公开(公告)号：US20070039686A1

公开(公告)日：2007-02-22

申请号：US11464230

申请日：2006-08-14

申请人： Yoichi Makino ,  Akira Kabeshita

发明人： Yoichi Makino ,  Akira Kabeshita

IPC分类号： B32B37/00 ,  H01L21/00 ,  B32B38/00 ,  B32B38/18

CPC分类号： H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53478 ,  Y10T156/1702

摘要： In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

摘要翻译： 在用于保持并垂直反转由接合喷嘴放置的芯片的芯片安装装置中的芯片反转装置中，芯片被保持在设置在反转构件中的芯片保持单元上，并且通过向后转动反向构件而垂直反转 反转轴。 在由芯片接收单元接收到反向芯片之后，该芯片接收单元下降到缩回位置，以将反向构件返回到原始位置。 在这种状态下，芯片接收单元升高以将芯片定位在芯片转移动作的高度L处。 结果，反转构件不突出到用于芯片转移的高度水平以上，从而干扰另一机构，使得可以使芯片安装动作有效。

公开(公告)号：US5265649A

公开(公告)日：1993-11-30

申请号：US907188

申请日：1992-07-01

申请人： Yoshimi Iwano ,  Yoichi Makino ,  Tetsuya Furuta

发明人： Yoshimi Iwano ,  Yoichi Makino ,  Tetsuya Furuta

IPC分类号： D03J1/00 ,  D03D49/00

CPC分类号： D03J1/001

摘要： A full roll transferred from a cloth wind-up position in a weaving machine to a temporary full-roll storage position on a transfer carriage is prevented from rotation by meshing with a gear mounted stationarily. The transfer carriage is equipped with empty roll supporting arms and cutter supporting arms having free ends at which a cloth cutting mechanism is supported. An empty roll is supported by a holding device mounted at free ends of the empty roll supporting arms so as to be rotated by an empty roll driving motor. Owing to rotation of the empty roll, tension is applied to a cloth between the full roll and the empty roll so that it is cut by the cloth cutting mechanism in a tensioned stationary state.

公开(公告)号：US08001678B2

公开(公告)日：2011-08-23

申请号：US12202594

申请日：2008-09-02

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

IPC分类号： B23P19/00

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

摘要： A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

摘要翻译： 一种用于将多个部件安装在板上的部件安装装置。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。

公开(公告)号：US20090007420A1

公开(公告)日：2009-01-08

申请号：US12202594

申请日：2008-09-02

申请人： Akira KABESHITA ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

发明人： Akira KABESHITA ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

IPC分类号： B23P19/00

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

摘要： A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

摘要翻译： 一种用于将多个部件安装在板上的部件安装装置。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。

公开(公告)号：US07017261B2

公开(公告)日：2006-03-28

申请号：US10130118

申请日：2001-09-18

申请人： Kenji Okamoto ,  Akira Kabeshita ,  Hideo Sakon ,  Yoichi Makino ,  Ken Takano

发明人： Kenji Okamoto ,  Akira Kabeshita ,  Hideo Sakon ,  Yoichi Makino ,  Ken Takano

IPC分类号： H05K3/30 ,  B23P19/00

CPC分类号： H05K13/0413 ,  H05K13/041 ,  H05K13/0452 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： A component suction device includes a suction nozzle for sucking and holding a component, a nozzle turning device for holding the suction nozzle and turning the suction nozzle, and a nozzle up-and-down device which is located above the nozzle turning device and which is connected to the suction nozzle for moving up and down the suction nozzle along an axial direction of the suction nozzle.

摘要翻译： 一种部件吸引装置，包括用于吸附和保持部件的吸嘴，用于保持吸嘴并转动吸嘴的喷嘴旋转装置，以及位于喷嘴旋转装置上方的喷嘴上下装置， 连接到吸嘴，用于沿着吸嘴的轴向上下移动吸嘴。

公开(公告)号：US5597743A

公开(公告)日：1997-01-28

申请号：US259149

申请日：1994-06-13

申请人： Kazuhiko Onda ,  Yoichi Makino

发明人： Kazuhiko Onda ,  Yoichi Makino

IPC分类号： H01L21/335 ,  H01L21/338 ,  H01L21/76 ,  H01L29/423 ,  H01L29/778 ,  H01L29/812 ,  H01L21/265 ,  H01L21/44

CPC分类号： H01L29/42316 ,  H01L21/7605 ,  H01L29/66462 ,  H01L29/7783

摘要： A field effect transistor has (a) a channel layer formed by a non-doped first semiconductor material (b) an electron supply layer formed by a doped second semiconductor material having an electron affinity which is lower than the affinity of the first semiconductor material, and (c) a contact layer formed by a doped third semiconductor material having an electron affinity which is higher than the affinity of the second semiconductor material. These layers are successively formed on a substrate of semi-insulating semiconductor material. Ions are implanted and a surface side portion of the contact layer is removed in a region other than at active portions in order to retain at least a part at a substrate side of the contact layer. By this arrangement, an excellent isolation can be achieved without producing large steps due to the mesa shape. Leakage current is not produced. There is no deterioration of the pinch off characteristic and withstand voltage. Noise characteristics and output efficiencies are excellent. There are no interruptions at electrode forming portions and the yield of fabrication is improved.

摘要翻译： 场效应晶体管具有（a）由非掺杂的第一半导体材料形成的沟道层（b）由电子亲和力低于第一半导体材料的亲和性的掺杂的第二半导体材料形成的电子供给层， 和（c）由具有比第二半导体材料的亲和性高的电子亲和力的掺杂的第三半导体材料形成的接触层。 这些层依次形成在半绝缘半导体材料的衬底上。 植入离子，并且在除活性部分之外的区域中去除接触层的表面侧部分，以便在接触层的基底侧保留至少一部分。 通过这种布置，可以实现优异的隔离，而不会由于台面形状而产生大的台阶。 泄漏电流不产生。 夹断特性和耐压不会变差。 噪声特性和输出效率非常好。 电极形成部分没有中断，制造成品率提高。

公开(公告)号：US07669317B2

公开(公告)日：2010-03-02

申请号：US11464230

申请日：2006-08-14

申请人： Yoichi Makino ,  Akira Kabeshita

发明人： Yoichi Makino ,  Akira Kabeshita

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53478 ,  Y10T156/1702

摘要： In a chip reversing method for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

摘要翻译： 在用于保持并垂直反转由接合喷嘴放置的芯片的芯片反转方法中，芯片被保持在设置在反转构件中的切屑保持单元上，并且通过在反转轴上向下转动反向构件而垂直反转。 在由芯片接收单元接收到反向芯片之后，该芯片接收单元下降到缩回位置，以将反向构件返回到原始位置。 在这种状态下，芯片接收单元升高以将芯片定位在芯片转移动作的高度L处。 结果，反转构件不突出到用于芯片转移的高度水平以上，从而干扰另一机构，使得可以使芯片安装动作有效。

公开(公告)号：US07437818B2

公开(公告)日：2008-10-21

申请号：US10564275

申请日：2004-08-25

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

摘要： A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

摘要翻译： 一种用于将多个部件安装在板上的部件安装装置和方法。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。

公开(公告)号：US06235626B1

公开(公告)日：2001-05-22

申请号：US09201151

申请日：1998-11-30

申请人： Yoichi Makino ,  Hironobu Miyamoto

发明人： Yoichi Makino ,  Hironobu Miyamoto

IPC分类号： H01L214763

CPC分类号： H01L21/28587 ,  H01L21/76804

摘要： The present invention provides a method of forming a gate recess in an insulating film on a substrate for depositing a gate electrode film being in contact with a part of the substrate and also extending at least within the gate recess. The method comprises the steps of: forming an etching mask pattern with a first opening pattern on the insulating film; carrying out a first anisotropic etching process by use of the etching mask pattern at a first selective ratio of the etching mask pattern to the insulating film, thereby to form a first recessed portion having a bottom which lies at a first level higher than an interface level between the insulating film and the substrate; and carrying out a second anisotropic etching process by use of the etching mask pattern again at a second selective ratio of the etching mask pattern to the insulating film, wherein the second selective ratio is higher than the first selective ratio, thereby to form a gate recess which comprises a second recessed portion both having a bottom which lies at the interface level and having first side walls of a first oblique angle and a third recessed portion both having a bottom united with a top of the second recessed portion and having second side walls of a second oblique angle which is smaller than the first oblique angle.

摘要翻译： 本发明提供一种在衬底上形成绝缘膜中的栅极凹槽的方法，用于沉积与衬底的一部分接触的栅电极膜，并且至少在栅极凹槽内延伸。 该方法包括以下步骤：在绝缘膜上形成具有第一开口图案的蚀刻掩模图案; 通过使用蚀刻掩模图案以与蚀刻掩模图案相对于绝缘膜的第一选择比进行第一各向异性蚀刻处理，从而形成第一凹陷部分，其具有位于比界面高度高的第一高度 在绝缘膜和基板之间; 并且以与蚀刻掩模图案相对于绝缘膜的第二选择比率再次利用蚀刻掩模图案进行第二各向异性蚀刻处理，其中第二选择比高于第一选择比，从而形成栅极凹部 其包括第二凹部，所述第二凹部具有位于界面水平处的底部，并且具有第一倾斜角的第一侧壁和具有与第二凹部的顶部结合的底部的第三凹部，并且具有第二侧壁 第二斜角小于第一斜角。

公开(公告)号：US20130071844A1

公开(公告)日：2013-03-21

申请号：US13636446

申请日：2011-03-23

申请人： Yoichi Makino ,  Akio Yamane ,  Masato Nakayama

发明人： Yoichi Makino ,  Akio Yamane ,  Masato Nakayama

IPC分类号： C12Q1/68

CPC分类号： C12Q1/6869 ,  C12Q1/6827 ,  C12Q1/6858 ,  C12Q2531/119 ,  C12Q2537/161 ,  C12Q2531/143 ,  C12Q2531/113 ,  C12Q2525/161 ,  C12Q2525/185 ,  C12Q2525/204 ,  C12Q2535/125 ,  C12Q2549/101 ,  C12Q2563/107 ,  C12Q2565/101

摘要： Disclosed is a method of detecting a target base sequence having a polymorphic base, the method including: (a) a step of adding to a nucleic acid sample having a target nucleic acid that includes a base sequence including the target base sequence: at least one type of detection primer, at least one type of competitive primer, and at least one type of common primer; (b) a step of annealing the detection primer and the competitive primer to the target nucleic acid in a competitive manner, thereby synthesizing an extension product A; (c) a step of annealing the common primer to the extension product A obtained in the step (b) or in the following step (d), thereby synthesizing an extension product B; (d) a step of annealing the detection primer or the competitive primer to the extension product B obtained in the previous step (c), thereby synthesizing the extension product A; and (e) a step of detecting the extension product A or the extension product B.

摘要翻译： 公开了一种检测具有多态性碱基的靶碱基序列的方法，所述方法包括：（a）向具有目标核酸的核酸样品中添加包含目标碱基序列的碱基序列的步骤：至少一种 检测引物的类型，至少一种类型的竞争性引物和至少一种类型的共同引物; （b）以竞争方式将检测引物和竞争性引物退火至目标核酸，由此合成延伸产物A; （c）将通用引物退火到步骤（b）或后续步骤（d）中获得的延伸产物A的步骤，从而合成延伸产物B; （d）将检测引物或竞争性引物退火至前述步骤（c）中获得的延伸产物B的步骤，从而合成延伸产物A; 和（e）检测扩展产品A或扩展产品B的步骤。