公开(公告)号：US11264286B2

公开(公告)日：2022-03-01

申请号：US16445778

申请日：2019-06-19

Applicant: STMicroelectronics, Inc.

Inventor： Nicolas Loubet ,  Pierre Morin ,  Yann Mignot

IPC: H01L29/78 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/165 ,  H01L21/02 ,  H01L21/762 ,  H01L29/49 ,  H01L29/06 ,  H01L29/417

Abstract: Integrated circuits are disclosed in which the strain properties of adjacent pFETs and nFETs are independently adjustable. The pFETs include compressive-strained SiGe on a silicon substrate, while the nFETs include tensile-strained silicon on a strain-relaxed SiGe substrate. Adjacent n-type and p-type FinFETs are separated by electrically insulating regions formed by a damascene process. During formation of the insulating regions, the SiGe substrate supporting the n-type devices is permitted to relax elastically, thereby limiting defect formation in the crystal lattice of the SiGe substrate.

公开(公告)号：US10600786B2

公开(公告)日：2020-03-24

申请号：US15452049

申请日：2017-03-07

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ,  STMICROELECTRONICS Inc

Inventor： Sylvain Maitrejean ,  Emmanuel Augendre ,  Pierre Morin ,  Shay Reboh

IPC: H01L27/092 ,  H01L21/02 ,  H01L21/266 ,  H01L21/268 ,  H01L21/8238 ,  H01L29/10 ,  H01L29/66

Abstract: Manufacture of a transistor device with at least one P type transistor with channel structure strained in uniaxial compression strain starting from a silicon layer strained in biaxial tension, by amorphization recrystallization then germanium condensation.

公开(公告)号：US20190189802A1

公开(公告)日：2019-06-20

申请号：US16212632

申请日：2018-12-06

Applicant: STMICROELECTRONICS, INC.

Inventor： Pierre Morin ,  Nicolas Loubet

IPC: H01L29/78 ,  H01L29/165 ,  H01L29/66 ,  H01L27/088

CPC classification number: H01L29/7848 ,  H01L27/0886 ,  H01L29/165 ,  H01L29/66795 ,  H01L29/785

Abstract: A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, and source and drain regions adjacent the channel region to generate shear and normal strain on the channel region. A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, source and drain regions adjacent the channel region, and a gate over the channel region. The fin may be canted with respect to the source and drain regions to generate shear and normal strain on the channel region.

公开(公告)号：US10204982B2

公开(公告)日：2019-02-12

申请号：US14048232

申请日：2013-10-08

Applicant: STMicroelectronics, Inc.

Inventor： Pierre Morin ,  Qing Liu ,  Nicolas Loubet

IPC: H01L29/06 ,  H01L21/84 ,  H01L27/12 ,  H01L29/78 ,  H01L21/8238

Abstract: A method for forming a semiconductor device includes forming a mask layer on a stressed semiconductor layer of a stressed, semiconductor-on-insulator wafer. An isolation trench bounding the stressed semiconductor layer is formed. The isolation trench extends through the mask layer and into the SOI wafer past an oxide layer thereof. A dielectric body is formed in the isolation trench. A relaxation reduction liner is formed on the dielectric body and on an adjacent sidewall of the stressed semiconductor layer. The mask layer on the stressed semiconductor layer is removed.

公开(公告)号：US10177255B2

公开(公告)日：2019-01-08

申请号：US15723152

申请日：2017-10-02

Applicant: STMICROELECTRONICS, INC.

Inventor： Pierre Morin ,  Nicolas Loubet

IPC: H01L29/00 ,  H01L29/78 ,  H01L29/66 ,  H01L29/165 ,  H01L27/088

Abstract: A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, and source and drain regions adjacent the channel region to generate shear and normal strain on the channel region. A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, source and drain regions adjacent the channel region, and a gate over the channel region. The fin may be canted with respect to the source and drain regions to generate shear and normal strain on the channel region.

公开(公告)号：US20180331106A1

公开(公告)日：2018-11-15

申请号：US16035441

申请日：2018-07-13

Applicant: STMICROELECTRONICS, INC.

Inventor： Pierre Morin ,  Nicolas Loubet

IPC: H01L27/092 ,  H01L29/66 ,  H01L29/10 ,  H01L29/16 ,  H01L29/78 ,  H01L29/165

CPC classification number: H01L27/0924 ,  H01L29/1054 ,  H01L29/16 ,  H01L29/1608 ,  H01L29/165 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/7843 ,  H01L29/7848 ,  H01L29/7849 ,  H01L29/785

Abstract: Methods and structures for forming strained-channel finFETs are described. Fin structures for finFETs may be formed using two epitaxial layers of different lattice constants that are grown over a bulk substrate. A first thin, strained, epitaxial layer may be cut to form strain-relieved base structures for fins. The base structures may be constrained in a strained-relieved state. Fin structures may be epitaxially grown in a second layer over the base structures. The constrained base structures can cause higher amounts of strain to form in the epitaxially-grown fins than would occur for non-constrained base structures.

公开(公告)号：US10043805B2

公开(公告)日：2018-08-07

申请号：US15197509

申请日：2016-06-29

Applicant: STMICROELECTRONICS, INC.

Inventor： Pierre Morin ,  Nicolas Loubet

IPC: H01L27/092 ,  H01L29/78 ,  H01L29/16 ,  H01L29/66 ,  H01L29/10 ,  H01L29/165

Abstract: Methods and structures for forming strained-channel finFETs are described. Fin structures for finFETs may be formed using two epitaxial layers of different lattice constants that are grown over a bulk substrate. A first thin, strained, epitaxial layer may be cut to form strain-relieved base structures for fins. The base structures may be constrained in a strained-relieved state. Fin structures may be epitaxially grown in a second layer over the base structures. The constrained base structures can cause higher amounts of strain to form in the epitaxially-grown fins than would occur for non-constrained base structures.

公开(公告)号：US10032912B2

公开(公告)日：2018-07-24

申请号：US14588221

申请日：2014-12-31

Applicant: STMICROELECTRONICS, INC. ,  GLOBALFOUNDRIES INC. ,  INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Pierre Morin ,  Kangguo Cheng ,  Jody Fronheiser ,  Xiuyu Cai ,  Juntao Li ,  Shogo Mochizuki ,  Ruilong Xie ,  Hong He ,  Nicolas Loubet

IPC: H01L29/78 ,  H01L29/16 ,  H01L29/06 ,  H01L29/66 ,  H01L21/8238 ,  H01L27/092

Abstract: A modified silicon substrate having a substantially defect-free strain relaxed buffer layer of SiGe is suitable for use as a foundation on which to construct a high performance CMOS FinFET device. The substantially defect-free SiGe strain-relaxed buffer layer can be formed by making cuts in, or segmenting, a strained epitaxial film, causing edges of the film segments to experience an elastic strain relaxation. When the segments are small enough, the overall film is relaxed so that the film is substantially without dislocation defects. Once the substantially defect-free strain-relaxed buffer layer is formed, strained channel layers can be grown epitaxially from the relaxed SRB layer. The strained channel layers are then patterned to create fins for a FinFET device. In one embodiment, dual strained channel layers are formed—a tensilely strained layer for NFET devices, and a compressively strained layer for PFET devices.

公开(公告)号：US09905478B2

公开(公告)日：2018-02-27

申请号：US15469851

申请日：2017-03-27

Applicant: STMicroelectronics, Inc.

Inventor： Nicolas Loubet ,  Pierre Morin ,  Yann Mignot

IPC: H01L21/8238 ,  H01L29/78 ,  H01L29/417

CPC classification number: H01L21/823821 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/76224 ,  H01L21/823807 ,  H01L21/823878 ,  H01L27/0922 ,  H01L27/0924 ,  H01L29/0649 ,  H01L29/165 ,  H01L29/41791 ,  H01L29/4916 ,  H01L29/7842 ,  H01L29/785

Abstract: Integrated circuits are disclosed in which the strain properties of adjacent pFETs and nFETs are independently adjustable. The pFETs include compressive-strained SiGe on a silicon substrate, while the nFETs include tensile-strained silicon on a strain-relaxed SiGe substrate. Adjacent n-type and p-type FinFETs are separated by electrically insulating regions formed by a damascene process. During formation of the insulating regions, the SiGe substrate supporting the n-type devices is permitted to relax elastically, thereby limiting defect formation in the crystal lattice of the SiGe substrate.

公开(公告)号：US09768299B2

公开(公告)日：2017-09-19

申请号：US14977077

申请日：2015-12-21

Applicant: STMicroelectronics, Inc.

Inventor： Pierre Morin

IPC: H01L29/78 ,  H01L29/66 ,  H01L27/12 ,  H01L21/8238 ,  H01L21/84 ,  H01L27/092 ,  H01L29/06 ,  H01L29/16 ,  H01L29/161 ,  H01L29/165 ,  H01L29/786

CPC classification number: H01L29/7848 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823878 ,  H01L21/84 ,  H01L21/845 ,  H01L27/0924 ,  H01L27/1203 ,  H01L27/1211 ,  H01L29/0653 ,  H01L29/1608 ,  H01L29/161 ,  H01L29/165 ,  H01L29/66772 ,  H01L29/66795 ,  H01L29/7842 ,  H01L29/7846 ,  H01L29/7849 ,  H01L29/785 ,  H01L29/78654

Abstract: Methods and structures for forming strained-channel FETs are described. A strain-inducing layer may be formed under stress in a silicon-on-insulator substrate below the insulator. Stress-relief cuts may be formed in the strain-inducing layer to relieve stress in the strain-inducing layer. The relief of stress can impart strain to an adjacent semiconductor layer. Strained-channel, fully-depleted SOI FETs and strained-channel finFETs may be formed from the adjacent semiconductor layer. The amount and type of strain may be controlled by etch depths and geometries of the stress-relief cuts and choice of materials for the strain-inducing layer.