公开(公告)号：US20240032218A1

公开(公告)日：2024-01-25

申请号：US18219779

申请日：2023-07-10

申请人： Yokogawa Electric Corporation

发明人： Tomoyuki Takahashi ,  Yusaku Yoshida ,  Akio Morita ,  Noriaki Kihara ,  Takahiro Kimura

IPC分类号： H05K5/02 ,  H05K5/03

CPC分类号： H05K5/0217 ,  H05K5/03 ,  H04W80/00

摘要： A signal processing device (10) according to the present disclosure includes a housing (161), an input interface (12) configured to receive input of an electrical signal, a converter (13) configured to convert the electrical signal inputted to the input interface (12) into a communication signal according to a communication protocol for wireless communication, and an output interface (14) configured to output the communication signal converted by the converter (13) for wireless communication. The signal processing device (10) includes the housing (61), the input interface (12), the converter (13), and the output interface (14) integrally. The input interface (12) is disposed on a first side (S1) of the housing (161), and the output interface (14) is disposed on a second side (S2) opposite the first side (S1) in the housing (161).

公开(公告)号：US20240032210A1

公开(公告)日：2024-01-25

申请号：US18265581

申请日：2021-12-14

申请人： AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Taiji YANAGIDA ,  Hiroki SHIMODA

IPC分类号： H05K5/00 ,  H05K1/05 ,  H05K1/02 ,  H05K5/03

CPC分类号： H05K5/0069 ,  H05K1/05 ,  H05K1/0212 ,  H05K5/03 ,  H05K2201/06 ,  H05K2201/0206

摘要： Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a result of a current flowing therethrough; a case accommodating the heat-generating components; metal plates connected to connecting portions of the heat-generating components, and each having a heat-dissipating portion exposed to an outside of the case and configured to come into thermal contact with an external heat-dissipation target; insulating films covering a contact surface of the heat-dissipating portion, the contact surface being configured to come into contact with the heat-dissipation target; and a thermal conductive filling member that is in thermal contact with the heat-dissipating portion via the insulating films and disposed between the insulating films and the heat-dissipation target.

公开(公告)号：US20240031460A1

公开(公告)日：2024-01-25

申请号：US18223337

申请日：2023-07-18

申请人： Apple Inc.

发明人： Lee E. Hooton ,  Alexander W. Williams

IPC分类号： H04M1/02 ,  H05K5/03 ,  H05K5/04

CPC分类号： H04M1/0202 ,  H05K5/03 ,  H05K5/04

摘要： Electronic devices are disclosed that include metal members bonded to members including a polymer material via a porous metallic layer. The polymer material may at least partially fill and mechanically interlock with pores of the porous metallic layer to form an interlock region.

公开(公告)号：US20240023265A1

公开(公告)日：2024-01-18

申请号：US18219434

申请日：2023-07-07

申请人： Apple Inc.

发明人： David Pakula ,  Richard Hung Minh Dinh ,  Scott Myers ,  Tang Yew Tan

IPC分类号： H05K7/14 ,  H04M1/02 ,  G06F1/16 ,  H05K5/03 ,  G02B7/02 ,  H05K5/00

CPC分类号： H05K7/14 ,  H04M1/0202 ,  G06F1/1656 ,  G06F1/1637 ,  G06F1/1658 ,  G06F1/1626 ,  H05K5/03 ,  G02B7/02 ,  H05K5/0086 ,  Y10T156/10 ,  Y10T29/49002 ,  H04M1/0266 ,  H04N23/51

摘要： Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.

公开(公告)号：US20240023262A1

公开(公告)日：2024-01-18

申请号：US18113929

申请日：2023-02-24

申请人： Schott AG

发明人： Robert Hettler ,  Wee Kiat Chai ,  Rainer Graf ,  Helena Blümel

IPC分类号： H05K5/03 ,  H05K5/04

CPC分类号： H05K5/03 ,  H05K5/04

摘要： A composite element includes: an outer holder; and an inner component which is held in the outer holder under a compressive stress, the outer holder and the inner component adjoining one another along a contour line which is closed, the contour line including two linear portions and two connecting portions, the two linear portions opposing one another and extending in a straight line, the two connecting portions connecting the two linear portions to form the contour line as closed, at least one of the two connecting portions having an arcuately extending curved region.

公开(公告)号：US20240019907A1

公开(公告)日：2024-01-18

申请号：US18449342

申请日：2023-08-14

申请人： Samsung Electronics Co., Ltd.

发明人： Taehwan KANG ,  Sangsik NA ,  Jungho CHUN

IPC分类号： G06F1/16 ,  H05K5/03

CPC分类号： G06F1/1656 ,  H05K5/03

摘要： An electronic device including at least one impact resistance-reinforcing structure may be disclosed herein. The disclosed electronic device includes: a first plate disposed to face in a first direction; a second plate disposed to face in a second direction opposite to the first direction; and a housing including a side member disposed so as to surround at least a portion of the space between the first and second plates, wherein the housing may include: a first metal material part; a second metal material part spaced apart from the first metal material part; a first reinforcing structure which is formed in the first metal material part and disposed adjacent to an edge portion of the housing; and a non-metal material part which is a structure integrally injection-molded between the first and second metal material parts and connecting the first and second metal material parts, is large enough to cover the first reinforcing structure, and is adhered to the first reinforcing structure. Various other embodiments are possible.

公开(公告)号：US11877411B2

公开(公告)日：2024-01-16

申请号：US17434798

申请日：2020-03-09

申请人： Samsung Electronics Co., Ltd.

发明人： Youngmin Moon ,  Hyeonbeom Kim ,  Jaehyun Bae

IPC分类号： H05K5/03 ,  G06F1/16

CPC分类号： H05K5/03 ,  G06F1/1626

摘要： An electronic device including a rear plate, and the rear plate itself are disclosed. The rear plate covers a rear surface of the electronic device, and includes: a glass plate including a pattern area, the pattern area including a pattern having a designated shape, in at least a partial area of the glass plate, a printed layer disposed on a first surface of the glass plate, a shielding layer stacked with the printed layer, and a coating layer disposed on a second surface of the glass plate opposite to the first surface, wherein the pattern area of the glass plate includes a plurality of processing lines spaced apart from each other.

公开(公告)号：US20240015915A1

公开(公告)日：2024-01-11

申请号：US18372218

申请日：2023-09-25

申请人： BYD COMPANY LIMITED

发明人： Fengchuan YU ,  Xingchun ZHANG ,  Yanjun FAN ,  Qinghui ZENG

IPC分类号： H05K7/14 ,  H02M7/00 ,  H02M7/537 ,  H05K9/00 ,  H05K1/18 ,  H05K5/03 ,  B60R16/023 ,  B60R16/033

CPC分类号： H05K7/1427 ,  H02M7/003 ,  H02M7/537 ,  H05K9/0007 ,  H05K1/181 ,  H05K5/03 ,  B60R16/0239 ,  B60R16/033 ,  H05K2201/10151

摘要： A vehicle controller includes: a box; a control board mounted in the box and including a communication module, a vehicle control module, a charge control module, and a motor control module, and the vehicle control module controlling operations of a vehicle according to signals of the communication module; a driver board mounted in the box, the control board being connected to the driver board, and the motor control module controlling a motor of the vehicle through the driver board; and an on-off switch mounted in the box and connected to the control board, the on-off switch having an input end and an output end, the charge control module controlling on-off of the input end and the output end, the output end being connected to an energy storage member of the vehicle, and the input end being connected to a charging cable of the energy storage member.

公开(公告)号：US11846984B2

公开(公告)日：2023-12-19

申请号：US17809740

申请日：2022-06-29

申请人： Apple Inc.

发明人： Hoon Sik Kim ,  Chang-Chia Huang ,  Christopher D. Jones ,  Masato Kuwabara ,  Nikhil D. Kalyankar ,  Terry C. Shyu ,  Yasmin F. Afsar ,  Paul S. Drzaic

IPC分类号： G06F1/16 ,  H04M1/02 ,  H05K5/03 ,  B32B17/06 ,  B32B7/12

CPC分类号： G06F1/1607 ,  B32B7/12 ,  B32B17/067 ,  G06F1/1643 ,  G06F1/1652 ,  H04M1/0268 ,  H05K5/03 ,  B32B2457/208

摘要： Protective cover layers for electronic devices are described. In an embodiment, an electronic device includes a display panel and a protective cover layer over the display panel. The protective cover layer includes a transparent support substrate and a hardcoat layer covering an exterior facing surface of the transparent support substrate. The display panel may be a flexible display panel and the protective cover layer may flex with the flexible display panel.

公开(公告)号：US11846012B2

公开(公告)日：2023-12-19

申请号：US17562960

申请日：2021-12-27

申请人： Samsung Display Co., Ltd.

发明人： Byung Chul Oh

IPC分类号： C23C14/04 ,  C23C14/20 ,  C23C14/24 ,  G06F1/16 ,  H04M1/02 ,  H05K5/03 ,  H05K5/00

CPC分类号： C23C14/042 ,  C23C14/20 ,  C23C14/24 ,  G06F1/1637 ,  H04M1/02 ,  H04M1/0266 ,  H05K5/03 ,  H04M1/0202 ,  H05K5/0017

摘要： A cover window for a display device and a method of manufacturing the same are provided. The cover window for a display device includes a light-transmitting substrate, a mold layer on at least a part of an edge of the light-transmitting substrate, and having an uneven pattern formed on a surface thereof, an inorganic material pattern layer on the mold layer and exposing a portion of the mold layer, and a print layer on the mold layer and covering the exposed portion of the mold layer.