Abstract:
A solid-state imaging device including a first transfer electrode portion and a second transfer electrode portion having a pattern area ratio higher than that of the first transfer electrode portion. The first transfer electrode portion includes a plurality of first transfer electrodes having a single-layer structure of metal material. The second transfer electrode portion includes a plurality of second transfer electrodes having a single-layer structure of polycrystalline silicon or amorphous silicon.
Abstract:
There is provided a four-cycle engine which can appropriately circulate oil in an engine regardless of a tilted condition with a simple structure. A crankcase (4) of a four-cycle engine (1) has a crank room (41) which rotatably supports a crankshaft (10) and an oil room (42) which is provided adjacent to the exterior of the crank room (41). The crankcase (4) also has partition walls (43) and (44) which partition the interior of the crankcase (4) into the crank room (41) and the oil room (42), respectively, and a communication path (45) which communicates the crank room (41) with the oil room (42). The partition walls (43) and (44) each has a cross section formed in a substantially V shape, and the communication path (45) is formed at an apex between the partition walls (43) and (44).
Abstract:
A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.
Abstract:
A solid-state imaging apparatus includes a plurality of photoelectric conversion units configured to generate signal charge from light received at light-receiving surfaces thereof, the plurality of photoelectric conversion units being provided in the image-sensing area of a substrate; a charge reading unit configured to read signal charge generated by the photoelectric conversion units, a charge readout channel area thereof being provided in the image-sensing area of the substrate; a transfer register unit configured to transfer signal charge read from the plurality of photoelectric conversion units by the charge reading unit, a charge transfer channel area thereof being provided in the image-sensing area of the substrate; and a light-shielding unit that is provided in the image-sensing area of the substrate and that has an opening through which light is transmitted formed in an area corresponding to a light-receiving surface of a respective photoelectric conversion unit.
Abstract:
The present invention provides a semiconductor device comprising a metal interconnect having considerably improved electromigration resistance and/or stress migration resistance. The copper interconnect 107 comprises a silicon-lower concentration region 104 and a silicon solid solution layer 106 disposed thereon. The silicon solid solution layer 106 has a structure, in which silicon atoms are introduced within the crystal lattice structure that constitutes the copper interconnect 107 to be disposed within the lattice as inter-lattice point atoms or substituted atoms. The silicon solid solution layer 106 has the structure, in which the crystal lattice structure of copper (face centered cubic lattice; lattice constant is 3.6 angstrom) remains, while silicon atoms are introduced as inter-lattice point atoms or substituted atoms.
Abstract:
An economical and highly reliable infrared sensor with a wide field of view and a method for economically manufacturing a highly reliable infrared sensor with a wide field of view includes a package having supporting portions that support an optical filter at a location below the upper surfaces of sidewalls of the package and recessed portions that communicate with gaps between side surfaces of the optical filter supported by the supporting portions and the sidewalls of the package. An adhesive is supplied to the recessed portions while the optical filter is supported by the supporting portions such that the adhesive flows into the gaps between the optical filter and the sidewalls of the package by capillary action and such that the optical filter is fixed to an opening of the package via the adhesive. The optical filter is fixed to the package via the adhesive by applying the adhesive such that the adhesive spreads over substantially the entire circumference of the optical filter.
Abstract:
An average face composition is produced by computer graphic methods surveying average facial features, skin color, lip color and eye color among plural faces representing different human races. Enquiries are performed among a plurality of different people to receive their replies to questions on the obtained faces on which various cosmetics were furnished. The collected comments were analyzed to prepare color maps, whereby necessary information and images were established to enable selection of suitable cosmetics.
Abstract:
An electronic component package that provides a high shielding performance and that can prevent failures such as short-circuiting with a component contained therein. A package includes a shield case formed of a metal plate and shaped to have a bottom portion, the bottom portion having a through hole; a resin case molded on inner and outer surfaces of the shield case and shaped to have a bottom portion; and a hot terminal that is insert-molded in the resin case such that the hot terminal is inserted into the shield case through the through hole without contact. One end of the hot terminal is exposed at an inner surface of the resin case, and the other end of the hot terminal is exposed at an outer surface of the resin case. An element contained in the package is surrounded by the shield case so that good shielding performance is obtained.
Abstract:
A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.
Abstract:
A battery charger for charging a battery pack having a battery, a temperature sensor for sensing a temperature of the battery, and a battery terminal. The battery charger includes a charger terminal to which the battery terminal is connected when the battery is charged, a charge current generating circuit that generates a charge current for charging the battery, a battery temperature detector, and a controller. The battery temperature detector is configured to include a circuit, for example, to detect a temperature of the battery while cooperating with the temperature sensor and to output a temperature signal indicative of the temperature of the battery. The controller which is supplied with the temperature signal from the battery temperature detector, corrects the temperature signal, and provides a corrected temperature signal.