公开(公告)号：US20020153477A1

公开(公告)日：2002-10-24

申请号：US10128753

申请日：2002-04-23

Applicant: Fujikoshi Machinery Corp.

Inventor： Tsuyoshi Hasegawa ,  Yasuhide Denda

IPC: G02F001/01

CPC classification number: B24B37/345 ,  H01L21/681

Abstract: The work piece feeding machine is capable of correctly and efficiently setting a work piece in a through-hole of a carrier. The work piece feeding machine comprises a positioning unit detecting amount of displacement of the work piece with respect to the through-hole and correcting the position of the work piece in the through-hole. The positioning unit includes: a lighting source section provided on the work piece side or the carrier side, the lighting source section throwing polarized light on the work piece and the carrier; a camera provided on the carrier side or the work piece side, the camera receiving the polarized light from the lighting source section so as to catch images of an outer edge of the work piece and an inner edge of the through-hole in a visual field thereof; and an image processing section measuring the amount of displacement on the basis of positions of the outer edge and the inner edge.

Abstract translation: 工件给料机能够正确有效地将工件设置在载体的通孔中。 工件给料机包括定位单元检测工件相对于通孔的位移量，并校正工件在通孔中的位置。 定位单元包括：设置在工件侧或承载侧的照明源部分，照明源部分在工件和载体上投射偏振光; 设置在载体侧或工件侧的照相机，所述照相机接收来自所述照明源部的偏振光，以便在视场中捕获所述工件的外边缘和所述通孔的内边缘的图像 的; 以及图像处理部，其基于所述外缘和所述内缘的位置来测量位移量。

公开(公告)号：US20020119735A1

公开(公告)日：2002-08-29

申请号：US10081493

申请日：2002-02-22

Applicant: Fujikoshi Machinery Corp.

Inventor： Yoshio Nakamura ,  Tsuyoshi Hasegawa ,  Susumu Onishi

IPC: B24B001/00 ,  B24B005/00

CPC classification number: B24B37/30

Abstract: In the wafer abrasive machine of the present invention, a gravity center and a rotational axis of a wafer can be corresponded while abrading the wafer and a holding plate can be smoothly moved in a head member. The abrasive machine comprises: the head member including a concave section, in which the holding plate is accommodated; an elastic sheet member suspending the holding plate and being reinforced by a cloth-formed reinforcing member; a space for storing pressure fluid which pushes the holding plate toward the abrasive plate, the space being formed between the elastic sheet member and the concave section; and a plurality of spherical bodies being provided between an outer circumferential face of the holding plate and an inner circumferential face of the concave section, the spherical bodies simultaneously point-contact the both circumferential faces.

Abstract translation: 在本发明的晶片研磨机中，在研磨晶片的同时可以使晶片的重心和旋转轴对应，并且保持板能够平滑地移动到头部构件中。 所述研磨机包括：所述头部构件包括凹部，所述保持板容纳在所述凹部中; 弹性片构件，其将所述保持板悬挂并由布形加强构件加强; 用于存储将所述保持板向研磨板推动的压力流体的空间，所述空间形成在所述弹性片构件和所述凹部之间; 并且在所述保持板的外周面与所述凹部的内周面之间设置有多个球状体，所述球状体同时与所述两个圆周面进行点接触。

公开(公告)号：US20020058465A1

公开(公告)日：2002-05-16

申请号：US10037742

申请日：2001-11-09

Applicant: Fujikoshi Machinery Corp.

Inventor： Tadakazu Miyashita ,  Tsuyoshi Hasegawa ,  Atsushi Kajikura ,  Norihiko Moriya

IPC: B24B007/22

CPC classification number: B24B37/08 ,  B24B37/042 ,  B24B49/16 ,  B24B51/00

Abstract: The method of the present invention is capable of abrading a work piece with fixed load. The method comprises: a first abrading process, in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted so as to apply first pressure to the work piece via the upper abrasive plate without applying full weight of the upper abrasive plate; and a second abrading process, in which the pressure of the cylinder chamber is readjusted so as to apply second pressure, which is higher than the first pressure, to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.

Abstract translation: 本发明的方法能够以固定的载荷研磨工件。 该方法包括：第一研磨过程，其中调节悬挂上磨料板的气缸单元的气缸室的压力，以便经由上磨料板向工件施加第一压力，而不用全部重量的上磨料 盘子; 以及第二研磨过程，其中重新调节气缸室的压力，以便将高于第一压力的第二压力经由上磨料板施加到工件，而不施加上磨料板的全部重量 。