公开(公告)号：US20240224815A1

公开(公告)日：2024-07-04

申请号：US18392467

申请日：2023-12-21

Applicant: Melexis Technologies SA

Inventor： Guido DUPONT ,  Daniel ROSENFELD ,  Lionel TOMBEZ ,  Appo VAN DER WIEL ,  Gael CLOSE

IPC: H10N52/80 ,  G01R33/00 ,  G01R33/07 ,  H10N50/80 ,  H10N52/00 ,  H10N52/01 ,  H10N59/00

CPC classification number: H10N52/80 ,  G01R33/0011 ,  G01R33/07 ,  H10N50/80 ,  H10N52/01 ,  H10N52/101 ,  H10N59/00

Abstract: A semiconductor device includes a semiconductor substrate, having an excitation circuit for applying an excitation signal, and a soft-magnetic component for guiding magnetic flux lines. The soft-magnetic component is electrically connected to the excitation by at least two electrical contacts in the form of back contacts or side contacts. The substrate further includes at least one electromagnetic transducer operatively connected to the soft-magnetic component. The excitation circuit includes a modulator for providing a modulated signal to the soft-magnetic component to modulate its magnetic permeability. The substrate further has a demodulator configured to demodulate signals obtained from the at least one electromagnetic transducer.

公开(公告)号：US11982547B2

公开(公告)日：2024-05-14

申请号：US18162263

申请日：2023-01-31

Applicant: Melexis Technologies SA

Inventor： Gael Close ,  Eric Lahaye ,  Lionel Tombez

IPC: G01D5/14 ,  G01D5/24 ,  G01D5/244 ,  G01P3/44

CPC classification number: G01D5/145 ,  G01D5/24438 ,  G01P3/44

Abstract: Method of determining a position of a sensor device relative to a magnetic source, includes: a) determining a first and a second magnetic field component at a first sensor location; b) determining a third and a fourth magnetic field component at a second sensor location; c) determining a first difference of the first and third component, and determining a second difference of the second and fourth component, and determining a first angle based on a ratio of the first and second difference; d) determining a first sum of the first and third component, and determining a second sum of the second and fourth component; e) determining a second angle based on a ratio of said first and second sum; f) comparing the first and second angle to detect error.

公开(公告)号：US20240003940A1

公开(公告)日：2024-01-04

申请号：US18467942

申请日：2023-09-15

Applicant: Melexis Technologies SA

Inventor： Lucian BARBUT ,  Simon HOUIS ,  Lionel TOMBEZ ,  Tim VANGERVEN

IPC: G01R15/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: G01R15/202 ,  G01R15/205 ,  H05K2201/10151 ,  H05K1/181 ,  H05K1/0213

Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.

公开(公告)号：US20230422632A1

公开(公告)日：2023-12-28

申请号：US18461923

申请日：2023-09-06

Applicant: Melexis Technologies SA

Inventor： Appo VAN DER WIEL ,  Yves BIDAUX ,  Lionel TOMBEZ

IPC: H10N52/00 ,  G01R33/07 ,  H10N50/80

CPC classification number: H10N52/101 ,  G01R33/072 ,  H10N50/80

Abstract: A method of producing a semiconductor substrate comprising at least one integrated magnetic flux concentrator, comprising the steps of: a) providing a semiconductor substrate having an upper surface; b) making at least one cavity in said upper surface; c) depositing one or more layers of one or more materials, including sputtering at least one layer of a soft magnetic material; d) removing substantially all of the soft magnetic material that is situated outside of the at least one cavity, while leaving at least a portion of the soft magnetic material that is inside said at least one cavity. A semiconductor substrate comprising at least one integrated magnetic flux concentrator. A sensor device or a sensor system, a current sensor device or system, a position sensor device or system, a proximity sensor device or system, an integrated transformer device or system.

公开(公告)号：US11846687B2

公开(公告)日：2023-12-19

申请号：US18147170

申请日：2022-12-28

Applicant: Melexis Technologies SA

Inventor： Nicolas Dupre ,  Yves Bidaux

IPC: G01R33/07 ,  G01R33/022 ,  G01R33/00

CPC classification number: G01R33/022 ,  G01R33/0082 ,  G01R33/07

Abstract: A method of determining a gradient of a magnetic field, includes the steps of: biasing a first/second magnetic sensor with a first/second biasing signal; measuring and amplifying a first/second magnetic sensor signal; measuring a temperature and/or a stress difference; adjusting at least one of: the second biasing signal, the second amplifier gain, the amplified and digitized second sensor value using a predefined function f(T) or f(T, ΔΣ) or f(ΔΣ) of the measured temperature and/or the measured differential stress before determining a difference between the first/second signal/value derived from the first/second sensor signal. A magnetic sensor device is configured for performing this method, as well as a current sensor device, and a position sensor device.

公开(公告)号：US20230371401A1

公开(公告)日：2023-11-16

申请号：US18351797

申请日：2023-07-13

Applicant: Melexis Technologies SA

Inventor： Arnaud LAVILLE ,  Eric LAHAYE ,  Jian CHEN

IPC: H10N52/80 ,  G01R33/07 ,  H01L23/495 ,  H01L25/065 ,  H10N52/00

CPC classification number: H10N52/80 ,  G01R33/07 ,  H01L23/49541 ,  H01L23/49575 ,  H01L25/0657 ,  H10N52/101

Abstract: A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.

公开(公告)号：US11815533B2

公开(公告)日：2023-11-14

申请号：US17479181

申请日：2021-09-20

Applicant: Melexis Technologies SA

Inventor： Simon Houis

IPC: G01R19/00 ,  G01R15/14 ,  G01R33/022

CPC classification number: G01R19/0007 ,  G01R15/148 ,  G01R33/022

Abstract: A current sensor system for accurately measuring an AC electrical current having frequencies up to 2 kHz, the system comprising: an electrical conductor (e.g. busbar) for conducting said AC current thereby creating a first magnetic field; a magnetic sensor device for measuring a magnetic field component or gradient; an object (e.g. a metal plate) having an electrically conductive surface arranged in the vicinity of said conductor for allowing eddy currents to flow in said surface, thereby creating a second magnetic field which is superimposed with the first magnetic field; wherein the magnetic sensor device is configured for determining the current as a signal or value proportional to the measured component or gradient. The metal plate may have an opening. The current sensor system may further comprise a shielding.

公开(公告)号：US11796609B2

公开(公告)日：2023-10-24

申请号：US17506098

申请日：2021-10-20

Applicant: Melexis Technologies SA

Inventor： Yves Bidaux ,  Lionel Tombez

IPC: G01R33/07 ,  H10N52/01 ,  H10N52/80 ,  H10N52/00

CPC classification number: G01R33/07 ,  H10N52/01 ,  H10N52/101 ,  H10N52/80

Abstract: An integrated sensor device includes: a semiconductor substrate comprising a horizontal Hall element, and an integrated magnetic flux concentrator located substantially above said horizontal Hall element, wherein the first magnetic flux concentrator has a shape with a geometric center which is aligned with a geometric centre of the horizontal Hall element; and wherein the shape has a height H and a transversal dimension D, wherein H≥30 μm and/or wherein (H/D)≥25%. The integrated magnetic flux concentrator may be partially incorporated in the “interconnection stack”. A method is provided for producing such an integrated sensor device.

公开(公告)号：US11789092B2

公开(公告)日：2023-10-17

申请号：US17837456

申请日：2022-06-10

Applicant: Melexis Technologies SA

Inventor： Zsombor Lazar ,  Mathieu Poezart ,  Lionel Tombez

IPC: G01R33/00 ,  G01R33/07

CPC classification number: G01R33/0029 ,  G01R33/077

Abstract: A method of magnetic sensing uses at least two magnetic sensing elements including a first and a second magnetic sensor element. The method includes: a) measuring in a first configuration a combination of the first and second signal obtained from both sensors; b) measuring in a second configuration an individual signal obtained from the first sensor only; c) testing a consistency of the combined signal and the individual signal, or testing a consistency of signals derived therefrom, in order to detect an error. A sensor device is configured for performing this method. A sensor system includes the sensor device and optionally a second processor connected thereto.

公开(公告)号：US11698394B2

公开(公告)日：2023-07-11

申请号：US16826869

申请日：2020-03-23

Applicant: Melexis Technologies SA

Inventor： Tim Vangerven ,  Appolonius Jacobus Van Der Wiel

IPC: H01L21/768 ,  H01L23/522 ,  G01R19/00 ,  G01R15/20 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/00

CPC classification number: G01R19/0092 ,  G01R15/202 ,  H01L21/4825 ,  H01L21/565 ,  H01L21/76898 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247

Abstract: A current sensor is described comprising an integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad and a housing comprising material embedding the integrated circuit arranged for allowing electric connection to the at least two contact pads of the active side of the integrated circuit. The housing comprises at least one conductive via disposed outside the integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the integrated circuit.