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公开(公告)号:US20200214173A1
公开(公告)日:2020-07-02
申请号:US16631323
申请日:2018-07-13
Applicant: NEC CORPORATION
Inventor: Masanori SATO , Koichi TODOROKI , Minoru YOSHIKAWA
Abstract: A phase-change cooling apparatus according to an exemplary aspect of the present invention includes heat receiving means; refrigerant liquid driving means for circulating the refrigerant liquid; a first refrigerant flow path in which the refrigerant liquid flowing away from the refrigerant liquid driving means circulates through the heat receiving means and the heat radiating means; a second refrigerant flow path of a flow path shortening the first refrigerant flow path in such a way that a branched refrigerant liquid being at least part of the refrigerant liquid flowing away from the refrigerant liquid driving means toward the heat receiving means circulates without passing through the heat receiving means and the heat radiating means; and control means for controlling a flow rate of a heat-receiving-side refrigerant liquid being a refrigerant liquid flowing into the heat receiving means based on a flow rate of the branched refrigerant liquid.
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公开(公告)号:US20190145667A1
公开(公告)日:2019-05-16
申请号:US16089994
申请日:2017-03-23
Applicant: NEC CORPORATION
Inventor: Arihiro MATSUNAGA , Minoru YOSHIKAWA , Hisato SAKUMA , Masato YANO , Asuka MATSUBA , Takafumi NATSUMEDA
Abstract: Since improving heat exchange between a gas-phase refrigerant and a liquid-phase refrigerant in a refrigeration system could instead result in a reduction in the efficiency of the whole refrigeration system, a heat exchange device (201) of the present invention includes: a refrigerant supply means (210) for supplying a first-temperature liquid-phase refrigerant (R11) and a second-temperature gas-phase refrigerant (R12) in one circulation system; a plurality of heat exchange means (220A, 220B) which are each configured so as to perform heat exchange between the liquid-phase refrigerant and the gas-phase refrigerant; and refrigerant circulation means (231, 232, 242) for circulating the gas-phase refrigerant (R12) in such a manner that the gas-phase refrigerant (R12) flows in parallel in the plurality of heat exchange means, and circulating the liquid-phase refrigerant (R11) in such a manner that the liquid-phase refrigerant (R11) flows in series in the plurality of heat exchange means.
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公开(公告)号:US20180073764A1
公开(公告)日:2018-03-15
申请号:US15561633
申请日:2016-03-30
Applicant: NEC Corporation , NEC Facilities, Ltd.
Inventor: Minoru YOSHIKAWA , Kazuo WATANABE , Masanori SATO , Arihiro MATSUNAGA
IPC: F24F11/053 , F28D15/06 , F24F3/044 , G06F1/20 , H05K7/20
CPC classification number: F24F11/76 , F24F3/044 , F24F5/0021 , F24F11/77 , F28D15/06 , G06F1/20 , H05K7/20145 , H05K7/20745 , H05K7/20827 , H05K7/20836 , Y02E60/147
Abstract: A cooling system employing a phase-change cooling apparatus together with an air conditioner becomes complex and increases in cost if it is configured to maximize the efficiency of the entire cooling system; therefore, a phase-change cooling apparatus according to an exemplary aspect of the present invention includes a heat receiving means for vaporizing refrigerant liquid stored and producing refrigerant vapor by receiving heat exhausted from a heating section having breathed in cold air; a heat radiation means for liquefying the refrigerant vapor and producing refrigerant liquid by radiating heat of the refrigerant vapor to cooling air by a fan; a vapor tube connecting the heat receiving means to the heat radiation means, the refrigerant vapor mainly flowing through the vapor tube; a liquid tube connecting the heat receiving means to the heat radiation means, the refrigerant liquid mainly flowing through the liquid tube; and a control means for controlling a rotation rate of the fan, wherein the control means controls the rotation rate of the fan so that a vapor temperature that is a temperature of the refrigerant vapor may approach an intake-air temperature that is a temperature of the cold air.
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公开(公告)号:US20160014928A1
公开(公告)日:2016-01-14
申请号:US14768917
申请日:2014-02-19
Applicant: NEC CORPORATION
Inventor: Hitoshi SAKAMOTO , Minoru YOSHIKAWA , Akira SHOUJIGUCHI , Masaki CHIBA , Kenichi INABA , Arihiro MATSUNAGA
IPC: H05K7/20
CPC classification number: H05K7/20145 , G06F1/20 , H05K7/20154 , H05K7/202 , H05K7/205
Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.
Abstract translation: 电子板200具有安装在其上的发热部件220。 外壳300容纳电子板200.热传输单元400耦合到外壳300,并将由发热部件220产生的热量输送到外部。 在热传输单元400,400A中设置有热量接收单元510。 受热单元510接收由发热组件220产生的热量。散热单元530以散热单元530的一部分暴露于外部空气的方式设置在热传输单元400中,并且耦合 散热单元530将由热接收单元510接收的热量散发到外部。 导管单元340形成为将发热部件220和热接收单元510互连的管,以便将发热部件220的热量释放到热接收单元510.这使得电子板上的发热部件 以小而简单的结构被有效地冷却。
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