CIRCUIT STRUCTURE
    2.
    发明申请

    公开(公告)号:US20220248524A1

    公开(公告)日:2022-08-04

    申请号:US17623781

    申请日:2020-06-24

    IPC分类号: H05K1/02 H05K5/00

    摘要: Provided is a circuit structure having a novel structure that allows heat from a heat-generating component to be dissipated more efficiently. A circuit structure includes: a heat-generating component that generates heat when energized; energization bus bars that are connected to connection portions of the heat-generating component; cooling members that are formed separately from the energization bus bars, and are connected to the connection portions of the heat-generating component along with energization bus bars, and the heat-transfer portions that are provided in the cooling members, and are in heat-conductive contact with a heat-dissipating body.

    CIRCUIT ASSEMBLY
    4.
    发明公开
    CIRCUIT ASSEMBLY 审中-公开

    公开(公告)号:US20240249900A1

    公开(公告)日:2024-07-25

    申请号:US18564396

    申请日:2022-06-15

    IPC分类号: H01H45/12 H01H45/04 H05K7/20

    摘要: A circuit assembly includes: a relay; a case that houses the relay; and a bus bar including a fastening part configured to be fastened to a connection part of the relay, and a heat transfer part configured to be in thermally conductive contact with an external heat dissipation target, wherein the relay includes an excitation connector part that is provided on a side surface of the relay, and that is open in a direction opposite to a direction in which the connection part is open, the fastening part of the bus bar protrudes upward from the heat transfer part disposed on a bottom wall side of the case so as to be inclined at an angle larger than 90°, and the excitation connector part of the relay in which the connection part connected to the fastening part of the bus bar is open obliquely upward.

    CIRCUIT ASSEMBLY
    5.
    发明公开
    CIRCUIT ASSEMBLY 审中-公开

    公开(公告)号:US20240032210A1

    公开(公告)日:2024-01-25

    申请号:US18265581

    申请日:2021-12-14

    摘要: Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a result of a current flowing therethrough; a case accommodating the heat-generating components; metal plates connected to connecting portions of the heat-generating components, and each having a heat-dissipating portion exposed to an outside of the case and configured to come into thermal contact with an external heat-dissipation target; insulating films covering a contact surface of the heat-dissipating portion, the contact surface being configured to come into contact with the heat-dissipation target; and a thermal conductive filling member that is in thermal contact with the heat-dissipating portion via the insulating films and disposed between the insulating films and the heat-dissipation target.

    WIRING MODULE AND POWER STORAGE MODULE

    公开(公告)号:US20220410821A1

    公开(公告)日:2022-12-29

    申请号:US17780753

    申请日:2020-11-25

    摘要: A wiring module includes a flexible substrate, a sensor component (temperature sensor), a connecting member (bus bar), and a holding part-equipped relay member, wherein the holding part-equipped relay member includes: a relay member main body including a base part (first main plate) that is to be fixed to the flexible substrate and the bus bar, and a holding part (first holding piece) that is continuous with the first main plate; a pedestal part (housing) that is to be held by the first holding piece so as to be displaceable in a direction toward or away from the first main plate, and that is to be fixed to a position of the flexible substrate where the temperature sensor is mounted; and a biasing member that has elastic force, that has one end held by the first main plate, and that biases the housing in the direction away from the first main plate.

    WIRING MODULE
    7.
    发明申请

    公开(公告)号:US20220263141A1

    公开(公告)日:2022-08-18

    申请号:US17628360

    申请日:2020-07-10

    摘要: A wiring module disposed on a plurality of power storage devices that have electrode terminals, the wiring module including: at least one flexible first substrate that is electrically connected to the electrode terminals; and a flexible second substrate that is electrically connected to the first substrate and a device, wherein a plurality of first voltage detection lines that are electrically connected to the electrode terminals are formed on the first substrate, and the plurality of first voltage detection lines are not lined up in the order of the potentials of the electrode terminals to which the plurality of first voltage detection lines are connected, a plurality of second voltage detection lines that are connected to the plurality of first voltage detection lines are formed on the second substrate, and the second substrate has a connection end portion that is connected to the device.

    TERMINAL MODULE
    8.
    发明申请

    公开(公告)号:US20220013871A1

    公开(公告)日:2022-01-13

    申请号:US17295285

    申请日:2019-11-01

    摘要: A configuration is adopted in which a terminal module includes a voltage detection terminal having a terminal connection part connected to an electrode terminal and a wire connection part connected to a wire, and a protector housing at least part of the voltage detection terminal, with two liquid draining parts each including a first extension part extending downward in the direction of gravity being provided between the terminal connection part and the wire connection part in the voltage detection terminal, and the protector having a housing part housing the liquid draining parts and accumulating liquid that travels along the first extension part.

    TEMPERATURE DETECTION MODULE
    9.
    发明申请

    公开(公告)号:US20190041273A1

    公开(公告)日:2019-02-07

    申请号:US16074523

    申请日:2017-01-23

    摘要: A temperature detection module includes a thermistor configured to detect the temperature of an electric cell, a thermistor electrical wire drawn from the thermistor, a thermistor holding portion configured to hold the thermistor movably in a direction in which the thermistor comes into contact with and separates from the electric cell in a form in which the thermistor is biased to move toward the electric cell, and an electrical wire routing path in which the thermistor electrical wire is routed in one direction. The electrical wire routing path is provided with a holding means for holding a midpoint of the thermistor electrical wire that is drawn from the thermistor and routed along the electrical wire routing path in a form in which a drawing end of the thermistor electrical wire is provided with an excess length portion having a predetermined length in order to allow movement of the thermistor.