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    Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid
    51.
    发明授权
    Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid 有权

    公开(公告)号：US10935325B2

    公开(公告)日：2021-03-02

    申请号：US16352633

    申请日：2019-03-13

    Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

    Inventor： Shahar Ben-Menahem ,  Tzu-Yuan Lin ,  Michael Nikkhoo

    IPC: F28D15/00 ,  F28D15/02 ,  H01L23/367 ,  H01L23/427

    Abstract: A vapor-chamber that includes a porous microstructure sheet with varying surface energy across different regions to optimize utilization of a working fluid. Modulating the surface energy of the porous microstructure sheet can minimize the amount of the working fluid that becomes trapped in the condenser region(s) and maximize an aggregate thin-film evaporation area of the working fluid in the evaporator region(s). The condenser region of the vapor-chamber is treated so that the internal surfaces have low surface energy. For example, the treatment may cause the condenser region to become hydrophobic to minimize the amount of fluid that becomes trapped in the condenser. The evaporator region is treated so that the internal surfaces have high surface energy. For example, the treatment may cause the evaporator region to become hydrophilic to induce the formation of large numbers of robust (e.g., dry-out resistant) thin-film evaporation sites.

    Loop heat pipe
    53.
    发明授权
    Loop heat pipe 有权

    公开(公告)号：US10859319B2

    公开(公告)日：2020-12-08

    申请号：US16251692

    申请日：2019-01-18

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Yoshihiro Machida

    IPC: F28D15/00 ,  F28D15/02 ,  F28D15/04 ,  H05K7/20

    Abstract: A loop heat pipe includes an evaporator to vaporize a working fluid, a condenser to liquefy the working fluid, a liquid pipe to connect the evaporator and the condenser, a porous body provided inside a flow passage in which the working fluid or vapor thereof flows, and a vapor pipe to connect the evaporator and the condenser and form a loop-shaped passage together with the liquid pipe. The porous body includes a metal layer including a first bottomed hole that caves in from a first surface thereof, a second bottomed hole that caves in from a second surface thereof, opposite to the first surface, and a pore formed by and partially communicating the first and second bottomed holes. An inner wall surface of each of the first and second bottomed holes formed in the porous body has a concave shape formed by a curved surface.

    HEATED SEPARATION ASSEMBLY
    54.
    发明申请
    HEATED SEPARATION ASSEMBLY 审中-公开

    公开(公告)号：US20200340347A1

    公开(公告)日：2020-10-29

    申请号：US16396851

    申请日：2019-04-29

    Applicant: WORTHINGTON INDUSTRIES, INC.

    Inventor： NICHOLAS LEE JENSEN ,  SPENCER SCOTT BRUNER ,  DEREK RUPP

    IPC: E21B43/34 ,  F28D15/00 ,  B01D17/02 ,  B01D17/04 ,  B01D19/00

    Abstract: Provided is an indirect heated separation assembly that includes a vessel having a heating section and a separation section, a plate separating the heating section from the separation section, the plate being configured to be heated by a heating fluid in the heating section to provide indirect heat to the separation section, and a coil assembly disposed in the heating section, the coil assembly including an inlet configured to receive a process fluid and an outlet in communication with an inlet of the separation section to direct the process fluid after heating to the separation section.

    Boiling cooling device and boiling cooling system
    55.
    发明授权
    Boiling cooling device and boiling cooling system 有权

    公开(公告)号：US10816273B2

    公开(公告)日：2020-10-27

    申请号：US15781568

    申请日：2016-01-08

    Applicant: Mitsubishi Electric Corporation

    Inventor： Shigetoshi Ipposhi ,  Masaru Shinozaki ,  Yugo Asai

    IPC: F28D15/00

    Abstract: A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump 11; and a gas-liquid separator 15 to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump.

    Vehicle temperature control system
    56.
    发明授权
    Vehicle temperature control system 有权

    公开(公告)号：US10814716B2

    公开(公告)日：2020-10-27

    申请号：US15960746

    申请日：2018-04-24

    Applicant: Eberspächer Climate Control Systems GmbH & Co. KG

    Inventor： Günter Eberspach ,  Michael Humburg ,  Hans Jensen

    IPC: B60K11/02 ,  B60H1/00 ,  B60H1/22 ,  B60H1/14 ,  B60L58/24 ,  B60H1/03 ,  F01P3/18 ,  F01P3/20 ,  F28D15/00 ,  F28F27/02 ,  F28D21/00

    Abstract: A vehicle temperature control system, especially for a hybrid vehicle, includes a first heat transfer medium circuit (12) including an internal combustion engine (16), a heater (18) and one or preferably a plurality of heat transfer areas (32, 34, 36) for transferring heat between a first heat transfer medium, circulating in the first heat transfer medium circuit (12), and a first group of system areas to be thermally treated. A second heat transfer medium circuit (14) includes a heat one or preferably a plurality of heat transfer areas for the transfer of heat between a second heat transfer medium, circulating in the second heat transfer medium circuit (14), and a second group of system areas (46, 48, 50) to be thermally treated. A heat transfer medium circuit heat exchanger unit (58) transfers heat between the first heat transfer medium and the second heat transfer medium.

    Heat pipe
    57.
    发明授权
    Heat pipe 有权

    公开(公告)号：US10782076B2

    公开(公告)日：2020-09-22

    申请号：US16021380

    申请日：2018-06-28

    Applicant: FURUKAWA ELECTRIC CO., LTD.

    Inventor： Yasumi Sasaki

    IPC: F28D15/00 ,  F28D15/04 ,  H01L23/427 ,  H05K7/20 ,  F28D15/02 ,  F28F1/24 ,  H01L23/367

    Abstract: A heat pipe has a heat receiving portion that is to be thermally connected to a heat generating member so as to absorb heat from the heat generating member. The heat pipe includes a sealed flat container; a wick structure housed inside the flat container; and a working fluid sealed inside the flat container. In at least one cross section of the flat container, the wick structure includes a first wick member and a second wick member disposed vertically, the wick structure also has a first wick part and a second wick part respectively disposed in the lengthwise direction of the flat container, the second wick part having a maximum width that is wider than a maximum width of the first wick part. The second wick part is disposed in the heat receiving portion of the heat pipe.

    PRESSURIZED INFUSION DEVICE AND LIQUID COOLING SYSTEM
    59.
    发明申请
    PRESSURIZED INFUSION DEVICE AND LIQUID COOLING SYSTEM 审中-公开

    公开(公告)号：US20200264679A1

    公开(公告)日：2020-08-20

    申请号：US16866986

    申请日：2020-05-05

    Applicant: COOLER MASTER TECHNOLOGY INC.

    Inventor： Yu-Te WEI

    IPC: G06F1/20 ,  F04B23/02 ,  H01L23/473 ,  F28D20/00 ,  F28D15/00 ,  H05K7/20

    Abstract: A pressurized infusion device and a liquid cooling system are disclosed. The pressurized infusion device includes a liquid storage tank and a pump. The liquid storage tank has a first end and a second end opposite to the first end. The first end has a first connecting structure, and the second end has a second connecting structure. The pump is connected with the first end of the liquid storage tank and has a third connecting structure, a first connecting port, a second connecting port, a third connecting port and a fourth connecting port. The third connecting structure corresponds to the first connecting structure. A pump flow channel from the first connecting port to the second connecting port is formed inside the pump, and a bypass flow channel from the third connecting port to the fourth connecting port is also formed inside the pump.

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