Abstract:
A head transducer includes a thermal sensor comprising a conducting ceramic material having a temperature coefficient of resistance. The thermal sensor can comprise a transparent conducting oxide having a temperature coefficient of resistance. The thermal sensor can be situated proximate a near-field transducer of the heat-assisted magnetic recording head transducer.
Abstract:
Apparatuses, systems, and methods are disclosed related to heat assisted magnetic recording. According to one embodiment, an apparatus that includes a heat sink region and a near field transducer region is disclosed. The near field transducer region is thermally coupled to the heat sink region. At least one of the heat sink region and the near field transducer region includes both an inner core and an outer shell. The inner core can be comprised of a non-plasmonic material and the outer shell can be comprised of a plasmonic material. In further embodiments, the inner core is comprised of a material having a relatively higher electron-phonon coupling constant and the outer shell is comprised of a material having a relatively lower electron-phonon coupling constant.
Abstract:
Example embodiments include an apparatus that has a piezoelectric contact sensor. The piezoelectric contact sensor includes a semiconductor device having a semiconductor material that defines a channel through which current can flow. The piezoelectric contact sensor also includes a piezoelectric element coupled to the semiconductor material. The semiconductor material is configured to modulate the current channel in response to compressive stress waves at the contact sensor. Other example embodiments include an apparatus that has a slider having an air-bearing surface, a write head integral to the slider, and a piezoelectric contact sensor that includes a semiconductor device and a piezoelectric element.
Abstract:
Embodiments are directed to an apparatus having an air-bearing surface that is configured to interact with magnetic medium. The apparatus includes a waveguide and a plasmonic near-field transducer positioned at or near the air-bearing surface. The plasmonic near-field transducer is operatively coupled to the waveguide. The plasmonic near-field transducer includes an enlarged region and a peg region. The peg region extends from the enlarged region towards the air-bearing surface. The peg region has at least a portion of a periphery of its cross-sectional shape include curvature or at least one substantially obtuse angle.
Abstract:
A tool for use in fabricating an electronic component includes a plurality of processing modules and a transfer chamber in communication with each of the plurality of processing modules. The transfer chamber includes a component for transferring a structure to each of the plurality of processing modules. The plurality of processing modules and the transfer chamber are sealed from the surrounding environment and are under a vacuum. The plurality of processing modules includes a first module configured to perform a first process on the structure and a second module configured to perform a second process on the structure. The first process includes performing at least one shaping operation on the structure.
Abstract:
An apparatus including a near field transducer positioned adjacent to an air bearing surface, the near field transducer comprising silver (Ag) and at least one other element or compound; a first magnetic pole; and a heat sink positioned between the first magnetic pole and the near field transducer, wherein the heat sink includes: rhodium (Rh) or an alloy thereof; ruthenium (Ru) or an alloy thereof; titanium (Ti) or an alloy thereof; tantalum (Ta) or an alloy thereof; tungsten (W) or an alloy thereof; borides; nitrides; transition metal oxides; or palladium (Pd) or an alloy thereof.
Abstract:
Apparatuses, systems, and methods are disclosed related to heat assisted magnetic recording. According to one embodiment, an apparatus that includes a heat sink region and a near field transducer region is disclosed. The near field transducer region is thermally coupled to the heat sink region. At least one of the heat sink region and the near field transducer region includes both an inner core and an outer shell. The inner core can be comprised of a non-plasmonic material and the outer shell can be comprised of a plasmonic material. In further embodiments, the inner core is comprised of a material having a relatively higher electron-phonon coupling constant and the outer shell is comprised of a material having a relatively lower electron-phonon coupling constant.
Abstract:
A magnetic write head is disclosed that includes a slider that includes a laser diode having a light-emitting edge or surface of a laser diode and an optical waveguide. The disclosed magnetic write head also includes a dielectric layer disposed in a gap between the laser diode and an input to the optical waveguide. The dielectric layer fills the gap completely and provides a low-loss optical pathway for the laser diode to the input of the optical waveguide. Also disclosed is a method that includes spinning on a dielectric in a gap between the light-emitting surface and the optical waveguide coupler, wherein after the spinning on, the laser diode is optically coupled to the optical waveguide coupler through the dielectric.
Abstract:
A waveguide including a first cladding layer, the first cladding layer having an index of refraction, n3; an assist layer, the assist layer having an index of refraction, n2, and the assist layer including ASixOy, wherein A is selected from: Ta, Ti, Nb, Hf, Zr, and Y, x is from about 0.5 to about 2.0, y is from about 3.5 to about 6.5, and the atomic ratio of A/A+Si in ASixOy is from about 0.2 to about 0.7; and a core layer, the core layer including a material having an index of refraction, n1, wherein n1 is greater than n2 and n3, and n2 is greater than n3.
Abstract translation:包括第一包层的波导,所述第一包层具有折射率n3; 辅助层,辅助层具有折射率n2,辅助层包括ASixOy,其中A选自:Ta,Ti,Nb,Hf,Zr和Y,x为约0.5至约2.0, y为约3.5至约6.5,并且ASixOy中的A / A + Si的原子比为约0.2至约0.7; 芯层,芯层包括具有折射率n1的材料,其中n1大于n2和n3,n2大于n3。
Abstract:
A system for poling piezoelectric devices comprises a plurality of thin-film components, a plurality of piezoelectric devices, a poling pad for poling the piezoelectric devices, a plurality of traces, and a plurality of current-limiting elements. The thin-film components are separated by dice lanes to form an array, and the piezoelectric devices are formed on the thin-film components. The traces connect the piezoelectric devices across the dice lanes in parallel to the poling pad. Each current-limiting element is connected in series with one of the piezoelectric devices, in order to limit current to individual piezoelectric devices that experience current-related failure.