公开(公告)号：US20120125536A1

公开(公告)日：2012-05-24

申请号：US13388492

申请日：2010-08-05

申请人： Masahiro Morimoto ,  Nobuyuki Kakita ,  Akira Kabeshita

发明人： Masahiro Morimoto ,  Nobuyuki Kakita ,  Akira Kabeshita

IPC分类号： B32B37/10 ,  B32B37/14

CPC分类号： H01L21/67092 ,  Y10T29/4913 ,  Y10T29/53178 ,  Y10T156/1089 ,  Y10T156/1744

摘要： Link mechanisms provided corresponding to press bonding heads each include a first link member having one end pivotably connected to an upper end of the press bonding head, a second link member having one end pivotably connected to the other end of the first link member and having the other end pivotably connected to a link bracket above the press bonding head, and a connection slide part connected to a connection part between the first and second link members, collectively drive the connection slide parts of the link mechanisms by a press bonding head driving unit in horizontal directions (Y axis directions) orthogonal to a direction (X axis direction) of side-by-side arrangement of the plurality of press bonding heads, open and close the first and second link members of the link mechanisms in the vertical directions thereby collectively moving the plurality of press bonding heads downward and upward.

摘要翻译： 对应于压接头的连杆机构各自包括：第一连杆部件，其一端可枢转地连接到压接头的上端;第二连杆部件，其一端可枢转地连接到第一连杆部件的另一端， 另一端可枢转地连接到压接头上方的连杆支架，以及连接到第一和第二连杆构件之间的连接部分的连接滑动部分，通过压接头驱动单元共同地驱动连杆机构的连接滑动部件 与多个压接头的并排配置的方向（X轴方向）正交的水平方向（Y轴方向），在垂直方向上打开和关闭连杆机构的第一和第二连杆构件，从而共同地 向下和向上移动多个压接头。

公开(公告)号：US20110114117A1

公开(公告)日：2011-05-19

申请号：US13003331

申请日：2009-10-29

申请人： Masaya Watanabe ,  Sakae Kobayashi ,  Akira Kabeshita

发明人： Masaya Watanabe ,  Sakae Kobayashi ,  Akira Kabeshita

IPC分类号： B08B1/00

CPC分类号： B08B1/008 ,  Y10S134/902

摘要： A substrate cleaning apparatus for cleaning a front-side clean target surface 1a and a back-side clean target surface 1b of a edge portion of a substrate 1 by wiping surfaces 12a, 12b of a cleaning tape 12. The substrate cleaning apparatus includes a presser member 11a for pressing the cleaning tape 12 against the clean target surface 1a, a presser member 11b for pressing the cleaning tape 12 against the clean target surface 1b, a tape path passing through between the presser member 11a and the clean target surface 1a and between the presser member 11b and the clean target surface 1b, a moving device for moving the cleaning tape 12 and the substrate 1 relative to each other in a longitudinal direction of the edge portion. The tape path makes the cleaning tape 12 passed through between the presser member 11a and the clean target surface 1a in a direction orthogonal to the longitudinal direction of the edge portion of the substrate 1 with the wiping surface 12a facing the clean target surface 1a, next makes the cleaning tape 12 looped so that the wiping surface 12b faces the back side of the substrate 1, and subsequently makes the cleaning tape 12 passed through between the presser member 11b and the clean target surface 1b in a direction identical to the passage direction between the presser member 11a and the clean target surface 1a with the wiping surface 12b facing the clean target surface 1b.

摘要翻译： 通过擦拭清洁带12的表面12a，12b清洁基板1的边缘部分的前侧清洁目标表面1a和后侧清洁目标表面1b的基板清洁装置。基板清洁装置包括压板 用于将清洁带12压靠在清洁目标表面1a上的构件11a，用于将清洁带12压靠在清洁目标表面1b上的压紧构件11b，穿过压紧构件11a和清洁目标表面1a之间的带路径，以及 按压部件11b和清洁目标表面1b，用于沿着边缘部分的纵向移动清洁带12和基板1的移动装置。 带路径使得清洁带12沿着与基板1的边缘部分的纵向正交的方向通过压紧构件11a和清洁目标表面1a之间，擦拭表面12a面向清洁目标表面1a，接下来 使得清洁带12环绕，使得擦拭表面12b面向基板1的背面，并且随后使清洁带12沿与压接件11b和清洁目标表面1b之间的通过方向相同的方向通过， 压紧构件11a和清洁目标表面1a，其中擦拭表面12b面向清洁目标表面1b。

公开(公告)号：US07669317B2

公开(公告)日：2010-03-02

申请号：US11464230

申请日：2006-08-14

申请人： Yoichi Makino ,  Akira Kabeshita

发明人： Yoichi Makino ,  Akira Kabeshita

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53478 ,  Y10T156/1702

摘要： In a chip reversing method for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

摘要翻译： 在用于保持并垂直反转由接合喷嘴放置的芯片的芯片反转方法中，芯片被保持在设置在反转构件中的切屑保持单元上，并且通过在反转轴上向下转动反向构件而垂直反转。 在由芯片接收单元接收到反向芯片之后，该芯片接收单元下降到缩回位置，以将反向构件返回到原始位置。 在这种状态下，芯片接收单元升高以将芯片定位在芯片转移动作的高度L处。 结果，反转构件不突出到用于芯片转移的高度水平以上，从而干扰另一机构，使得可以使芯片安装动作有效。

公开(公告)号：US07437818B2

公开(公告)日：2008-10-21

申请号：US10564275

申请日：2004-08-25

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

摘要： A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

摘要翻译： 一种用于将多个部件安装在板上的部件安装装置和方法。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。

公开(公告)号：US07077262B2

公开(公告)日：2006-07-18

申请号：US11035997

申请日：2005-01-18

申请人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

发明人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

IPC分类号： B65G15/10

CPC分类号： H05K13/0069 ,  H05K13/0061 ,  H05K13/0452 ,  Y10T29/49124

摘要： In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working their drive units, board conveying/holding devices recognition cameras and so forth are also arranged. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.

摘要翻译： 在组件安装工作区域中，两个电子电路板以锯齿形的方式放置，并且组件独立地安装在每个板上。 还安排了两套其驱动单元，板传送/保持装置识别照相机等。 用于保持板的板传送/保持装置移动到靠近分量供给单元的位置，并且部件安装在相应的安装区域中。

公开(公告)号：US07003872B2

公开(公告)日：2006-02-28

申请号：US10503497

申请日：2003-02-06

申请人： Naoto Mimura ,  Izumi Miura ,  Hirofumi Obara ,  Hiroshi Uchiyama ,  Nobuyuki Kakita ,  Kazunori Kanai ,  Osamu Okuda ,  Akira Kabeshita

发明人： Naoto Mimura ,  Izumi Miura ,  Hirofumi Obara ,  Hiroshi Uchiyama ,  Nobuyuki Kakita ,  Kazunori Kanai ,  Osamu Okuda ,  Akira Kabeshita

IPC分类号： H05K3/30 ,  B23P19/00

CPC分类号： H05K13/0413 ,  H05K13/0853 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5137 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.

摘要翻译： 提供了一种用于安装电子部件的装置和方法，其缩短了安装所需的周期时间，并且使部件安装机器布置在小的区域中。 提供了一种控制器，使得对第二部件馈送器执行用于第二电子部件的退避控制，以便如果第一电子部件或部件保持器干扰第二部件馈送器的第二电子部件，则避免干扰，因为 的安装头的运动。 可以减少上下移动部件保持器所需的时间，并且消除了在移动安装头时无法沿着绕行移动的需要。 可以缩短周期时间，最终可以降低成本。

公开(公告)号：US06971157B1

公开(公告)日：2005-12-06

申请号：US10129005

申请日：2000-10-30

申请人： Noriaki Yoshida ,  Osamu Okuda ,  Akira Kabeshita ,  Takeyuki Kawase

发明人： Noriaki Yoshida ,  Osamu Okuda ,  Akira Kabeshita ,  Takeyuki Kawase

IPC分类号： H05K13/04 ,  H05K13/08 ,  B23P19/00

CPC分类号： H05K13/0452 ,  H05K13/0404 ,  H05K13/041 ,  H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53196

摘要： When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

摘要翻译： 当安装两个用于执行由部件保持，部件识别和部件放置构成的一系列部件安装操作的安装单元时，执行操作控制，使得在两个安装中的任一个中执行部件识别或板识别操作 在另一个安装单元中不执行部件放置或部件保持操作。

公开(公告)号：US06895662B2

公开(公告)日：2005-05-24

申请号：US09921982

申请日：2001-08-06

申请人： Osamu Okuda ,  Yoshihiro Yoshida ,  Akira Kabeshita ,  Satoshi Shida ,  Naoyuki Kitamura

发明人： Osamu Okuda ,  Yoshihiro Yoshida ,  Akira Kabeshita ,  Satoshi Shida ,  Naoyuki Kitamura

IPC分类号： H05K13/04

CPC分类号： H05K13/0409 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

摘要翻译： 一种电子部件安装装置，其采用与花键轴的一端部的空气通路连接的第一空气供给装置和与所述花键轴的另一端附近的所述空气通路连接的第二供气装置。 第一和第二空气进料用于向空气通道供应空气以将其内部返回到大气压力。 通过使用两个单独的空气进料，可以缩短将空气通道中的真空压力恢复到大气压所需的时间。

公开(公告)号：US06688833B1

公开(公告)日：2004-02-10

申请号：US09979274

申请日：2001-11-21

申请人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

发明人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

IPC分类号： B65B2102

CPC分类号： H05K13/0413 ,  H05K13/0409 ,  H05K13/041 ,  H05K13/0452

摘要： When a nozzle is selected, a piston rod (46) of a nozzle selecting cylinder (45) positioned at a lower end position unfailingly forms a gap (A) with an upper end of a nozzle elevating shaft (55) so that the piston rod of the cylinder (45) is not brought into contact with the nozzle elevating shaft at the time of nozzle selecting. Only when an elevating member (58) is lowered by a drive by an elevation drive motor (56), the piston rod (46) is brought into contact with the nozzle elevating shaft (55).

摘要翻译： 当选择喷嘴时，位于下端位置的喷嘴选择圆筒（45）的活塞杆（46）与喷嘴升降轴（55）的上端形成间隙（A），使得活塞杆 在喷嘴选择时，气缸（45）不与喷嘴升降轴接触。 只有当升降构件（58）被升降驱动马达（56）的驱动下降时，活塞杆（46）与喷嘴升降轴（55）接触。

公开(公告)号：US06395335B2

公开(公告)日：2002-05-28

申请号：US08987202

申请日：1997-12-09

申请人： Hiroaki Onishi ,  Shoji Sato ,  Takao Naito ,  Takaaki Higashida ,  Akira Kabeshita

发明人： Hiroaki Onishi ,  Shoji Sato ,  Takao Naito ,  Takaaki Higashida ,  Akira Kabeshita

IPC分类号： B05D312

CPC分类号： H05K3/1233 ,  B41F15/42 ,  H05K2203/0139

摘要： A filling squeegee and a scraping squeegee are provided in a printing apparatus. The filling squeegee is moved without contacting a surface of a mask in order to fill a solder paste into openings of the mask. Unnecessary solder paste on the surface of the mask is scraped by the scraping squeegee. The solder paste is prevented from being improperly filled in or scraped from the openings even if a speed of the squeegee is increased, so that the solder paste can be printed stably on circuit board.