公开(公告)号：US20240019196A1

公开(公告)日：2024-01-18

申请号：US18034864

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun YOUN ,  Duchan KI

IPC: F25D23/06 ,  F25D23/02 ,  F16L59/065 ,  F16L59/08

CPC classification number: F25D23/063 ,  F25D23/064 ,  F25D23/028 ,  F16L59/065 ,  F16L59/08 ,  F25D2201/14 ,  F25D2201/12

Abstract: A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Accordingly, the vacuum adiabatic body may be improved in productivity.

公开(公告)号：US20240003612A1

公开(公告)日：2024-01-04

申请号：US18034926

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun YOUN ,  Jaehyun BAE

IPC: F25D23/06 ,  F25D23/02 ,  B32B3/26 ,  B32B3/08 ,  B32B27/32 ,  B32B5/18 ,  B32B27/06 ,  B32B15/18 ,  B32B15/085

CPC classification number: F25D23/062 ,  F25D23/028 ,  B32B3/266 ,  B32B3/08 ,  B32B27/32 ,  B32B5/18 ,  B32B27/065 ,  B32B15/18 ,  B32B15/085 ,  F25D2201/14 ,  F25D2323/024 ,  B32B2307/304 ,  B32B2509/10

Abstract: A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body may further include a side plate extending in a height direction of the vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Optionally, a hinge shaft installed to extend in a depth direction (Z-axis) of the vacuum space from the outside of the vacuum space may be provided. Optionally, at least one of the plate or the support may have a member in which an extension line of a component extending in a height direction (y-axis) of the vacuum space does not pass through the hinge shaft. Accordingly, the vacuum adiabatic body may be improved in productivity.

公开(公告)号：US20240003480A1

公开(公告)日：2024-01-04

申请号：US18034949

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun YOUN ,  Bongjin KIM ,  Jaehyun BAE

IPC: F16L59/065 ,  F25D23/06

CPC classification number: F16L59/065 ,  F25D23/062 ,  F25D2201/14

Abstract: A vacuum adiabatic body includes a first plate, a second plate, and a seal for sealing the first plate and the second plate to provide a vacuum space. Optionally, the vacuum adiabatic body includes a support for maintaining the vacuum space. Optionally, the vacuum adiabatic body includes a heat transfer resistor for reducing heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body includes a component coupler that is connected to at least one of the first and second plates and to which the component is coupled. Optionally, the vacuum adiabatic body includes a side plate extending in a height direction of the vacuum space. Thus, a vacuum adiabatic body for achieving an industrial purpose is provided.

公开(公告)号：US20230417479A1

公开(公告)日：2023-12-28

申请号：US18034825

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun YOUN ,  Sungsub LEE

IPC: F25D23/06 ,  F16L59/065 ,  B32B3/26 ,  B32B5/18 ,  B32B15/04 ,  B32B15/18 ,  B32B7/05 ,  B32B27/32 ,  B32B27/06

CPC classification number: F25D23/062 ,  F16L59/065 ,  B32B3/266 ,  B32B5/18 ,  B32B15/046 ,  B32B2509/10 ,  B32B7/05 ,  B32B27/32 ,  B32B27/065 ,  F25D2201/14 ,  B32B2307/304 ,  B32B15/18

Abstract: A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Optionally, the vacuum adiabatic body may include a tube provided as a tube passing through the first plate. Optionally, the vacuum adiabatic body may include a flange provided on the first plate to guide the tube. The tube may perform functions of exhaust and getter necessary for an operation of the vacuum adiabatic body. Examples of the aforementioned tube may be ports such as an exhaust port or a getter port.

公开(公告)号：US20230390855A1

公开(公告)日：2023-12-07

申请号：US18034680

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun YOUN ,  Minsu RYU

IPC: B23K11/08 ,  F25D23/06 ,  B23K11/00

CPC classification number: B23K11/08 ,  F25D23/063 ,  B23K11/002 ,  F25D2201/14 ,  B23K2101/045

Abstract: A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Accordingly, the vacuum adiabatic body may be improved in productivity.

公开(公告)号：US20230202371A1

公开(公告)日：2023-06-29

申请号：US18108219

申请日：2023-02-10

Applicant: LG Electronics Inc.

Inventor： Wonyeong JUNG ,  Myoungju KANG ,  Deokhyun YOUN ,  Sungsub LEE ,  Sora KIM ,  Daewoong KIM ,  Jangseok LEE

IPC: B60N3/10 ,  B60R7/04 ,  F25B21/04 ,  F25D19/00 ,  F25D23/08 ,  F25D23/02 ,  F25D23/06 ,  F25B21/02

CPC classification number: B60N3/104 ,  B60R7/04 ,  F25B21/04 ,  F25D19/00 ,  F25D23/08 ,  F25D23/02 ,  F25D23/06 ,  F25D23/065 ,  F25B21/02 ,  F25D19/006 ,  F25B2321/023 ,  F25D2201/14 ,  F25B2321/025

Abstract: A vacuum insulator including a heat diffusion block placed in a vacuum space; a thermoelectric module, in the vacuum space, coming into contact with the heat diffusion block so as to exchange heat therewith: and a heat sink exchanging heat with the thermoelectric module and placed in a first space or a second place. High heat-insulation performance and heat-transfer performance can be obtained.

公开(公告)号：US20220357099A1

公开(公告)日：2022-11-10

申请号：US17619906

申请日：2020-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun YOUN ,  Daewoong KIM

IPC: F25D23/06

Abstract: Provided is a vacuum adiabatic body. The vacuum adiabatic body includes a cover assembly configured to cover the conductive resistance sheet. The cover assembly includes an inner cover configured to protect an inside, an outer cover configured to protect an outside, and a front cover configured to a front side, and at least one of the inner cover or the outer cover extends toward the other end of at least one of the first plate or the second plate. According to the embodiments, an edge and a side surface of the vacuum adiabatic body may be protected together.

公开(公告)号：US20220316791A1

公开(公告)日：2022-10-06

申请号：US17749679

申请日：2022-05-20

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun YOUN

IPC: F25D23/06 ,  F16L59/065 ,  F25D19/00 ,  F25D23/08

Abstract: A vacuum adiabatic body includes: a first plate, a second plate, a sealing part sealing the first plate and the second plate to provide a third space, a supporting unit maintaining the third space, and a heat resistance unit for decreasing a heat transfer amount between the first plate and the second plate. The second plate may include a front part and a side part having a different extending direction from the front part, and the side part defines at least one portion of a wall for the third space.

公开(公告)号：US20220307758A1

公开(公告)日：2022-09-29

申请号：US17620054

申请日：2020-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Daewoong KIM ,  Chanho CHUN ,  Sungsub LEE ,  Jangseok LEE

IPC: F25D23/06 ,  F25D23/08 ,  F25D23/02 ,  F25D11/02

Abstract: Provided is a vacuum adiabatic body. The vacuum adiabatic body includes a conductive resistance sheet configured to connect the first plate to the second plate so as to reduce a heat transfer amount between the first plate and the second plate and a cover assembly configured to cover the conductive resistance sheet. The cover assembly includes an inner cover configured to protect an inside, an outer cover configured to protect an outside, and a front cover configured to protect a front side. The front cover is thicker than the plate. The protection of the conductive resistance sheet and the improvement of the adiabatic effect may be obtained.

公开(公告)号：US20220290796A1

公开(公告)日：2022-09-15

申请号：US17831604

申请日：2022-06-03

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun YOUN

IPC: F16L59/065 ,  F25D23/06

Abstract: A vacuum adiabatic body includes a first plate, a second plate, a space between the first plate and the second plate configured to be a vacuum state, a support including at least a pair of support plates that maintain a distance between the first and second plates, and at least one radiation resistance sheet provided between the pair of support plates to reduce heat transfer between the first plate and the second plate.