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    METHODS AND APPARATUS FOR CONDITIONING OF CHEMICAL MECHANICAL POLISHING PADS
    62.
    发明申请
    METHODS AND APPARATUS FOR CONDITIONING OF CHEMICAL MECHANICAL POLISHING PADS 审中-公开
    化学机械抛光垫调节方法与装置

    公开(公告)号：US20140206263A1

    公开(公告)日：2014-07-24

    申请号：US13801127

    申请日：2013-03-13

    Applicant: Rajeev BAJAJ ,  Hung Chih CHEN

    Inventor： Rajeev BAJAJ ,  Hung Chih CHEN

    IPC: B24B53/017 ,  B24B53/00 ,  B24B37/34

    CPC classification number: B24B53/017 ,  B24B37/34

    Abstract: A method and apparatus for conditioning a polishing pad is provided. In one embodiment, a pad conditioning device for a substrate polishing process is provided. The pad conditioning device includes an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad.

    Abstract translation: 提供了一种用于调理抛光垫的方法和装置。 在一个实施例中，提供了一种用于衬底抛光工艺的衬垫调节装置。 焊盘调节装置包括耦合到抛光站的与抛光垫相邻的部分的光学装置，该光学装置包括适于向抛光垫的抛光表面发射光束的激光发射器，该光束的波长范围为 与抛光过程中使用的抛光液基本上不反应，但与抛光垫反应。

    METHOD AND APPARATUS FOR CMP CONDITIONING
    64.
    发明申请
    METHOD AND APPARATUS FOR CMP CONDITIONING 有权
    用于CMP调节的方法和装置

    公开(公告)号：US20130189906A1

    公开(公告)日：2013-07-25

    申请号：US13785845

    申请日：2013-03-05

    Applicant: Rajeev BAJAJ

    Inventor： Rajeev BAJAJ

    IPC: B24B53/017

    CPC classification number: B24B53/017 ,  B23K26/3576 ,  B24B53/095

    Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.

    Abstract translation: 抛光垫调节装置包括用于提供激光束的激光束产生单元，用于提供流体流的流体输送系统和用于去除碎片的真空管线。 激光束可以直接冲击抛光垫的表面，从而产生切割作用，而雾化的流体流提供冷却和垫片碎屑以及流体通过真空管线被去除。 或者，激光束可以与垫表面上方的区域中的雾化流体流组合，以将其能量的一部分基本上赋予流体流，产生在焊盘表面上提供“冷”切割作用的高能量液滴。

    POLISHING PAD
    66.
    发明申请
    POLISHING PAD 有权
    抛光垫

    公开(公告)号：US20100203815A1

    公开(公告)日：2010-08-12

    申请号：US12676318

    申请日：2008-08-28

    Applicant: Rajeev Bajaj

    Inventor： Rajeev Bajaj

    IPC: B24B57/00 ,  B24D11/00

    CPC classification number: B24B37/26

    Abstract: A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveable in an axis normal to a polishing surface of the polishing elements. Different densities of the polishing elements may be positioned within different areas of the surface of the polishing pad.

    Abstract translation: 抛光垫包括在抛光垫的表面上相互交叉的抛光元件。 每个抛光元件被固定以便限制其相对于其它抛光元件的横向运动，但是保持在与抛光元件的抛光表面垂直的轴线上的运动。 抛光元件的不同密度可以位于抛光垫表面的不同区域内。

    Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
    67.
    发明授权
    Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor 有权
    具有压力控制和过程监控的改进化学机械平面化垫的方法和装置

    公开(公告)号：US07530880B2

    公开(公告)日：2009-05-12

    申请号：US11576944

    申请日：2005-10-05

    Applicant: Rajeev Bajaj ,  Natraj Narayanswami ,  Bang C. Nguyen

    Inventor： Rajeev Bajaj ,  Natraj Narayanswami ,  Bang C. Nguyen

    IPC: B24B49/00

    CPC classification number: B24B37/22 ,  B23H5/08 ,  B24B49/105 ,  B24B49/16

    Abstract: A pad for CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of pressure-sensing and process monitoring polishing elements each affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate.

    Abstract translation: 用于CMP操作的焊盘包括其中具有多个孔并被附着到可压缩底层的引导板; 以及多个压力感测和过程监控抛光元件，每个抛光元件均固定到可压缩底层并穿过导板中的相应孔，以便相对于可压缩底层维持在基本垂直的方向，但是 可相对于导板在垂直方向上平移。

    Method and Apparatus for Improved Chemical Mechanical Planarization Pad with Pressure Control and Process Monitor
    68.
    发明申请
    Method and Apparatus for Improved Chemical Mechanical Planarization Pad with Pressure Control and Process Monitor 有权
    用于压力控制和过程监控的改进化学机械平面化垫的方法和装置

    公开(公告)号：US20080268760A1

    公开(公告)日：2008-10-30

    申请号：US11576944

    申请日：2005-10-05

    Applicant: Rajeev Bajaj ,  Natraj Narayanswami ,  Bang C. Nguyen

    Inventor： Rajeev Bajaj ,  Natraj Narayanswami ,  Bang C. Nguyen

    IPC: B24D11/00 ,  B24B49/00

    CPC classification number: B24B37/22 ,  B23H5/08 ,  B24B49/105 ,  B24B49/16

    Abstract: A pad for CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of pressure-sensing and process monitoring polishing elements each affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate.

    Abstract translation: 用于CMP操作的焊盘包括其中具有多个孔并被附着到可压缩底层的引导板; 以及多个压力感测和过程监控抛光元件，每个抛光元件均固定到可压缩底层并穿过导板中的相应孔，以便相对于可压缩底层维持在基本垂直的方向，但是 可相对于导板在垂直方向上平移。

    Electro-Chemical Mechanical Planarization Pad With Uniform Polish Performance
    69.
    发明申请
    Electro-Chemical Mechanical Planarization Pad With Uniform Polish Performance 有权
    电化学机械平面化抛光垫具有均匀的波兰性能

    公开(公告)号：US20070131564A1

    公开(公告)日：2007-06-14

    申请号：US11562310

    申请日：2006-11-21

    Applicant: Rajeev Bajaj

    Inventor： Rajeev Bajaj

    IPC: B23H3/00

    CPC classification number: B24B37/20

    Abstract: A polishing pad includes at least one conductive polishing element supported by a compressible under layer having conductive patterning therein, the conductive patterning adapted to permit coupling of a potential to the conductive polishing element; a guide plate above the compressible under layer, the guide plate having a hole through which the polishing element passes and further having a cathodic element connected thereto; and a slurry distribution layer adhered to the guide plate opposite the compressible under layer. The polishing pad may further include a proton exchange membrane placed over the cathodic element. A semiconductor wafer having a metal film thereon may be polished using the polishing pad by placing the wafer in contact with the polishing element, applying anodic current to the polishing element and cathodic current to the cathodic element, and polishing with an anodic solution. For copper films, a sulfuric acid-copper sulfate solution may be used.

    Abstract translation: 抛光垫包括由其中具有导电图案化的可压缩底层支撑的至少一个导电抛光元件，所述导电图案适于允许将电位耦合到导电抛光元件; 在可压缩底层上方的引导板，所述引导板具有用于抛光元件通过的孔，并且还具有连接到其上的阴极元件; 以及粘附到与可压缩底层相对的引导板的浆料分布层。 抛光垫还可以包括置于阴极元件上的质子交换膜。 可以使用抛光垫将晶片与抛光元件接触，向抛光元件施加阳极电流，向阴极元件施加阴极电流，并用阳极溶液抛光，可以抛光其上具有金属膜的半导体晶片。 对于铜膜，可以使用硫酸 - 硫酸铜溶液。

    Method for regulating the electrical power applied to a substrate during an immersion process
    70.
    发明授权
    Method for regulating the electrical power applied to a substrate during an immersion process 有权
    用于调节在浸入过程中施加到基底的电功率的方法

    公开(公告)号：US06911136B2

    公开(公告)日：2005-06-28

    申请号：US10135546

    申请日：2002-04-29

    Applicant: Bo Zheng ,  Rajeev Bajaj ,  Zhonghui Alex Wang

    Inventor： Bo Zheng ,  Rajeev Bajaj ,  Zhonghui Alex Wang

    IPC: C25D7/12 ,  C25D21/12 ,  H01L21/288 ,  H01L21/768

    CPC classification number: C25D7/123 ,  C25D17/001 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76877

    Abstract: A method and apparatus for providing a uniform current density across an immersed surface of a substrate during an immersion process. The method includes the steps of determining a time varying area of an immersed portion of the substrate during the immersion process, and supplying a time varying current to the substrate during the immersion process, wherein the time varying current is proportional to the time varying area and is configured to provide a constant current density to the immersed portion of the substrate.

    Abstract translation: 一种用于在浸入工艺期间在衬底的浸入表面上提供均匀电流密度的方法和装置。 该方法包括以下步骤：在浸入过程期间确定衬底的浸入部分的时变面积，以及在浸入过程期间向衬底提供时变电流，其中时变电流与时变面积成正比， 被配置为向衬底的浸没部分提供恒定的电流密度。

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