公开(公告)号：US20120304485A1

公开(公告)日：2012-12-06

申请号：US13482318

申请日：2012-05-29

申请人： Hidekazu Hayashi ,  Yohei Sato ,  Hisashi Okuchi ,  Hiroshi Tomita ,  Kazuyuki Mitsuoka ,  Mitsuaki Iwashita ,  Takehiko Orii ,  Gen You ,  Hiroki Ohno ,  Takayuki Toshima

发明人： Hidekazu Hayashi ,  Yohei Sato ,  Hisashi Okuchi ,  Hiroshi Tomita ,  Kazuyuki Mitsuoka ,  Mitsuaki Iwashita ,  Takehiko Orii ,  Gen You ,  Hiroki Ohno ,  Takayuki Toshima

IPC分类号： F26B7/00

CPC分类号： H01L21/67028 ,  B08B7/0021 ,  H01L21/02057 ,  H01L21/02101

摘要： A substrate processing method and apparatus which can remove an anti-drying liquid, which has entered a three-dimensional pattern with recessed portions formed in a substrate, in a relatively short time. The substrate processing method includes the steps of: carrying a substrate, having a three-dimensional pattern formed in a surface, into a processing container, said pattern being covered with an anti-drying liquid that has entered the recessed portions of the pattern; heating the substrate and supplying a pressurizing gas or a fluid in a high-pressure state into the processing container, thereby forming a high-pressure atmosphere in the processing container before the anti-drying liquid vaporizes to such an extent as to cause pattern collapse and bringing the anti-drying liquid into a high-pressure state while keeping the liquid in the recessed portions of the pattern; and thereafter discharging a fluid in a high-pressure state or a gaseous state from the processing container.

摘要翻译： 一种基板处理方法和装置，其能够在相当短的时间内去除已经进入具有形成在基板中的凹部的三维图案的抗干燥液体。 基板处理方法包括以下步骤：将具有形成在表面上的三维图案的基板运送到处理容器中，所述图案被已经进入图案的凹部的防干燥液体覆盖; 加热基板并将高压状态的加压气体或流体供给到处理容器中，从而在防干燥液体蒸发之前在处理容器中形成高压气氛，使其形成图案塌陷， 将防干燥液体保持在高压状态，同时将液体保持在图案的凹部中; 然后从处理容器中排出处于高压状态或气态的流体。

公开(公告)号：US20120240426A1

公开(公告)日：2012-09-27

申请号：US13231956

申请日：2011-09-13

申请人： Hidekazu HAYASHI ,  Hiroshi Tomita ,  Yukiko Kitajima ,  Hisashi Okuchi ,  Yohei Sato

发明人： Hidekazu HAYASHI ,  Hiroshi Tomita ,  Yukiko Kitajima ,  Hisashi Okuchi ,  Yohei Sato

IPC分类号： F26B7/00 ,  F26B21/14

CPC分类号： H01L21/02101 ,  H01L21/02068 ,  H01L21/67017 ,  H01L21/67034

摘要： According to one embodiment, a supercritical drying method for a semiconductor substrate includes introducing a semiconductor substrate formed with a metal film into a chamber, the surface of the substrate being wet with alcohol, supplying a supercritical fluid of carbon dioxide into the chamber, setting a temperature inside the chamber to a predetermined temperature, to replace the alcohol on the semiconductor substrate with the supercritical fluid, and discharging the supercritical fluid and the alcohol from the chamber while keeping the temperature inside the chamber at the predetermined temperature, to lower a pressure inside the chamber. The predetermined temperature is not lower than 75° C. but lower than a critical temperature of the alcohol.

摘要翻译： 根据一个实施例，半导体衬底的超临界干燥方法包括将形成有金属膜的半导体衬底引入腔室中，基底表面被醇润湿，将二氧化碳的超临界流体供应到腔室中， 在室内温度达到预定温度，用超临界流体替代半导体衬底上的醇，并且将超临界流体和醇从室中排出，同时将室内的温度保持在预定温度，以降低内部的压力 房间。 预定温度不低于75℃，但低于醇的临界温度。

公开(公告)号：US20120074974A1

公开(公告)日：2012-03-29

申请号：US13375588

申请日：2010-05-27

申请人： Yohei Sato ,  Kenichi Kataoka

发明人： Yohei Sato ,  Kenichi Kataoka

IPC分类号： G01R1/04 ,  G01R1/067

CPC分类号： G01R31/2887 ,  G01R31/3025 ,  H01L2924/0002 ,  H01L2924/00

摘要： A test unit to be used with a tester that tests an electrical characteristic of a circuit formed in a wafer includes a tester a board electrically connected to the tester; a first wireless port mounted on a lower surface of the tester board and electrically connected to the tester; a probe board that includes a probe to be in contact with an electrode pad of the electronic circuit, and is configured so that the probe board may be transferred along with the wafer into the system box while the probe and the electrode pad are in contact with each other; a second wireless port that is mounted on an upper surface of the probe board and electrically connected to the probe, and carries out contactless transmission/reception with the first wireless port; a chuck plate that is away from the tester board, and holds the probe board and the wafer; and a flexible expandable chamber that may be inflated by introducing gas thereinto.

摘要翻译： 与测试晶片中形成的电路的电特性的测试器一起使用的测试单元包括：测试器，电连接到测试器; 安装在测试器板的下表面上并电连接到测试器的第一无线端口; 探针板，其包括与电子电路的电极焊盘接触的探针，并且被构造成使得探针板可以与晶片一起转移到系统箱中，同时探针和电极焊盘与 彼此; 第二无线端口，其安装在所述探针板的上表面上并电连接到所述探针，并且与所述第一无线端口执行非接触式发送/接收; 离开测试器板的夹盘，并保持探针板和晶片; 以及可以通过将气体引入其而膨胀的柔性可膨胀室。

公开(公告)号：US20100196590A1

公开(公告)日：2010-08-05

申请号：US12758220

申请日：2010-04-12

申请人： Masako Shimomura ,  Tadayoshi Inamoto ,  Kazunari Ishizuka ,  Ryoichiro Kurobe ,  Yohei Sato ,  Akihiko Shimomura ,  Isao Imamura

发明人： Masako Shimomura ,  Tadayoshi Inamoto ,  Kazunari Ishizuka ,  Ryoichiro Kurobe ,  Yohei Sato ,  Akihiko Shimomura ,  Isao Imamura

IPC分类号： B05D7/24

CPC分类号： B41J2/1603 ,  B41J2/14024 ,  B41J2/14072 ,  B41J2/1623 ,  B41J2/1629

摘要： An ink jet head has a head substrate including discharge elements for discharging ink, with an electric wiring board being electrically connected to the head substrate, in which the periphery of the head substrate is sealed with a first sealant, and an electric splice between the head substrate and the electric wiring board is sealed with a second sealant. The first and second sealants contain the same base resin and curing agent, and the second sealant shows higher hardness than the first sealant after curing. This ink jet head is free from problems such as cavities and fissures at the boundary of the two sealants caused by a difference in linear expansion coefficients.

摘要翻译： 喷墨头具有包括用于排出墨水的排出元件的头基板，其中电接线板与头基板电连接，其中头基板的周边用第一密封剂密封，并且头部之间的电接头 基板和电布线板用第二密封剂密封。 第一和第二密封剂含有相同的基础树脂和固化剂，并且第二密封剂在固化后显示比第一密封剂更高的硬度。 该喷墨头在线性膨胀系数的差异下，在两个密封剂的边界处没有诸如空腔和裂缝的问题。

公开(公告)号：US07722917B2

公开(公告)日：2010-05-25

申请号：US10957686

申请日：2004-10-05

申请人： Masako Shimomura ,  Tadayoshi Inamoto ,  Kazunari Ishizuka ,  Ryoichiro Kurobe ,  Yohei Sato ,  Akihiko Shimomura ,  Isao Imamura

发明人： Masako Shimomura ,  Tadayoshi Inamoto ,  Kazunari Ishizuka ,  Ryoichiro Kurobe ,  Yohei Sato ,  Akihiko Shimomura ,  Isao Imamura

IPC分类号： B05D5/12 ,  B05D3/02

CPC分类号： B41J2/1603 ,  B41J2/14024 ,  B41J2/14072 ,  B41J2/1623 ,  B41J2/1629

摘要： An ink jet head has a head substrate including discharge elements for discharging ink, with an electric wiring board being electrically connected to the head substrate, in which the periphery of the head substrate is sealed with a first sealant, and an electric splice between the head substrate and the electric wiring board is sealed with a second sealant. The first and second sealants contain the same base resin and curing agent, and the second sealant shows higher hardness than the first sealant after curing. This ink jet head is free from problems such as cavities and fissures at the boundary of the two sealants caused by a difference in linear expansion coefficients.

摘要翻译： 喷墨头具有包括用于排出墨水的排出元件的头基板，其中电接线板与头基板电连接，其中头基板的周边用第一密封剂密封，并且头部之间的电接头 基板和电布线板用第二密封剂密封。 第一和第二密封剂含有相同的基础树脂和固化剂，并且第二密封剂在固化后显示比第一密封剂更高的硬度。 该喷墨头在线性膨胀系数的差异下，在两个密封剂的边界处没有诸如空腔和裂缝的问题。

公开(公告)号：US20090131598A1

公开(公告)日：2009-05-21

申请号：US12304689

申请日：2007-06-11

申请人： Noburu Murata ,  Chiharu Takimoto ,  Yohei Sato

发明人： Noburu Murata ,  Chiharu Takimoto ,  Yohei Sato

IPC分类号： C08G63/91

CPC分类号： C08L83/04 ,  C08G77/18 ,  C08G77/70 ,  C08K5/098 ,  C08L67/02 ,  C08L83/00 ,  C08L2666/18

摘要： There is provided an organic-inorganic hybrid vitreous material comprising a composite of a polycondensate of an organoalkoxysilane represented by R1nSi(OR2)4-n (R1 is an organic group, R2 is a C1-C5 alkyl group, and n is 1-2) and an organic polymer, wherein the polycondensate of the organoalkoxysilane is in 40-70wt % and the organic polymer is in 30-60wt % in case that the total weight of the composite is taken as 100wt %.

摘要翻译： 提供了由R1nSi（OR2）4-n（R1是有机基团，R2是C1-C5烷基，n是1-2）的有机烷氧基硅烷的缩聚物的复合物的有机 - 无机混合玻璃质材料， ）和有机聚合物，其中有机烷氧基硅烷的缩聚物为40-70重量％，有机聚合物为30-60重量％，在复合材料的总重量为100重量％的情况下。