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106 条记录 (耗时 0.024 秒)

    Di capacitive embedded metal card
    61.
    发明授权
    Di capacitive embedded metal card 有权

    公开(公告)号：US11710024B2

    公开(公告)日：2023-07-25

    申请号：US17715506

    申请日：2022-04-07

    申请人： CompoSecure, LLC

    发明人： Adam Lowe ,  Michele Logan ,  Dori Skelding ,  Syeda Hussain

    IPC分类号： G06K19/06 ,  G06K19/077 ,  G06K19/02 ,  G06K19/07

    CPC分类号： G06K19/07792 ,  G06K19/02 ,  G06K19/0723 ,  G06K19/07794

    摘要： A transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from an origin on the card periphery to a terminus in the opening. The card has a greater flex resistance than a card having a comparative discontinuity with the terminus and the origin the same distance from a line defined by a first long side of the card periphery in an absence of one or more strengthening features. Strengthening features include a discontinuity wherein one of the terminus or the origin are located relatively closer to the first long side of the card periphery than the other, a plurality of discontinuities wherein fewer than all extend from the card periphery to the opening, a self-supporting, non-metal layer disposed on at least one surface of the card, or one or more ceramic reinforcing tabs surrounding the opening.

    DI metal transaction devices and processes for the manufacture thereof
    62.
    发明授权
    DI metal transaction devices and processes for the manufacture thereof 有权

    公开(公告)号：US11618191B2

    公开(公告)日：2023-04-04

    申请号：US17168382

    申请日：2021-02-05

    申请人： CompoSecure, LLC

    发明人： Adam Lowe ,  John Esau

    IPC分类号： B29C45/14 ,  G06K19/077 ,  H01Q13/10 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  B22D19/00 ,  B29C45/17 ,  B29L17/00

    摘要： A transaction device includes a metal layer with one or more discontinuities in the metal layer. Each discontinuity comprises a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. A transponder chip module is disposed in the opening. A booster antenna is in communication with the transponder chip module. The device may include at least one fiber-reinforced epoxy laminate material layer. The transponder chip module and the booster antenna may comprise components in a payment circuit, with the metal layer electrically isolated from the payment circuit. The booster antenna may be formed on or embedded in the fiber-reinforced epoxy laminate material layer. Processes for manufacturing transaction devices including a metal layer with one or more fiber-reinforced epoxy laminate material layers are also disclosed.

    Metal smart card with dual interface capability
    63.
    发明授权
    Metal smart card with dual interface capability 有权

    公开(公告)号：US11301744B2

    公开(公告)日：2022-04-12

    申请号：US16935948

    申请日：2020-07-22

    申请人： CompoSecure, LLC

    发明人： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

    IPC分类号： G06K19/077 ,  H01L23/66 ,  H01Q1/38 ,  H01Q1/22

    摘要： A transaction card comprising a metal layer. A first cut out region in a first surface of said metal layer has a depth less than the thickness of the metal layer, and a first portion of an integrated circuit (IC) module is secured therein. A second cut out region extends from the first cut out region to the second surface of said metal layer and defines a non-RF-impeding volume having a perimeter greater than the perimeter of the first cut out region. One or more additional layers are stacked on the second surface of the metal layer, and a channel extends between one of the stacked layers and the IC module.

    METAL DUAL INTERFACE CARD
    64.
    发明申请
    METAL DUAL INTERFACE CARD 有权

    公开(公告)号：US20220036149A1

    公开(公告)日：2022-02-03

    申请号：US17502790

    申请日：2021-10-15

    申请人： CompoSecure, LLC

    发明人： Adam Lowe

    IPC分类号： G06K19/07 ,  G06K19/077

    摘要： A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.

    CARD WITH DYNAMIC SHAPE MEMORY ALLOY TACTILE FEATURE
    65.
    发明申请
    CARD WITH DYNAMIC SHAPE MEMORY ALLOY TACTILE FEATURE 有权

    公开(公告)号：US20210271948A1

    公开(公告)日：2021-09-02

    申请号：US17320323

    申请日：2021-05-14

    申请人： CompoSecure, LLC

    发明人： Adam Lowe

    IPC分类号： G06K19/077 ,  G06K19/07

    摘要： A transaction or identification card has a width, a length, and at least one planar surface extending across the width and length. The card includes a dynamic feature including an actuator having an inactivated position and an activated position, wherein the inactivated position has at least one reversible difference from the activated position relative to the planar surface of the card.

    TRANSACTION CARD WITH EMBEDDED ELECTRONIC COMPONENTS AND PROCESS FOR MANUFACTURE
    66.
    发明申请
    TRANSACTION CARD WITH EMBEDDED ELECTRONIC COMPONENTS AND PROCESS FOR MANUFACTURE 有权

    公开(公告)号：US20210073607A1

    公开(公告)日：2021-03-11

    申请号：US17101096

    申请日：2020-11-23

    申请人： CompoSecure, LLC

    发明人： Adam Lowe ,  Syeda Hussain

    IPC分类号： G06K19/077 ,  G06K19/06 ,  G06K19/02

    摘要： A process for making a transaction card defined by a plurality of layers is described. The process includes providing a first portion of the card, the first portion comprising a non-plastic layer having first and second faces and a thickness therebetween; forming an opening in the non-plastic layer, the opening defined through the first face; disposing embedded electronics in the opening; providing a second portion of the card; and providing a fill disposed in portions of the opening not occupied by the embedded electronics and attaching the first portion of the card to the second portion of the card.

    DI capacitive embedded metal card
    68.
    发明授权
    DI capacitive embedded metal card 有权

    公开(公告)号：US10762412B2

    公开(公告)日：2020-09-01

    申请号：US15928813

    申请日：2018-03-22

    申请人： CompoSecure, LLC

    发明人： Adam Lowe ,  Michele Logan ,  Dori Skelding ,  Syeda Hussain

    IPC分类号： G06K19/06 ,  G06K19/077 ,  G06K19/02 ,  G06K19/07

    摘要： A transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from an origin on the card periphery to a terminus in the opening. The card has a greater flex resistance than a card having a comparative discontinuity with the terminus and the origin the same distance from a line defined by a first long side of the card periphery in an absence of one or more strengthening features. Strengthening features include a discontinuity wherein one of the terminus or the origin are located relatively closer to the first long side of the card periphery than the other, a plurality of discontinuities wherein fewer than all extend from the card periphery to the opening, a self-supporting, non-metal layer disposed on at least one surface of the card, or one or more ceramic reinforcing tabs surrounding the opening.