公开(公告)号：US08013057B2

公开(公告)日：2011-09-06

申请号：US12405589

申请日：2009-03-17

申请人： Yusuke Taguchi ,  Kazutoshi Tomiyoshi

发明人： Yusuke Taguchi ,  Kazutoshi Tomiyoshi

IPC分类号： C08L83/04 ,  B29D11/00

CPC分类号： C08L83/06 ,  C08G77/26 ,  C08G77/28 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R3dSi(OR2)e wherein R3 represents an organic group containing a mercapto group, a glycidyl group, or an amino group, R2 represents a C1-4 organic group, d represents 1 or 2, and e represents 2 or 3; wherein content of the white pigment (B) is 1 to 50% by weight in the entire composition, and total content of the white pigment (B) and the inorganic filler (C) is 70 to 93% by weight in the entire composition. When cured, it has excellent whiteness, consistency, and resistance to heat, light, yellowing, and warping.

摘要翻译： 提供了一种用于模制光学半导体壳体的白色热固性硅树脂组合物和诸如LED的光学半导体的壳体。 组合物包含（A）热固性有机聚硅氧烷，（B）白色颜料，（C）无机填料（不包括白色颜料），（D）缩合催化剂和（E）由下式表示的偶联剂： R3dSi（OR2）e其中R3表示含有巯基，缩水甘油基或氨基的有机基团，R2表示C1-4有机基团，d表示1或2，e表示2或3; 其中白色颜料（B）的含量在整个组合物中为1〜50重量％，白色颜料（B）和无机填料（C）的总含量在整个组合物中为70〜93重量％。 固化时，具有优异的白度，一致性和耐热，耐光，发黄，翘曲等特点。

公开(公告)号：US20100148380A1

公开(公告)日：2010-06-17

申请号：US12637359

申请日：2009-12-14

申请人： Masaki Hayashi ,  Yusuke Taguchi ,  Kazutoshi Tomiyoshi ,  Tomoyoshi Tada

发明人： Masaki Hayashi ,  Yusuke Taguchi ,  Kazutoshi Tomiyoshi ,  Tomoyoshi Tada

IPC分类号： H01L23/29 ,  C08L63/00

CPC分类号： C08G59/3245 ,  C08G59/186 ,  C08G59/42 ,  C08L63/00 ,  C08L63/06 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3135 ,  H01L24/73 ,  H01L24/97 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: R11—COO—R12  (1) wherein R11 and R12 are CnH2n+1 and n is 1 to 30 and a compound represented by: wherein R1, R2, and R3 are selected from H, —OH, —OR, and —OCOCaHb with the proviso that at least one includes —OCOCaHb; R is CnH2n+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.

摘要翻译： 一种热固性环氧树脂组合物，其包含（A）三嗪衍生物环氧树脂和酸酐的反应混合物，其中环氧基当量相对于酸酐当量为0.6-2.0; （B）内部脱模剂; （C）反射材料; （D）无机填料; 和（E）固化催化剂。 组分（B）的内部脱模剂包含由以下化合物表示的羧酸酯：R11-COO-R12（1）其中R11和R12为CnH2n + 1且n为1至30，以及由下式表示的化合物：其中R1，R2， 并且R 3选自H，-OH，-OR和-OCOCaHb，条件是至少一个包括-OCOCaHb; R为C n H 2n + 1（n为1〜30的整数），a为10〜30，b为17〜61。

公开(公告)号：US20090171013A1

公开(公告)日：2009-07-02

申请号：US12344048

申请日：2008-12-24

申请人： Yusuke TAGUCHI ,  Kazutoshi Tomiyoshi ,  Tomoyoshi Tada ,  Hisashi Shimizu

发明人： Yusuke TAGUCHI ,  Kazutoshi Tomiyoshi ,  Tomoyoshi Tada ,  Hisashi Shimizu

IPC分类号： C08L83/06 ,  B29D11/00

CPC分类号： C08L83/04 ,  C08G77/16 ,  C08G77/18 ,  C08K3/011 ,  C08K3/10 ,  C08K3/22 ,  C08K5/0025 ,  C08K5/56 ,  C08K2003/2241 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.

摘要翻译： 一种有机硅树脂组合物，其包含（A）熔点为40-130℃的可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）固化催化剂的转移或压缩 在高温下成型为具有白色，耐热性，耐光性和最小黄化的固化产物。 固化产品适用于封装有光电子部件的情况。