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    Coil component
    51.
    发明授权
    Coil component 有权

    公开(公告)号：US11610725B2

    公开(公告)日：2023-03-21

    申请号：US16527931

    申请日：2019-07-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim ,  Byeong Cheol Moon

    IPC: H01F27/30 ,  H01F27/28 ,  H01F27/02 ,  H01F27/26

    Abstract: A coil component includes a mold portion having a first surface and the second surface opposing each other, a winding coil disposed in the second surface of the mold portion, a cover portion disposed on the mold portion and the winding coil, and accommodating grooves on the first surface of the mold portion to be spaced apart from each other, and in which both ends of the winding coil are disposed, the accommodating grooves extend from one side of the mold portion in a width direction, and a minimum distance from the accommodating grooves to the second surface of the mold portion increases or decreased in the width direction.

    Coil component
    52.
    发明授权
    Coil component 有权

    公开(公告)号：US11270829B2

    公开(公告)日：2022-03-08

    申请号：US16664062

    申请日：2019-10-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong Sam Lee ,  Eo Jin Choi ,  Jae Hun Kim ,  Ji Hyun Eom ,  Hye Yeon Cha

    IPC: H01F27/32 ,  H01F27/02 ,  H01F27/29 ,  H01F17/00 ,  H01F27/24 ,  H01F17/04

    Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.

    COIL COMPONENT
    53.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20220013271A1

    公开(公告)日：2022-01-13

    申请号：US16952505

    申请日：2020-11-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim ,  Byeong Cheol Moon

    IPC: H01F27/00 ,  H01F27/29 ,  H01F17/04

    Abstract: A coil component includes a body having one end and the other end opposing each other, a support substrate disposed inside the body, a coil portion, disposed on at least one surface of the support substrate, in which an end portion of an outermost turn is disposed closer to the one surface of the body than to the other surface of the body, a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body, and an anchor portion connected to the lead-out portions and including a via pad disposed between the lead-out portion and the coil portion inside the body.

    Coil component
    54.
    发明授权
    Coil component 有权

    公开(公告)号：US11217381B2

    公开(公告)日：2022-01-04

    申请号：US16178003

    申请日：2018-11-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong Hui Li ,  Byung Soo Kang ,  Jae Hun Kim

    IPC: H01F27/28 ,  H01F27/32 ,  H01F27/30 ,  H01F27/29 ,  H01F27/22

    Abstract: A coil component includes: a body including a support member including a through-hole and a via hole spaced apart from the through-hole, an internal coil supported by the support member and including a plurality of conductive units wound in one direction, and an encapsulant encapsulating the support member and the internal coil and filling the through-hole; and an external electrode disposed on an external surface of the body and connected to the internal coil.

    TOUCH MODULE
    59.
    发明申请
    TOUCH MODULE 审中-公开
    触控模块

    公开(公告)号：US20130162561A1

    公开(公告)日：2013-06-27

    申请号：US13710179

    申请日：2012-12-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim ,  Seul Gi Kim ,  Sang Su Hong ,  Jin Uk Lee

    IPC: G06F3/041

    CPC classification number: G06F3/041 ,  G06F3/04883

    Abstract: Disclosed herein is a touch module including: a touch electrode formed on one surface or both surfaces of a transparent substrate; a connection part coupled to the touch electrode; and a coating layer coating the touch electrode and the connection part.

    Abstract translation: 这里公开了一种触摸模块，包括：形成在透明基板的一个表面或两个表面上的触摸电极; 耦合到所述触摸电极的连接部分; 以及涂覆有触摸电极和连接部的涂层。

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