公开(公告)号：US20130096721A1

公开(公告)日：2013-04-18

申请号：US13276247

申请日：2011-10-18

申请人： Madhusudan K. Iyengar ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC分类号： G05D23/19

CPC分类号： H05K7/20836 ,  G05D23/1932

摘要： A method, system, and computer program product for controlling data center cooling. In an example embodiment the method includes calculating, using a processor, an over-provisioning factor, where the over-provisioning factor is a function of a ratio of a rated cooling power to a calculated cooling power of a set of cooling units, the set of cooing units comprising at least one cooling unit. The method proceeds by adjusting the data-center cooling until the over-provisioning factor is substantially equal to a target over-provisioning factor.

摘要翻译： 一种用于控制数据中心冷却的方法，系统和计算机程序产品。 在示例实施例中，该方法包括使用处理器计算过度供应因子，其中过度供应因子是额定冷却功率与一组冷却单元的计算的冷却功率的比率的函数，该组 包括至少一个冷却单元的冷却单元。 该方法通过调整数据中心冷却来进行，直到过度供应因子基本上等于目标过度供应因子。

公开(公告)号：US08369091B2

公开(公告)日：2013-02-05

申请号：US12825761

申请日：2010-06-29

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： F28F3/04 ,  F28D2021/0031 ,  F28F3/12 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20236 ,  H05K7/20827

摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment so that the electronic subsystem is immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple electronic components immersed within the dielectric fluid to facilitate localized cooling and condensing of dielectric fluid vapor between the multiple electronic components.

摘要翻译： 提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。 冷却装置包括至少部分围绕电子子系统和形成密封隔室的壳体，以及设置在密封隔间内的电介质流体，使得电子子系统浸没在电介质流体内。 提供了液体冷却的蒸汽冷凝器，其包括在密封隔室内延伸的多个导热冷凝器翅片。 冷凝器翅片促进在密封隔室内产生的介电流体蒸气的冷却和冷凝。 在密封隔室内，多个导热冷凝器翅片与浸没在电介质流体内的多个电子部件交错，以便于多个电子部件之间的介电流体蒸气的局部冷却和冷凝。

公开(公告)号：US08322154B2

公开(公告)日：2012-12-04

申请号：US12556031

申请日：2009-09-09

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25B5/02 ,  F25D17/02 ,  F28D15/02

CPC分类号： H05K7/20381 ,  F28D15/0266 ,  F28D15/06

摘要： A cooling system and method are provided for facilitating two-phase heat transfer from an electronics system including a plurality of electronic devices to be cooled. The cooling system includes a plurality of evaporators coupled to the electronic devices, and a coolant loop for passing system coolant through the evaporators. The coolant loop includes a plurality of coolant branches coupled in parallel, with each coolant branch being coupled in fluid communication with a respective evaporator. The cooling system further includes a control unit for maintaining pressure of system coolant at a system coolant supply side of the coolant branches within a specific pressure range at or above saturation pressure of the system coolant for a given desired saturation temperature of system coolant into the evaporators to facilitate two-phase heat transfer in the plurality of evaporators from the electronic devices to the system coolant at the given desired saturation temperature.

摘要翻译： 提供了一种冷却系统和方法，用于促进包括要冷却的多个电子设备的电子系统的两相热传递。 冷却系统包括耦合到电子设备的多个蒸发器和用于使系统冷却剂通过蒸发器的冷却剂回路。 冷却剂回路包括并联联接的多个冷却剂分支，每个冷却剂分支与相应的蒸发器流体连通地联接。 冷却系统还包括一个控制单元，用于在系统冷却剂进入蒸发器的给定期望饱和温度下，在系统冷却剂的饱和压力或更高的特定压力范围内，保持冷却剂分支的系统冷却剂供应侧的系统冷却剂的压力。 以促进在给定的所需饱和温度下从电子装置到系统冷却剂的多个蒸发器中的两相热传递。

公开(公告)号：US20120232879A1

公开(公告)日：2012-09-13

申请号：US13045474

申请日：2011-03-10

申请人： Madhusudan K. Iyengar ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC分类号： G06G7/62

CPC分类号： G06F17/5009 ,  G06Q10/04

摘要： Method, system and computer program product for estimating the overall energy efficiency of a data center over a period of time. In one embodiment, a computer processor coupled to computer readable memory is configured to receive time parameters indicating the period of time over which the overall energy efficiency of the data center is to be estimated, receive component parameters indicating the performance characteristics of data center components and the operational interactions between the data center components, simulate the operation and interaction of the data center components based, at least in part, on the component parameters for the period of time over which the energy efficiency is estimated, and output results of the simulation to estimate the overall energy efficiency of the data center.

摘要翻译： 方法，系统和计算机程序产品，用于估计数据中心在一段时间内的总体能效。 在一个实施例中，耦合到计算机可读存储器的计算机处理器被配置为接收指示要在其上估计数据中心的总能量效率的时间周期的时间参数，接收指示数据中心组件的性能特征的组件参数，以及 数据中心组件之间的操作交互，至少部分地模拟数据中心组件的操作和交互，该模型至少部分地基于估计能量效率的时间段内的组件参数，以及模拟的输出结果 估计数据中心的整体能源效率。

公开(公告)号：US20120175100A1

公开(公告)日：2012-07-12

申请号：US13423659

申请日：2012-03-19

申请人： Raschid Jose Bezama ,  Evan George Colgan ,  Madhusudan K. Iyengar ,  John Harold Magerlein ,  Roger Ray Schmidt

发明人： Raschid Jose Bezama ,  Evan George Colgan ,  Madhusudan K. Iyengar ,  John Harold Magerlein ,  Roger Ray Schmidt

IPC分类号： F28F1/10

CPC分类号： F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

摘要翻译： 一种具有整体构造的冷却器，包括在基部上包括多个翅片的通道部分，所述多个翅片在其间限定多个微通道，形成在所述多个翅片的一组中的锥形开口， 所述歧管部分包括设置在所述多个翅片中的所述锥形开口上方的入口和出口，以及包括设置在所述通道部分和所述歧管部分之间的至少两个细长开口的隔离片。

公开(公告)号：US08208258B2

公开(公告)日：2012-06-26

申请号：US12556053

申请日：2009-09-09

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： A cooling system and method are provided for facilitating cooling of multiple liquid-cooled electronics racks. The cooling system includes a main system coolant supply loop with a plurality of system coolant supply branch lines for facilitating supply of cooled system coolant to the electronics racks, and a main system coolant return loop with a plurality of system coolant return branch lines for facilitating return of exhausted system coolant from the electronics racks. When operational, cooled system coolant circulates through the coolant supply loop and exhausted system coolant circulates through the coolant return loop. A plurality of modular cooling units are coupled to the coolant supply loop and coolant return loop. Each modular cooling unit includes a heat exchanger to facilitate cooling of a portion of the exhausted coolant circulating through the main system coolant return loop for return as cooled system coolant to the main system coolant supply loop.

摘要翻译： 提供了一种用于促进多个液冷电子机架的冷却的冷却系统和方法。 冷却系统包括主系统冷却剂供应回路，其具有多个系统冷却剂供应分支管线，以便于将冷却的系统冷却剂供应到电子机架，以及具有多个系统冷却剂返回分支管线以便于返回的主系统冷却剂回流回路 从电子机架排出的系统冷却液。 冷却系统冷却剂在运行时循环通过冷却剂供应回路，排气系统冷却剂循环通过冷却液回流回路。 多个模块化冷却单元联接到冷却剂供应回路和冷却剂回流回路。 每个模块化冷却单元包括热交换器，以便于冷却循环通过主系统冷却剂回流回路的排出冷却剂的一部分，以便作为冷却系统冷却剂返回到主系统冷却剂供应回路。

公开(公告)号：US08081461B2

公开(公告)日：2011-12-20

申请号：US12491325

申请日：2009-06-25

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4735 ,  F28D15/0266 ,  F28F13/187 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material.

摘要翻译： 提供冷却装置和制造方法以便于电子装置的冷却。 冷却装置包括导热多孔材料和液体冷却剂供应。 导热多孔材料（例如金属泡沫材料）被耦合到要冷却的电子设备的表面，或耦合到电子设备的结构。 液体冷却剂供应包括喷射冲击结构，其包括用于将液体冷却剂引导到要冷却的表面上的一个或多个喷嘴。 喷射喷嘴延伸到导热多孔材料中，并且有助于将液体冷却剂输送到待冷却的表面上。 导热多孔材料与要冷却的表面热接触，并且通过沸腾通过多孔材料的液体冷却剂来促进电子器件的冷却。

公开(公告)号：US08020298B2

公开(公告)日：2011-09-20

申请号：US12246545

申请日：2008-10-07

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： B21D53/06 ,  B23P15/26

CPC分类号： F28F1/126 ,  F28D2001/0266 ,  F28D2021/0031 ,  F28F1/30 ,  F28F1/32 ,  F28F2009/228 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/3672 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49377 ,  Y10T29/49378 ,  Y10T29/4938 ,  H01L2924/00

摘要： A method of fabricating a heat exchanger which includes: obtaining multiple coolant-carrying conduit sections, each having a non-circular cross-section, and first and second main surfaces; providing multiple primary folded fins secured to the conduit sections. Each folded fin includes a solid fin surface with multiple bends defining alternating, U-shaped air-passage channels, and a base surface and a top surface. Each folded fin is secured at the base or top surface to a main surface of a conduit section, and the folded fins have leading and trailing edges relative to airflow direction. The method includes forming a plurality of sets of secondary fins, each set extending from the leading or trailing edge of a respective folded fin at an angle other than 0. At least one conduit section has a first folded fin secured to its first main surface, and a second folded fin secured to its second main surface thereof.

摘要翻译： 一种制造热交换器的方法，包括：获得多个具有非圆形横截面的冷却剂承载管段，以及第一和第二主表面; 提供固定到导管部分的多个主折叠翼片。 每个折叠翅片包括具有限定交替的U形通气通道的多个弯曲的固体翅片表面，以及基部表面和顶部表面。 每个折叠的翅片在基部或顶部表面固定到导管部分的主表面，并且折叠的翅片具有相对于气流方向的前缘和后缘。 该方法包括形成多组辅助散热片，每组二次散热片各自以相应的折叠翅片的前缘或后缘以不同于0的角度延伸。至少一个导管段具有固定到其第一主表面上的第一折叠翅片， 以及固定到其第二主表面的第二折叠翅片。

公开(公告)号：US07990709B2

公开(公告)日：2011-08-02

申请号：US12565189

申请日：2009-09-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  H05K5/00 ,  G06F1/20

CPC分类号： H05K7/2079 ,  H05K7/20745 ,  Y10T29/49826

摘要： Apparatus and method are provided for facilitating cooling of air passing through an electronics rack. The apparatus includes a heat exchange assembly hingedly mounted above and external to the rack, such that air passing above the rack from an air outlet side to an air inlet side thereof passes through the heat exchange assembly, and is cooled. The heat exchange assembly includes a support structure to support hinged mounting of the assembly above the rack, and an air-to-liquid heat exchanger coupled to the support structure. The heat exchanger has an inlet plenum and an outlet plenum in fluid communication with respective connect couplings which facilitate connection of the plenums to coolant supply and return lines, respectively. The heat exchanger also includes heat exchange tube sections, each of which has a coolant channel with an inlet and an outlet coupled to the inlet and outlet plenums, respectively.

摘要翻译： 提供了用于促进通过电子机架的空气冷却的装置和方法。 该装置包括铰链地安装在机架上方和外部的热交换组件，使得从空气出口侧到其空气入口侧的齿条上方的空气通过热交换组件，并被冷却。 热交换组件包括支撑结构以支撑组件在机架上方的铰接安装，以及耦合到支撑结构的空气 - 液体热交换器。 热交换器具有入口压力室和与相应的连接联接器流体连通的出口增压室，分别促进增压室连接到冷却剂供应和回流管线。 热交换器还包括热交换管部分，每个热交换管部分具有冷却剂通道，分别具有入口和出口，该入口和出口分别连接到入口和出口增压室。

公开(公告)号：US07983040B2

公开(公告)日：2011-07-19

申请号：US12256628

申请日：2008-10-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H05K7/20236 ,  H05K7/20772

摘要： Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled.

摘要翻译： 提供了一种装置和方法，用于促进具有多种不同类型待组件的电子子系统的浸入式冷却。 该设备包括一个容纳电子子系统的容器，以及一个冷却剂入口和一个冷却剂出口，用于促进冷却剂通过容器的进出。 该装置还包括与容器的冷却剂入口和出口流体连通地联接的冷却剂泵组件，用于促进冷却剂通过容器的主动泵送。 当电子子系统可操作地插入容器中并且冷却剂被泵送通过容器时，电子子系统的多种不同类型的部件被冷却剂浸没冷却。 在一个实施例中，填充元件设置在容器内，并且其尺寸设计成减小容器内的冷却剂的量，同时仍保持电子子系统的部件浸没冷却。