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公开(公告)号：US10819189B2
公开(公告)日：2020-10-27
申请号：US16308876
申请日：2017-03-28
发明人： Masaru Shinozaki , Yugo Asai , Yusuke Kimoto , Hiroyuki Ushifusa , Yoshiaki Kitta , Yoshiyuki Deguchi
摘要： A cooling apparatus includes: an annular internal liquid coolant flow channel that is mounted to a rotary electric machine main body, and in which an internal liquid coolant circulates around an outer circumference of the rotary electric machine main body, and an external liquid coolant passage portion through which an external liquid coolant passes, the external liquid coolant passage portion is connected to the internal liquid coolant flow channel by a connecting portion that is positioned vertically higher than the rotary electric machine main body, and the electric power converting apparatus includes a heat radiating surface that releases heat that is generated in the electric power converting apparatus, the electric power converting apparatus being mounted to the cooling apparatus such that the heat radiating surface and the internal liquid coolant can exchange heat at a position that is vertically lower than the connecting portion.
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公开(公告)号：US11289979B2
公开(公告)日：2022-03-29
申请号：US16496260
申请日：2018-03-05
摘要： Provided is a rotating electric machine. Angles formed by tooth center axes of adjacent teeth are defined as tooth pitch angles. Maximum tooth pitch angles are defined as first tooth pitch angles α1. At least one of tooth pitch angles become smaller as proceeding from the first tooth pitch angles α1 in a clockwise direction and a counterclockwise direction, respectively, and such tooth pitch angles are defined as second tooth pitch angles α3. Cross-sectional areas of second coils, which are arranged in slots each formed between adjacent teeth corresponding to the second tooth pitch angles α3 in a cross-section perpendicular to a rotation axis, is smaller than cross-sectional areas of first coils, which are arranged in slots each formed between adjacent teeth corresponding to the first tooth pitch angles α1 in the cross-section perpendicular to the rotation axis.
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公开(公告)号：US10729040B2
公开(公告)日：2020-07-28
申请号：US15753228
申请日：2016-04-22
发明人： Yugo Asai , Shigetoshi Ipposhi , Masaru Shinozaki , Hiroyuki Higashino , Kazuki Sakata , Masakazu Tani
IPC分类号： H05K7/20 , H01L23/473
摘要： A cooler configured to cool an electronic device includes: a refrigerant inlet portion configured to guide refrigerant from an outside of a casing to an inside of the casing; a refrigerant outlet portion configured to guide the refrigerant from the inside of the casing to the outside of the casing; and a metal member located inside the casing and configured to define a flow path region in which the refrigerant is caused to flow from the refrigerant inlet portion to the refrigerant outlet portion. The metal member includes: a plurality of opening portions configured to cause the refrigerant to pass therethrough; and a capture and reduction portion having such a shape as to capture air bubbles, which are generated through a connection surface between the casing and the electronic device. The air bubbles are reduced through cooling by the refrigerant when the electronic device is cooled.
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公开(公告)号：US10271458B2
公开(公告)日：2019-04-23
申请号：US15559843
申请日：2015-03-25
发明人： Yugo Asai , Shigetoshi Ipposhi , Masaru Shinozaki , Hiroyuki Higashino , Kazuki Sakata , Masakazu Tani
摘要： Provided is a cooling device, a power conversion device, and a cooling system in which bubbles produced by boiling in the cooling device are inhibited from flowing out of the cooling device, and thus, vibration, noise, and damage to pipes and other components can be prevented. A cooling device according to the present invention includes a housing having a hollow interior, the housing having a refrigerant inlet from which refrigerant flows in and a refrigerant outlet from which the refrigerant flows out, and having, in the hollow interior, a refrigerant flow path through which the refrigerant flows, and an opening body provided in the housing, dividing the refrigerant flow path into a first area including a heating surface being at least one of a bottom surface and side surfaces of the housing and heating the refrigerant, and a second area including the refrigerant outlet, and having a plurality of openings.
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公开(公告)号：US12106899B2
公开(公告)日：2024-10-01
申请号：US18283828
申请日：2021-04-01
CPC分类号： H01F7/064 , F25B21/00 , F25B2321/0022 , F25B2321/0023
摘要： A magnetic field application device applying a magnetic field to a magnetocaloric material includes: a magnetic field generating component; a first yoke connected to both poles of the magnetic field generating component; and a second yoke movably disposed between a first position and a second position. A first closed magnetic circuit formed by the magnetic field generating component and the first yoke passes through a magnetic field application region in which the magnetocaloric material is accommodated. A second closed magnetic circuit formed by the magnetic field generating component, the first yoke, and the second yoke bypasses the magnetic field application region. Magnetic resistance of the second closed magnetic circuit when the second yoke is located at the second position is smaller than the magnetic resistance of the second closed magnetic circuit when the second yoke is located at the first position.
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公开(公告)号：US09863710B2
公开(公告)日：2018-01-09
申请号：US14384900
申请日：2013-05-09
发明人： Koji Kise , Masaru Shinozaki , Masaru Takada , Hajime Sotokawa , Yuichi Ishimaru , Hidemoto Arai
CPC分类号： F28D9/0062 , F24F12/006 , F28D9/0093 , F28D21/0015 , F28F3/086 , Y02B30/563
摘要： A laminated total heat exchange element that includes a plurality of laminated plates, a first spacing member forming a first flow path between the laminated plates, and a second spacing member forming a second flow path between the laminated plates, wherein the first flow path is formed to allow fluid to pass from one side to another side of the laminated total heat exchange element, the second flow path is formed to allow fluid to pass from the another side to the one side of the laminated total heat exchange element, a third flow path, which communicates with the first flow path on the one side and extends substantially parallel to a lamination direction of the laminated plates, is formed, and a fourth flow path, which communicates with the second flow path on the another side and extends substantially parallel to the lamination direction of the laminated plate, is formed.
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公开(公告)号：US10816273B2
公开(公告)日：2020-10-27
申请号：US15781568
申请日：2016-01-08
发明人： Shigetoshi Ipposhi , Masaru Shinozaki , Yugo Asai
IPC分类号： F28D15/00
摘要： A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump 11; and a gas-liquid separator 15 to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump.
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公开(公告)号：US10383262B2
公开(公告)日：2019-08-13
申请号：US15549821
申请日：2015-03-25
发明人： Masaru Shinozaki , Shigetoshi Ipposhi , Hiroyuki Higashino , Yugo Asai , Hiroyuki Yano , Haruyuki Matsuo
摘要： The power conversion device of the invention includes: a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion the cooling unit having in the interior thereof a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion; electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit, excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and a hollow outer case 4 that covers the electronic devices.
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公开(公告)号：US20150047817A1
公开(公告)日：2015-02-19
申请号：US14384900
申请日：2013-05-09
发明人： Koji Kise , Masaru Shinozaki , Masaru Takada , Hajime Sotokawa , Yuichi Ishimaru , Hidemoto Arai
IPC分类号： F28D9/00
CPC分类号： F28D9/0062 , F24F12/006 , F28D9/0093 , F28D21/0015 , F28F3/086 , Y02B30/563
摘要： A laminated total heat exchange element that includes a plurality of laminated plates, a first spacing member forming a first flow path between the laminated plates, and a second spacing member forming a second flow path between the laminated plates, wherein the first flow path is formed to allow fluid to pass from one side to another side of the laminated total heat exchange element, the second flow path is formed to allow fluid to pass from the another side to the one side of the laminated total heat exchange element, a third flow path, which communicates with the first flow path on the one side and extends substantially parallel to a lamination direction of the laminated plates, is formed, and a fourth flow path, which communicates with the second flow path on the another side and extends substantially parallel to the lamination direction of the laminated plate, is formed.
摘要翻译： 一种层叠的全热交换元件，其包括多个层压板，形成在所述层叠板之间的第一流路的第一间隔部件和在所述层叠板之间形成第二流路的第二间隔部件，其中，形成所述第一流路 为了允许流体从层叠的总热交换元件的一侧通过到另一侧，形成第二流动路径以允许流体从层叠的全热交换元件的另一侧流向一侧，第三流动路径 形成有与第一流路连通的第一流路，并且基本上平行于层叠板的层叠方向延伸，第四流路与另一侧的第二流路连通，大致平行于 形成层叠板的层叠方向。
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公开(公告)号：US11348850B2
公开(公告)日：2022-05-31
申请号：US16496645
申请日：2017-03-27
发明人： Hirokazu Takabayashi , Ryosuke Nakagawa , Shigetoshi Ipposhi , Masaru Shinozaki , Hiroyuki Ushifusa
IPC分类号： H01L23/04 , H01L23/049 , F28F3/02 , H02M7/00 , F28F3/04 , F28F3/06 , H01L23/42 , H01L23/473 , H01L23/367 , H01L23/373
摘要： A vehicle power conversion device includes: a housing configured to accommodate an electronic component therein and having an opening; and a cooling device. The cooling device includes a base being a plate-shaped member and heat sinks attached to the base. The base has a groove with refrigerant enclosed. The base has a first main surface to which the electronic component is to be attached, and covers the opening by the first main surface facing an interior of the housing. The heat sinks are joined, at intervals, onto the second main surface of the base.
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