Inspection method and inspection apparatus using charged particle beam
    51.
    发明授权
    Inspection method and inspection apparatus using charged particle beam 有权
    使用带电粒子束的检查方法和检查装置

    公开(公告)号:US07449690B2

    公开(公告)日:2008-11-11

    申请号:US11349974

    申请日:2006-02-09

    IPC分类号: G01N23/00 G21K7/00

    摘要: To establish a technique that enables sorting of the elevation and azimuth angle in the direction of emitting secondary electrons and obtaining images with emphasized contrast, in order to perform the review and analysis of shallow asperities and microscopic foreign particles in a wafer inspection during the manufacture of semiconductor devices, an electromagnetic overlapping objective lens is used to achieve high resolution, an electron beam is narrowly focused using the objective lens, an electric field for accelerating secondary electrons in the vicinity of a wafer in order to suppress the dependence on secondary electron energy of the rotation of secondary electrons generated by irradiation of the electron beam, a ring-shaped detector plate is disposed between an electron source and the objective lens, and the low angle components of the elevation angle of the secondary electrons, as viewed from the place of generation, and the high angle components are separated and also the azimuth components are separated and detected.

    摘要翻译: 为了建立能够在发射二次电子的方向上对高程和方位角进行排序并获得具有强调对比度的图像的技术,以便在制造期间对晶片检查中的浅凹凸和微观异物进行检查和分析 半导体器件使用电磁重叠物镜实现高分辨率,电子束使用物镜窄聚焦,用于加速晶片附近的二次电子的电场,以抑制对二次电子能量的依赖性 通过电子束的照射产生的二次电子的旋转,环状检测器板设置在电子源和物镜之间,并且从二次电子的位置观察二次电子的仰角的低角分量 并且高角度分量被分离,也是azimu 分离和检测。

    Defect detector and defect detecting method
    53.
    发明授权
    Defect detector and defect detecting method 有权
    缺陷检测器和缺陷检测方法

    公开(公告)号:US07417721B2

    公开(公告)日:2008-08-26

    申请号:US10536715

    申请日:2003-11-27

    IPC分类号: G01N21/00

    摘要: A defects inspecting apparatus having: a scanning stage for running into a predetermined direction while mounting an inspection target substrate thereon; an illumination optic system for irradiating an illumination light beam upon a surface of the inspection target substrate at a predetermined angle inclined thereto; a detection optic system including, an upper-directed photo-detector for receiving upper-directed reflected/scattered lights emitting upwards from the inspection target substrate, thereby converting them into an upper-directed image signal, and a side-directed photo-detector for receiving side-directed reflected/scattered lights emitting for the inspection target substrate into an inclined direction, so as to flatly intersects the illumination light beam, and thereby converting into a side-directed image signal; and a signal processing system-for detecting defects upon basis of the upper-directed image signal and the side-directed image signal.

    摘要翻译: 一种缺陷检查装置,具有:在其上安装检查对象基板的同时沿预定方向行进的扫描台; 照明光学系统,用于以与其倾斜的预定角度将照明光束照射在检查对象基板的表面上; 检测光学系统,包括:用于接收从检查对象基板向上发射的上方反射/散射光的上位光检测器,从而将其转换为高定向图像信号;以及侧向光检测器, 将检测对象基板发射的侧向反射/散射光倾斜到倾斜方向,以与照明光束平坦地相交,从而转换为侧向图像信号; 以及信号处理系统 - 用于基于上限图像信号和侧向图像信号来检测缺陷。

    METHOD AND APPARATUS FOR REVIEWING DEFECTS
    54.
    发明申请
    METHOD AND APPARATUS FOR REVIEWING DEFECTS 有权
    评估缺陷的方法和装置

    公开(公告)号:US20080073524A1

    公开(公告)日:2008-03-27

    申请号:US11668510

    申请日:2007-01-30

    IPC分类号: G01N23/00

    摘要: A method and an apparatus for reviewing defects detected by an optical particle inspection system or an optical profile inspection system in detail by an electron microscope are provided. In order to putting defects to be reviewed in the viewing field of the electron microscope and reducing the size of the apparatus, the electron microscope reviews defects detected by an optical defect inspection system. In the electron microscope, an optical microscope for reviewing detects is arranged, and when focusing of this optical microscope is carried out, the illumination position and the detection position of the optical microscope are not changed to the sample.

    摘要翻译: 提供了一种用于通过电子显微镜详细检查由光学粒子检查系统或光学轮廓检查系统检测到的缺陷的方法和装置。 为了在电子显微镜的观察区域中提供缺陷以及减小设备的尺寸,电子显微镜检查由光学缺陷检查系统检测到的缺陷。 在电子显微镜中,设置检查用光学显微镜,当进行该光学显微镜的聚焦时,光学显微镜的照明位置和检测位置不变为样品。

    Method and apparatus for inspecting particles or defects of a semiconductor device
    55.
    发明申请
    Method and apparatus for inspecting particles or defects of a semiconductor device 审中-公开
    用于检查半导体器件的颗粒或缺陷的方法和装置

    公开(公告)号:US20070257214A1

    公开(公告)日:2007-11-08

    申请号:US11827522

    申请日:2007-07-11

    IPC分类号: G01N21/88

    摘要: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

    摘要翻译: 通常,作为检测结果,粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策,分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷,所以需要巨大的时间来分析检测到的粒子/缺陷,从而导致制造过程中的失败的对策的延迟。 在本发明中,用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因,并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析,以统计学评价检测出的粒子。

    Inspection method and apparatus using charged particle beam
    56.
    发明授权
    Inspection method and apparatus using charged particle beam 有权
    使用带电粒子束的检查方法和装置

    公开(公告)号:US07276693B2

    公开(公告)日:2007-10-02

    申请号:US11375070

    申请日:2006-03-15

    CPC分类号: G01R31/311

    摘要: A scanning electron microscope or inspection system includes a sample stage on which a sample such as a wafer is loaded, an electro optical unit to scan an electron beam to the sample, and a charge control electrode to which voltage for controlling a charged state of the sample is applied. Further, there is provided an ultraviolet irradiation device for irradiating ultraviolet light onto the sample, a retarding electric source to apply a retarding voltage to the sample stage or the sample, and a detection unit for detecting secondary electrons or backscattering electrons generated in response to the scan of the electron beam. A monitoring unit for displaying an image of the sample or an inspection unit for inspection of the sample is provided which effects display or inspection based on signals from the detection unit.

    摘要翻译: 扫描电子显微镜或检查系统包括其上装载诸如晶片的样品的样品台,向样品扫描电子束的电光单元以及用于控制电极的充电状态的电压 样品被应用。 此外,提供了一种用于向样品照射紫外光的紫外线照射装置,向样品台或样品施加延迟电压的延迟电源,以及用于检测响应于该样品的样品产生的二次电子或反向散射电子的检测单元 扫描电子束。 提供了用于显示样本的图像的监视单元或用于检查样本的检查单元,其基于来自检测单元的信号进行显示或检查。

    Apparatus and method for inspecting defects
    58.
    发明申请
    Apparatus and method for inspecting defects 有权
    用于检查缺陷的装置和方法

    公开(公告)号:US20070153264A1

    公开(公告)日:2007-07-05

    申请号:US11714196

    申请日:2007-03-06

    IPC分类号: G01N21/88

    CPC分类号: G01N21/9501

    摘要: A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concavo-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

    摘要翻译: 一种缺陷检查装置,包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元,其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类,其中通过基于凹凸水平(b / a)改变所述缺陷尺寸的校正系数来估计缺陷尺寸, ,其中缺陷的凹凸级(b / a)由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比率指示,其中第二方向与第 第一个方向。

    Apparatus and method for inspecting defects
    60.
    发明授权
    Apparatus and method for inspecting defects 有权
    用于检查缺陷的装置和方法

    公开(公告)号:US07187438B2

    公开(公告)日:2007-03-06

    申请号:US10050776

    申请日:2002-01-18

    IPC分类号: G01N21/00

    CPC分类号: G01N21/9501

    摘要: The present invention is characterized by the following: incident illumination and oblique illumination are performed on a scratch and a foreign material, which have been made on a surface of a polished or a ground insulating layer, with substantially the same luminous flux; and on the basis of a correlation such as a ratio of intensity of scattered light generated by the shallow scratch and the foreign material between the incident illumination and the oblique illumination, the shallow scratch is discriminated from the foreign material.

    摘要翻译: 本发明的特征在于:在具有基本上相同的光通量的在抛光或接地绝缘层的表面上制成的划痕和异物进行入射照明和倾斜照明; 并且基于由浅划痕产生的散射光的强度与入射照明与倾斜照明之间的异物的比例的相关性,浅色划痕被鉴别为异物。