利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

235 条记录 (耗时 0.018 秒)

    Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package
    7.
    发明授权
    Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package 有权
    建立基板，制造方法及半导体集成电路封装

    公开(公告)号：US09236338B2

    公开(公告)日：2016-01-12

    申请号：US14122323

    申请日：2012-10-29

    申请人： Panasonic Corporation

    发明人： Seiichi Nakatani ,  Koji Kawakita ,  Susumu Sawada ,  Yoshihisa Yamashita

    IPC分类号： H01L21/48 ,  H05K1/03 ,  H01L23/498 ,  H05K3/46 ,  H01L23/15 ,  H01L23/373

    CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/4673 ,  H05K3/4682 ,  H05K2201/017 ,  H05K2201/0175 ,  H05K2203/0126 ,  H05K2203/0514 ,  H05K2203/1366

    摘要： A method for manufacturing a build-up substrate, the build-up substrate comprising an insulating layer and a wiring pattern layer stacked over a circuit substrate, said method comprising the steps of: (i) applying a photoactive metal oxide precursor material to one or both sides of the circuit substrate with a wiring pattern, and drying the applied photoactive metal oxide precursor material to form an insulating film; (ii) forming an opening for a via hole in the insulating film by exposure and development of the insulating film; (iii) applying a heat treatment to the insulating film to convert the insulating film into a metal oxide film, thereby forming a build-up insulating layer of the metal oxide film; and (iv) plating the build-up insulating layer to form via holes in the openings, forming a metal layer on the build-up insulating layer, and etching the metal layer to form a build-up wiring pattern; and (v) repeating the steps from (i) to (iv) at least one time.

    摘要翻译： 一种用于制造积聚基板的方法，所述堆积基板包括层叠在电路基板上的绝缘层和布线图案层，所述方法包括以下步骤：（i）将光活性金属氧化物前体材料施加到一个或 电路基板的两侧具有布线图案，并干燥所施加的光活性金属氧化物前体材料以形成绝缘膜; （ii）通过曝光和显影绝缘膜形成绝缘膜中的通孔的开口; （iii）对绝缘膜进行热处理以将绝缘膜转换为金属氧化物膜，由此形成金属氧化物膜的堆积绝缘层; 和（iv）电镀积层绝缘层以在开口中形成通孔，在积层绝缘层上形成金属层，并蚀刻金属层以形成积聚布线图案; 和（v）至少一次重复（i）至（iv）的步骤。

    TOUCH PANEL
    8.
    发明申请
    TOUCH PANEL 审中-公开
    触控面板

    公开(公告)号：US20140000944A1

    公开(公告)日：2014-01-02

    申请号：US13929625

    申请日：2013-06-27

    申请人： PANASONIC CORPORATION

    发明人： Koji TANABE ,  Keishiro MURATA

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0274 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  H05K1/0289 ,  H05K1/095 ,  H05K3/02 ,  H05K3/4685 ,  H05K2201/0108 ,  H05K2203/0514

    摘要： The touch panel includes a light transmissive substrate, a first light transmissive conductive layer, and a second light transmissive conductive layer. The first conductive layer is provided on an upper surface of the substrate, and extending in a roughly band-shaped form in a first direction. The second conductive layer is provided on the upper surface of the substrate, insulated from the first conductive layer, and extending in a roughly band-shaped form in a second direction perpendicular to the first direction. The first conductive layers and the second conductive layers are plurally provided. The second conductive layer includes conductive parts provided on the upper surface of the substrate, and a connecting part provided for connecting the conductive parts in the second direction, and provided above the first conductive layer, and material of the connecting part is resin containing dispersed conductive fine wires.

    摘要翻译： 触摸面板包括透光基板，第一透光导电层和第二透光导电层。 第一导电层设置在基板的上表面上，并沿第一方向以大致带状的形式延伸。 第二导电层设置在基板的上表面上，与第一导电层绝缘，并且在垂直于第一方向的第二方向上以大致带状的形式延伸。 第一导电层和第二导电层多个设置。 第二导电层包括设置在基板的上表面上的导电部分和设置用于在第二方向上连接导电部分并且设置在第一导电层上方的连接部分，并且连接部分的材料是包含分散导电 细线