公开(公告)号：US20020020343A1

公开(公告)日：2002-02-21

申请号：US09765088

申请日：2001-01-17

Inventor： Robert G. Nothum, Sr. ,  Robert G. Nothum, Jr.

IPC: B05C003/00

CPC classification number: A23P20/17 ,  A23P2020/251

Abstract: A convertible, combination batter-mixer and -applicator machine combines mixing and applying functions in one machine as well as affords conversion among at least three modes of use. In a first mode, the batter is preferably handled by mixing up one batch at a time from materials whose input quantities are specified in terms of defined weight-ratios, and then the batch is used up completely until depleted. In a second mode, the batter is preferably handled by mixing up one batch at a time from materials whose input quantities are adjusted in order to meet a defined-viscosity, and then the batch is used up completely until depleted. The third mode involves re-circulating the batter stock and calls for continuous re-stocking of batter by mixing in the input materials at varying intervals to the existing stock and in input quantities that are adjusted in order to meet the defined-viscosity.

Abstract translation: 可转换，组合式电动搅拌机和应用机将一台机器中的混合和应用功能结合在一起，并提供至少三种使用模式之间的转换。 在第一模式中，面糊最好通过一次混合一批批次来处理，该材料的输入量是按照规定的重量比来指定的，然后批量完全用尽，直到耗尽。 在第二模式中，面糊最好通过一次混合一批批次来处理其输入量被调整以满足定义粘度的材料，然后该批次被完全用尽直到耗尽。 第三种模式包括重新循环面糊原料，并要求通过在输入材料中以不同的间隔将现有原料和输入量混合在一起进行连续重新放料，以便满足定义的粘度。

公开(公告)号：US20010017105A1

公开(公告)日：2001-08-30

申请号：US09791841

申请日：2001-02-26

Applicant: ELECTROPLATING ENGINEERS OF JAPAN LIMITED

Inventor： Hirofumi Ishida ,  Yoshiyuki Harima

IPC: B05C003/00

CPC classification number: C25D17/001 ,  B05C3/18

Abstract: The present invention provides a technique for removing air remaining on the peripheral edge of a surface to be plated in a conventional wafer plating apparatus, and to provide a wafer plating apparatus capable of performing a more uniform plating up to the peripheral edge of the surface to be plated, and which is further capable of performing plating even with respect to a wafer coated with a seed metal. This wafer plating apparatus includes a wafer clamp 6 for holding a wafer 4, a wafer support member 7 for supporting the periphery of the surface 5 to be plated of the wafer 4, and a plating tank 2 for circulating a plating solution while making the plating solution overflow from an upper opening of the tank. The wafer plating apparatus is arranged so as to perform plating, while the surface 5 to be plated is laid face down, being in contact with the surface of the plating solution, in a state in which the wafer 4 is clamped by the wafer clamp 6 and the wafer support member 7. In this wafer plating apparatus, the wafer support member 7 is equipped with air-vent holes 12 for discharging air remaining on the peripheral edge of the surface 5 to be plated while the surface of the plating solution and the wafer 4 are made contact with each other.

Abstract translation: 本发明提供了一种用于去除传统晶片电镀装置中待镀表面的周缘残留的空气的技术，并且提供了能够对表面的周边进行更均匀的电镀的晶片电镀装置， 并且即使对于涂覆有种子金属的晶片也能进行电镀。 该晶片电镀装置包括用于保持晶片4的晶片夹具6，用于支撑晶片4的待镀表面5的周边的晶片支撑部件7以及用于使电镀液循环的镀槽2 溶液从罐的上部开口溢出。 晶片电镀装置被布置成在晶片4被晶片夹具6夹紧的状态下进行电镀，同时将待镀表面5面向下放置在与电镀液表面接触的状态 在该晶片电镀装置中，晶片支撑部件7配备有排气孔12，用于排出剩余在被镀表面5的周缘上的空气，同时电镀液的表面和 晶片4彼此接触。

公开(公告)号：US20040258848A1

公开(公告)日：2004-12-23

申请号：US10850372

申请日：2004-05-21

Inventor： Akira Fukunaga ,  Daisuke Takagi ,  Satoshi Morikami

IPC: H01L021/00 ,  B05C003/00 ,  B05D001/18

CPC classification number: H01L21/67028 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1675 ,  C23C18/1676 ,  C23C18/1678 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/50

Abstract: A method for processing a substrate having a metal layer formed on a surface of the substrate is set forth. The method first preprocesses a surface of the metal layer, deposits a protective film selectively on a surface of the metal layer by an electroless plating process, cleans the substrate after depositing the protective film, and dries the substrate after cleaning. These processes are repeated a plurality of times to process a plurality of substrate. The deposition rate in the deposition process is 10null600 null/min, and a variance of deposition rate for the plurality of substrate is controlled within null10%.

Abstract translation: 阐述了一种用于处理在衬底的表面上形成有金属层的衬底的方法。 该方法首先预处理金属层的表面，通过无电解电镀工艺在金属层的表面上选择性地沉积保护膜，在沉积保护膜之后清洁基板，并在清洁之后干燥基板。 这些处理重复多次以处理多个基板。 沉积过程中的沉积速率为10〜600 / min，多个基板的沉积速率变化控制在±10％以内。

公开(公告)号：US20040241336A1

公开(公告)日：2004-12-02

申请号：US10490175

申请日：2004-03-19

Inventor： Rolf Brisberger

IPC: B05C003/00

CPC classification number: C23C2/14

Abstract: The invention concerns a method and a device for coating the surface of elongated metal products (1) in particular strips or wires, by applying a metal coating material (2), the product (1) requiring to be coated being continuously passed through a bath (3) containing a molten liquid coating material (2). The invention aims at enhancing the productivity of such a coating device. Therefor, the inventive method consists in: a) measuring the thickness (dIst) of the coating material layer (2) applied on the product (1) after it has passed in the bath (3); b) comparing the measured thickness (dIst) with a predefined value of the layer thickness (dsoll) and in determining the difference (null) between the two values: and, c) influencing or modifying at least one parameter (P) of the coating process on the basis of the determined difference (null) so as to be closer to the measured value (dIst) of the predefined value (dsoll).

Abstract translation: 本发明涉及一种用于通过涂覆金属涂层材料（2）涂覆细长金属产品（1）表面，特别是条或电线的方法和装置，需要涂覆的产品（1）连续通过浴 （3），其包含熔融液体涂料（2）。 本发明旨在提高这种涂布装置的生产率。 因此，本发明的方法包括：a）测量在其通过浴（3）之后施加在产品（1）上的涂料层（2）的厚度（dIst）; b）将测量的厚度（dIst）与层厚度（dsol1）的预定值进行比较并确定两个值之间的差值（delta）：和c）影响或改变涂层的至少一个参数（P） 根据确定的差（Delta）进行处理，以便更接近于预定值（dsol1）的测量值（dIst）。

公开(公告)号：US20040200410A1

公开(公告)日：2004-10-14

申请号：US10821587

申请日：2004-04-09

Inventor： William S. Shadrach III

IPC: B05C003/00

CPC classification number: A47K10/3818 ,  A47K2010/3273

Abstract: A dispenser to dispense towels selectively treated with a fluid, includes a compartment having an open upper end and containing at least one dispensable towel therein. A removable cover is disposable on the compartment to form an enclosure with the compartment. A towel dispensing conduit extends through the cover to a top opening of the cover, the conduit defining a path through which the dispensable towel is extracted from the compartment and dispensed from the top opening of the cover. A fluid application assembly is associated with the removable cover. The fluid application assembly includes a fluid reservoir, oriented over the compartment when the cover is disposed on the compartment, and being configured to receive and store the fluid therein; and a fluid applicator, in fluid communication with the reservoir and being selectively operable by a user to selectively apply the fluid to the dispensable towel as the towel is dispensed from the dispenser.

Abstract translation: 用于分配用流体选择性处理的毛巾的分配器包括具有敞开的上端并在其中容纳至少一个可分发毛巾的隔室。 可移除的盖子是一次性的在隔室上形成与隔间的外壳。 毛巾分配导管延伸穿过盖子到盖的顶部开口，导管限定了一个路径，可分发毛巾通过该路径从隔室中提取并从盖子的顶部开口分配。 流体应用组件与可移除盖相关联。 所述流体施加组件包括流体储存器，所述流体储存器在所述盖被设置在所述隔间上时定向在所述隔室上方，并且被配置为在其中接收和储存流体; 以及流体施加器，其与储存器流体连通，并且当毛巾从分配器分配时，可由用户选择性地操作以选择性地将流体施加到可分配的毛巾。

公开(公告)号：US20040194698A1

公开(公告)日：2004-10-07

申请号：US10481448

申请日：2004-05-19

Inventor： Akihisa Hongo ,  Naoki Matsuda ,  Xinming Wang

IPC: B05C003/00 ,  B05C019/02

CPC classification number: C25D17/001 ,  C23C18/1617 ,  C23C18/1628 ,  C23C18/1676 ,  C23C18/50 ,  H01L21/288

Abstract: There is provided a plating apparatus which can keep a plating solution always in its optimal condition while minimizing, the amount of plating solution used, and which can easily form a uniform plated film on the plating surface of a workpiece. The plating apparatus includes: a plating solution supply system (70) for constantly circulating a plating solution while heating the plating solution in a circulation tank (80) provided with a heating apparatus (78a), and supplying a predetermined amount of plating solution to a plating treatment section (24) when carrying out plating treatment; a plating solution recovery system (72) for recovering the plating solution after the plating treatment in the plating treatment section (24), heating the plating solution and returning the heated plating solution to the circulation tank (80); and a plating solution replenishment system (74) for replenishing the circulation tank (80) with a fresh plating solution or a plating solution component.

Abstract translation: 提供一种电镀设备，其可以使电镀液始终处于最佳状态，同时最小化所用电镀液的量，并且可以在工件的电镀表面上容易地形成均匀的镀膜。 电镀装置包括：电镀液供给系统（70），用于在加热设置有加热装置（78a）的循环罐（80）的同时加热电镀液，不断循环电镀液，并将规定量的电镀液供给到 电镀处理部（24）进行电镀处理时; 电镀液回收系统（72），用于在所述电镀处理部（24）中回收所述电镀处理后的所述电镀液，加热所述电镀液并将所述被加热的电镀液返回到所述循环罐（80）。 以及用于用新鲜电镀液或电镀液成分补充循环罐（80）的电镀液补充系统（74）。

公开(公告)号：US20040177808A1

公开(公告)日：2004-09-16

申请号：US10482635

申请日：2003-12-24

Inventor： Daniel Plaetzer ,  Wilfried Plaetzer ,  Ernst-Werner Schmidt ,  Roman Lieutenant

IPC: B05C003/00 ,  B05C019/02

CPC classification number: C23C2/003 ,  C23C2/22 ,  F16C17/02 ,  F16C33/043 ,  F16C33/24

Abstract: The coating device (10) for coating a metal band (12,12null) in a melted metal mass (14) comprises a shaft (16,18) rotatably supported in the melted metal mass (14) by a slide bearing (261, 262), for guiding the metal band (12). The slide bearing (261, 262) is formed by a bearing housing (32) and an open bearing shell (34) held therein, with two bearing surfaces (36). Between the two bearing surfaces (36), the bearing shell (34) comprises a deformation zone (40) with a deformation element (44). With high radial forces of the shaft occurring, the two bearing shell halves (381, 382) are slightly spread. The flexible deformation zone ensures that the two bearing shell halves remain interconnected and cannot break in this area.

Abstract translation: 用于在熔融的金属块（14）中涂覆金属带（12,12'）的涂覆装置（10）包括通过滑动轴承（261）可旋转地支撑在熔融的金属块（14）中的轴（16,18） 262），用于引导金属带（12）。 滑动轴承（261,262）由轴承壳体（32）和保持在其中的开放轴承壳体（34）形成，具有两个轴承表面（36）。 在两个轴承表面（36）之间，轴承壳（34）包括具有变形元件（44）的变形区（40）。 随着轴的高径向力发生，两个轴承半壳（381,382）略微展开。 灵活的变形区确保两个轴承半壳保持互连，并且不能在该区域断裂。

公开(公告)号：US20040086648A1

公开(公告)日：2004-05-06

申请号：US10460609

申请日：2003-06-11

Inventor： Xiangyang Zhou ,  Zhuang Fei Zhou ,  Serguei N. Lvov ,  Digby D. MacDonald

IPC: B05D003/02 ,  B05C003/00 ,  B05C011/00

CPC classification number: C23C18/06 ,  C23C18/02 ,  C23C18/1216 ,  C23C18/1241

Abstract: A metal oxide layer can be deposited onto metallic or ceramic surfaces of a structure in situ, by exposing the surfaces to a precursor solution at an elevated temperature. The precursor solution contains: an organometallic, an oxidant, a surfactant, a chelating agent and water. The precursor solution is injected into the structure and maintained at a specific temperature, pH level and pressure for a predetermined period of time. The resulting in situ metal oxide layer is permanently bonded to the surface structure and does require post deposition heat treatment.

Abstract translation: 通过在高温下将表面暴露于前体溶液，金属氧化物层可以原位沉积在结构的金属或陶瓷表面上。 前体溶液含有：有机金属，氧化剂，表面活性剂，螯合剂和水。 将前体溶液注入结构中并保持在特定温度，pH水平和压力下一段预定的时间。 所得到的原位金属氧化物层永久地结合到表面结构并且需要后沉积热处理。

公开(公告)号：US20040055535A1

公开(公告)日：2004-03-25

申请号：US10247835

申请日：2002-09-19

Applicant: Xerox Corporation

Inventor： Man Kit Yip

IPC: B05C003/00

CPC classification number: G03G5/0525 ,  B05C3/02

Abstract: A diptank applies coating solution to devices that are dipped therein. A reservoir tank contains a reservoir of coating solution. The diptank forms a coating solution overflow return that flows to the reservoir by means of a conduit and a self-adjusting return line. The self-adjusting return line comprises a plastic tubing with an upper portion, a central portion and a lower portion. The upper portion is coupled to the conduit. The tubing central portion is flexible and corrugated and arranged to extend and compress in its length. The lower portion is supported by an attached buoy that floats on the surface of the reservoir. The lower portion defines an outlet that discharges the coating solution overflow return to the reservoir. As a result, the coating solution overflow return is discharged to the reservoir at a fixed vertical distance or level with respect to the surface of the reservoir.

Abstract translation: 一个diptank将涂层溶液施加到浸入其中的装置上。 储罐包含涂层溶液储存器。 通过管道和自我调整的返回管线，该管道形成了涂覆溶液溢流回流，该溢流回流流入储存器。 自调整返回线包括具有上部，中心部分和下部的塑料管。 上部连接到导管。 管道中心部分是柔性的并且是波纹状的并且被布置成在其长度上延伸和压缩。 下部由浮在浮筒上的浮标支撑。 下部限定了将涂布液溢出返回到储存器的出口。 结果，涂层溶液溢流返回以相对于储存器表面固定的垂直距离或高度排放到储存器。

公开(公告)号：US20030127048A1

公开(公告)日：2003-07-10

申请号：US09436988

申请日：1999-11-09

Inventor： SATOSHI KOKUBO ,  NOBUYUKI ISHIKAWA

IPC: B05C003/00

CPC classification number: B05C5/0254 ,  G02F1/133516 ,  G03F7/0007 ,  G03F7/16 ,  Y10S118/02

Abstract: A coating apparatus has a paint supply device, a mouthpiece for dispensing a paint supplied from the paint supply device, and a stage for holding a coated object. A 10-point average roughness Rz of a surface of the mouthpiece facing the coated object is not more than 1.0 nullm.

Abstract translation: 涂布装置具有涂料供给装置，用于分配从涂料供应装置供应的涂料的接口管，以及用于保持被涂物体的台架。 面对被涂物体的接口的表面的10点平均粗糙度Rz不大于1.0μm。