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    Mounter and Board Positioning Method
    1.
    发明申请
    Mounter and Board Positioning Method 有权
    贴片机和纸板定位方法

    公开(公告)号：US20070277369A1

    公开(公告)日：2007-12-06

    申请号：US11663766

    申请日：2006-02-13

    申请人： Masaru Kawazoe ,  Shigeo Masaki ,  Yoshihiro Mimura ,  Noriyuki Tani

    发明人： Masaru Kawazoe ,  Shigeo Masaki ,  Yoshihiro Mimura ,  Noriyuki Tani

    IPC分类号： H05K13/04

    CPC分类号： H05K13/0452 ,  H05K13/0061 ,  Y10T29/4913 ,  Y10T29/5136 ,  Y10T29/5137 ,  Y10T29/5313 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191

    摘要： A mounter including at least two mounting stages 109 and 110 where components are mounted onto boards transported from the upstream side in transportation direction of the board 120 and then transport the boards to the downstream side, and the mounter includes a first stopping unit 135 for stopping the board to place a board edge on the downstream side on a first fixed position which is in the downstream side from a first mountable area A, the first mountable area A being a mountable region where the components can be mounted on the first mounting stage 109 on the upstream side, and a second stopping unit 136 for stopping the board to place a board edge on the upstream side on a second fixed position which is the upstream side from a second mountable area A, the second mountable area A being a mountable region where the components can be mounted on the second mounting stage 110.

    摘要翻译： 一种安装器，包括至少两个安装台109和110，其中部件安装在从板120的运输方向上游侧传送的板上，然后将板运送到下游侧，并且安装器包括用于停止的第一停止单元135 所述板将第一固定位置的下游侧的板边缘从第一可安装区域A设置在下游侧，所述第一安装区域A为可安装在所述第一安装台109上的部件的安装区域 以及第二止动单元136，用于在第二可固定区域A的上游侧的第二固定位置上停止基板在上游侧设置板边缘，第二可安装区域A为可安装区域 其中组件可以安装在第二安装台110上。

    Component mounting apparatus and component mounting method
    2.
    发明申请
    Component mounting apparatus and component mounting method 有权
    组件安装装置和部件安装方法

    公开(公告)号：US20070101572A1

    公开(公告)日：2007-05-10

    申请号：US10564275

    申请日：2004-08-25

    申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

    发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

    IPC分类号： H05K3/30 ,  B23P19/00

    CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

    摘要： A component mounting apparatus is provided with a board holding device for holding a board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

    摘要翻译： 元件安装装置具有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板上的板上 保持位置的第二安装头，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持各个部件的晶片的晶片保持台的部件供给装置 进给，使得晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。

    Styrenic block copolymers and process for producing same
    5.
    发明授权
    Styrenic block copolymers and process for producing same 失效
    苯乙烯嵌段共聚物及其制备方法

    公开(公告)号：US5418290A

    公开(公告)日：1995-05-23

    申请号：US312759

    申请日：1994-09-27

    申请人： Shuji Machida ,  Toshinori Tazaki ,  Noriyuki Tani

    发明人： Shuji Machida ,  Toshinori Tazaki ,  Noriyuki Tani

    IPC分类号： B32B27/06 ,  C08F297/06 ,  C08L25/06 ,  C08L53/00 ,  C08L53/02 ,  C08L101/00 ,  B32B27/30 ,  C08F4/76 ,  C08F297/04

    CPC分类号： C08F297/06 ,  B32B27/06 ,  C08L25/06 ,  Y10T428/31855

    摘要： There are disclosed a styrenic block copolymer having a reduced viscosity of 0.01 to 20 dl/g (0.05 g/l in 1,2,4-trichlorobenzene at 135.degree. C.) which comprises highly syndiotactic styrenic-polymer segments and 10.sup.-4 to 10 mol % of heteroatom-containing styrenic polymer segments; a resin composition comprising the above styrenic block copolymer and a thermoplastic resin, an inorganic filler or an organic filler; a multi-layer material comprising at least one layer composed of the above styrenic block copolymer or the above resin composition; and a process for producing the above styrenic block copolymer which comprises polymerizing a styrenic monomer in the presence of a specific catalyst and adding a heteroatom-containing styrenic monomer to successively proceed with copolymerizaiton reaction. The above-disclosed styrenic block copolymer and the resin composition exhibit excellent compatibility and adhesivenesss, and the multi-layer material is expected to find a wide range of applications in automobile parts, electrical and electronic parts as well as film, sheet, etc.

    摘要翻译： 公开了一种苯乙烯嵌段共聚物，其具有0.01至20dl / g（在135℃下的1,2,4-三氯苯中为0.05g / l），其包含高度间同立构的苯乙烯 - 聚合物链段，并且10-4至 10mol％的含杂原子的苯乙烯聚合物链段; 包含上述苯乙烯嵌段共聚物和热塑性树脂，无机填料或有机填料的树脂组合物; 包括由上述苯乙烯嵌段共聚物或上述树脂组合物构成的至少一层的多层材料; 以及制备上述苯乙烯嵌段共聚物的方法，该方法包括在特定催化剂存在下使苯乙烯单体聚合并加入含杂原子的苯乙烯单体以继续进行共聚反应。 上述公开的苯乙烯嵌段共聚物和树脂组合物表现出优异的相容性和粘合性，多层材料预期在汽车部件，电气和电子部件以及薄膜，片材等方面可以广泛应用。

    ELECTRICAL CABLE WIRING HEAD DEVICE AND ELECTRICAL CABLE WIRING APPARATUS
    6.
    发明申请
    ELECTRICAL CABLE WIRING HEAD DEVICE AND ELECTRICAL CABLE WIRING APPARATUS 失效
    电线电缆头设备和电缆布线设备

    公开(公告)号：US20110030202A1

    公开(公告)日：2011-02-10

    申请号：US12842428

    申请日：2010-07-23

    申请人： Noriyuki TANI ,  Akinori OOISHI

    发明人： Noriyuki TANI ,  Akinori OOISHI

    IPC分类号： B23P19/00

    CPC分类号： H05K13/06 ,  Y10T29/5187 ,  Y10T29/53174 ,  Y10T29/532 ,  Y10T29/53213 ,  Y10T29/53261

    摘要： An electrical cable wiring head apparatus is provided to rapidly wire an electrical cable while more effectively restraining the electrical cable from floating. An electrical cable wiring head device of the electrical cable wiring head apparatus moves along a wiring surface of a wiring plate to wire an electrical cable on the wiring surface. The electrical cable wiring head device comprises: a head section supported rotatably about a rotary axis and provided with a guide recess for leading the electrical cable to the wiring surface, the guide recess being offset from the rotary axis; a head rotating mechanism for rotating the head section; a guide pushing member including a shaft portion and a roller portion provided rotatably on a distal end of the shaft portion, the guide pushing member being supported movably along the rotary axis; and a guide pushing member drive mechanism for reciprocating the guide pushing member.

    摘要翻译： 提供一种电缆布线头装置，用于在更有效地限制电缆浮动的同时快速地对电缆进行接线。 电缆布线头装置的电缆布线头装置沿着布线板的布线面移动，将布线面上的电缆布线。 电缆布线头装置包括：头部，其围绕旋转轴线可旋转地支撑并且设置有用于将电缆引导到布线表面的引导凹部，引导凹部偏离旋转轴线; 头部旋转机构，用于旋转头部; 引导推动构件，其包括轴部和可旋转地设置在所述轴部的远端上的滚子部，所述引导推动构件沿着所述旋转轴线可移动地支撑; 以及用于使引导推动构件往复运动的引导推动构件驱动机构。

    Component mounting method
    7.
    发明授权
    Component mounting method 有权
    组件安装方法

    公开(公告)号：US07437818B2

    公开(公告)日：2008-10-21

    申请号：US10564275

    申请日：2004-08-25

    申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

    发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

    IPC分类号： H05K3/30

    CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

    摘要： A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

    摘要翻译： 一种用于将多个部件安装在板上的部件安装装置和方法。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。

    Propylene polymer, and resin composition and molded product thereof
    8.
    发明授权
    Propylene polymer, and resin composition and molded product thereof 有权
    丙烯聚合物，树脂组合物及其成型体

    公开(公告)号：US07320950B2

    公开(公告)日：2008-01-22

    申请号：US11588208

    申请日：2006-10-27

    申请人： Takuji Okamoto ,  Takashi Kashiwamura ,  Noriyuki Tani ,  Yutaka Minami ,  Masami Kanamaru ,  Koji Kakigami

    发明人： Takuji Okamoto ,  Takashi Kashiwamura ,  Noriyuki Tani ,  Yutaka Minami ,  Masami Kanamaru ,  Koji Kakigami

    IPC分类号： C08F4/6392 ,  C08F4/642

    CPC分类号： C08F10/06 ,  C08F4/65908 ,  C08F4/65912 ,  C08F110/06 ,  C08F210/06 ,  Y10S526/943 ,  C08F4/65927 ,  C08F2500/20 ,  C08F2500/15 ,  C08F2500/03 ,  C08F2500/17 ,  C08F2500/21 ,  C08F210/16

    摘要： The propylene polymer of the present invention satisfies (1) a 25° C. hexane soluble content (H25) of 0-80 wt %; and (2) either no melting temperature (Tm) measurable by differential scanning calorimetry (DSC), or a melting temperature (Tm) satisfying, if measurable by DSC, the following relationship: ΔH≧3×(Tm−120) wherein ΔH is a melting endotherm (J/g). The propylene homopolymer of the present invention satisfies (1) a meso pentad fraction (mmmm) of 30-60 mol %; (2) a racemic pentad fraction (rrrr) satisfying the following relationship: [rrrr/(1−mmmm)]≦0.1; (3) a fraction (W25) eluted at a temperatures up to 25° C. by temperature-programmed chromatography, of from 20-100 wt %; and, (4) a pentad fraction (rmrm) of more than 2.5 mol %. The propylene copolymer of the present invention satisfies (1) a stereoregularity index (P) of 55-90 mol % as determined by 13C-NMR measurement; and (2) a fraction (W25) eluted at a temperatures up to 25° C. by temperature-programmed chromatography, of from 20-100 wt %.

    摘要翻译： 本发明的丙烯聚合物满足（1）0-80重量％的25℃的己烷可溶物含量（H25）; 和（2）通过差示扫描量热法（DSC）测量的熔融温度（Tm）或通过DSC测量的熔融温度（Tm）不能满足以下关系：DeltaH> = 3x（Tm-120），其中DeltaH为 熔融吸热（J / g）。 本发明的丙烯均聚物满足（1）30-60摩尔％的内消旋五单元组分（mmmm）; （2）满足以下关系的外消旋五单元组分（rrrr）：[rrrr /（1-mmmm）] <= 0.1; （3）通过温度程序层析在温度高达25℃下洗脱的级分（W25）为20-100重量％; 和（4）大于2.5摩尔％的五单元组分（rmrm）。 本发明的丙烯共聚物满足（1）通过13 C-NMR测定测定的立构规整性指数（P）为55〜90摩尔％ 和（2）通过温度程序化色谱在温度高达25℃下洗脱的级分（W25）为20-100重量％。

    Substrate transfer apparatus for component mounting machine
    9.
    发明授权
    Substrate transfer apparatus for component mounting machine 失效
    元件安装机基板输送装置

    公开(公告)号：US07318516B2

    公开(公告)日：2008-01-15

    申请号：US10521815

    申请日：2003-08-04

    申请人： Noriyuki Tani ,  Noboru Furuta

    发明人： Noriyuki Tani ,  Noboru Furuta

    IPC分类号： H05K13/00

    CPC分类号： H05K13/0061

    摘要： A mounting-waiting process for making a substrate to be transferred into a mounting process wait before the mounting process; and a substrate discharge-waiting process for making the substrate transferred from the mounting process wait before the following process are provided. When transfer of an unmounted substrate into the mounting process and transfer of a mounted substrate from the mounting process to the substrate discharge-waiting process are performed simultaneously, it is detected, by a substrate-arrival detecting sensor for detecting the mounted substrate transferred to the substrate discharge-waiting process and a substrate-continuity detecting sensor for detecting the unmounted substrate continuously transferred following to the mounted substrate, that a plurality of substrates have been transferred into the discharge-waiting process continuously.

    摘要翻译： 用于使衬底转移到安装过程中的安装等待过程在安装过程之前等待; 以及用于使从安装过程转移的衬底的衬底放电等待处理在提供以下处理之前等待。 当将未安装的基板转移到安装过程中并且将安装的基板从安装过程传送到基板放电等待处理时，通过基板到达检测传感器检测被传送到基板的安装基板 基板放电等待处理和基板连续性检测传感器，用于检测在安装的基板之后连续转印的未安装的基板，多个基板已经被连续转移到放电等待处理中。