects detected in the output generated for one spot illuminated on the wafer with the light directed to the wafer at the first and second angles, the method includes comparing the locations of the one of the defects determined based on the output generated with the light directed to the one spot on the wafer at the first and second angles. The method further includes determining a layer of the wafer on which the one of the defects is located based on results of the comparing.

    Repeater Defect Detection
    53.
    发明申请
    Repeater Defect Detection 审中-公开

    公开(公告)号：US20200240928A1

    公开(公告)日：2020-07-30

    申请号：US16845681

    申请日：2020-04-10

    Applicant: KLA-Tencor Corporation

    Inventor： Eugene Shifrin ,  Bjorn Brauer ,  Sumit Sen ,  Ashok Mathew ,  Sreeram Chandrasekaran ,  Lisheng Gao

    IPC: G01N21/95 ,  H01L21/66 ,  G01N21/956

    Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.

    High sensitivity repeater defect detection
    55.
    发明授权
    High sensitivity repeater defect detection 有权

    公开(公告)号：US10395358B2

    公开(公告)日：2019-08-27

    申请号：US15804980

    申请日：2017-11-06

    Applicant: KLA-Tencor Corporation

    Inventor： Bjorn Brauer ,  Eugene Shifrin ,  Ashok Mathew ,  Chetana Bhaskar ,  Lisheng Gao ,  Santosh Bhattacharyya ,  Hucheng Lee ,  Benjamin Murray

    IPC: G06T7/00 ,  G01N21/95

    Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.

    APPARATUS AND METHODS FOR FINDING A BEST APERTURE AND MODE TO ENHANCE DEFECT DETECTION
    57.
    发明申请
    APPARATUS AND METHODS FOR FINDING A BEST APERTURE AND MODE TO ENHANCE DEFECT DETECTION 审中-公开

    公开(公告)号：US20170307545A1

    公开(公告)日：2017-10-26

    申请号：US15643333

    申请日：2017-07-06

    Applicant: KLA-Tencor Corporation

    Inventor： Pavel Kolchin ,  Richard Wallingford ,  Lisheng Gao ,  Grace H. Chen ,  Markus B. Huber ,  Robert M. Danen

    IPC: G01N21/95

    CPC classification number: G01N21/9501

    Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image. In one aspect, determining an optimum one of the combinations of the first apertures includes selecting a set of one or more individual apertures that result in the highest signal to noise ratio for the defect area, and the method includes setting the optimum combination of the first apertures on the inspection tool and inspecting a sample using such optimum combination of the first apertures.

    Detecting defects on a wafer using defect-specific information
    59.
    发明授权
    Detecting defects on a wafer using defect-specific information 有权

    公开(公告)号：US09721337B2

    公开(公告)日：2017-08-01

    申请号：US14944130

    申请日：2015-11-17

    Applicant: KLA-Tencor Corporation

    Inventor： Kenong Wu ,  Meng-Che Wu ,  Lisheng Gao

    IPC: G06T7/00 ,  G01N21/95

    CPC classification number: G06T7/001 ,  G01N21/9501 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer using defect-specific information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest formed on the wafer and a known DOI occurring proximate to or in the pattern of interest. The information includes an image of the target on the wafer. The method also includes searching for target candidates on the wafer or another wafer. The target candidates include the pattern of interest. The target and target candidate locations are provided to defect detection. In addition, the method includes detecting the known DOI in the target candidates by identifying potential DOI locations in images of the target candidates and applying one or more detection parameters to images of the potential DOI locations.

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