公开(公告)号：US06180174B2

公开(公告)日：2001-01-30

申请号：US09432675

申请日：1999-11-02

申请人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo ,  Osamu Sugiyama

发明人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo ,  Osamu Sugiyama

IPC分类号： B05D302

CPC分类号： C25D5/505 ,  B32B15/01 ,  C22C9/02 ,  C22C9/04 ,  C25D3/30 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/265

摘要： The invention provides a process for producing a coated Cu alloy having a surface which has a low coefficient of friction and a high resistance to abrasion and is suitable for fabricating connectors, charging-sockets of electric automobiles etc. The coated Cu alloy is produced by coating the surface of a copper alloy with Sn and heat treating the coated Cu alloy at a temperature in the range of 100-450° C. for 0.5-24 hours. The Cu alloy which is coated with Sn consists of 1-41 wt % Zn with the balance being Cu and incidental impurities. By using the coated Cu alloy, the force of insertion, resistance to abrasion and resistance to corrosion of connectors can be significantly improved.

摘要翻译： 本发明提供了一种具有低摩擦系数和高耐磨性的表面的涂覆的Cu合金的制造方法，适用于制造连接器，电动汽车的充电座等。涂覆的Cu合金是通过涂覆 用Sn合金的铜合金的表面，并在100-450℃的温度范围内对涂覆的Cu合金进行热处理0.5-24小时。 涂有Sn的Cu合金由1-41wt％的Zn组成，余量为Cu和杂质。 通过使用涂覆的Cu合金，可以显着提高连接器的插入力，耐磨性和耐腐蚀性。

公开(公告)号：US6132529A

公开(公告)日：2000-10-17

申请号：US827664

申请日：1997-04-10

申请人： Koichi Hatakeyama ,  Akira Sugawara ,  Toshihiro Kanzaki

发明人： Koichi Hatakeyama ,  Akira Sugawara ,  Toshihiro Kanzaki

IPC分类号： C22C9/00 ,  C22C9/06 ,  C22F1/00 ,  C22F1/08 ,  H01B1/02 ,  H01L23/495

CPC分类号： C22F1/08 ,  C22C9/00 ,  C22C9/06 ,  H01L23/49579 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14

摘要： A leadframe of a single frame structure for supporting leads on IC chips. The leadframe is made of a high-strength, high-electroconductivity copper alloy. The copper alloy is produced by preparing an ingot of a copper alloy of 0.05-0.40 wt. % Fe, 0.05-0.40 wt. % Ni, 0.01-0.30 wt. % P, and optionally a total of 0.03-0.50 wt. % of either Sn or Zn or both and a total of 0.05-0.50 wt. % of at least one element of Ag, Co, B, Mn, Cr, Si, Ti and Zr, with the balance being Cu and incidental impurities, heating the ingot to 800 to 950.degree. C. and hot working the ingot to a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above down to 300.degree. C. or below at a cooling rate of at least 1.degree. C./seconds, heat treating the quenched material at 380 to 520.degree. C. for 60-600 minutes without cold working, and subsequently carrying out cold working and heat treating at 450.degree. C. or below, whereby an Fe--Ni--P system intermetallic compound is precipitated in the Cu matrix as uniform and fine grains not larger than 50 nm.

摘要翻译： 用于支持IC芯片上的引线的单个框架结构的引线框架。 引线框架由高强度，高导电性铜合金制成。 铜合金通过制备0.05-0.40重量％的铜合金锭， ％Fe，0.05-0.40重量％ ％Ni，0.01-0.30wt。 ％P，任选地总计为0.03-0.50wt。 Sn或Zn或两者的％，总共0.05-0.50wt。 Ag，Co，B，Mn，Cr，Si，Ti和Zr中的至少一种元素的％，余量为Cu和偶然杂质，将锭加热至800-950℃，并将锭热加工至还原 比例为50％以上，将热加工材料从600℃以上淬火至300℃以下，冷却速度为1℃/秒以上，将淬火后的材料在380〜520℃下进行热处理 ℃，60〜600分钟，不进行冷加工，随后在450℃以下进行冷加工和热处理，由此将Fe-Ni-P系金属间化合物在Cu基体中沉淀为均匀且细小的颗粒 不大于50nm。

公开(公告)号：US5814168A

公开(公告)日：1998-09-29

申请号：US662695

申请日：1996-06-13

申请人： Koichi Hatakeyama ,  Akira Sugawara ,  Toshihiro Kanzaki

发明人： Koichi Hatakeyama ,  Akira Sugawara ,  Toshihiro Kanzaki

IPC分类号： C22C9/00 ,  C22C9/06 ,  C22F1/00 ,  C22F1/08 ,  H01B1/02 ,  H01L23/495

CPC分类号： C22F1/08 ,  C22C9/00 ,  C22C9/06 ,  H01L23/49579 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14

摘要： High-strength, high-electroconductivity copper alloys are produced by preparing an ingot of a copper alloy containing 0.05-0.40 wt % Fe, 0.05-0.40 wt % Ni, 0.01-0.30 wt % P, and optionally a total of 0.03-0.50 wt % of either Sn or Zn or both and a total of 0.05-0.50 wt % of at least one element of Ag, B, Mn, Cr, Si, Ti or Zr, with the balance being Cu and incidental impurities, heating the ingot to 800.degree. to 950.degree. C. and hot working it by a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above to 300.degree. C. or below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched material at 380.degree. to 520.degree. C. for 60 to 600 minutes without performing cold working, and cold working and heat treating it at 450.degree. C. or below, to precipitate an Fe--Ni--P system intermetallic compound in the Cu matrix as uniform and fine grains not larger than 50 nanometers. The copper alloys thus produced are superior in hardness, tensile strength, electrical conductivity and amenability to bending. The copper alloys are useful for making electric and electronic components, such as leadframes.

摘要翻译： 通过制备含有0.05-0.40重量％Fe，0.05-0.40重量％Ni，0.01-0.30重量％P和任选总计0.03-0.50重量％的铜合金锭，制得高强度，高导电性铜合金 Sn或Zn或两者的％，以及总量为0.05-0.50重量％的Ag，B，Mn，Cr，Si，Ti或Zr中的至少一种元素，余量为Cu和偶然杂质，将锭加热至 800℃〜950℃，通过减压比50％以上进行热加工，将热加工材料从600℃以上淬火至300℃以下，冷却速度为1℃以上 ./sec，在380〜520℃下对骤冷材料进行热处理60〜600分钟，不进行冷加工，冷加工，在450℃以下进行热处理，析出Fe-Ni-P Cu基体中的系统金属间化合物为均匀且细晶粒不大于50纳米。 这样制造的铜合金的硬度，拉伸强度，导电性和弯曲性都优异。 铜合金可用于制造电子和电子部件，例如引线框架。

公开(公告)号：US5387293A

公开(公告)日：1995-02-07

申请号：US36489

申请日：1993-03-24

申请人： Takayoshi Endo ,  Kenji Takenouchi ,  Mikio Nishihata ,  Toshio Asano ,  Akira Sugawara

发明人： Takayoshi Endo ,  Kenji Takenouchi ,  Mikio Nishihata ,  Toshio Asano ,  Akira Sugawara

IPC分类号： C22F1/08 ,  C22C9/02

CPC分类号： C22F1/08 ,  C22C9/02 ,  C22C9/06

摘要： A copper base alloy for terminals that is of the Cu-Ni-Sn-P or Cu-Ni-Sn-P-Zn system and that has a tensile strength of at least 50 kgf/mm.sup.2, a spring limit of at least 40 kgf/mm.sup.2, a stress relaxation of not more than 10% and a conductivity of at least 30% IACS is provided. Terminals the spring portion or the entire part of which is produced from that copper base alloy, having an insertion/extraction force of 0.2-3 kgf and a resistance of not more than 3 m.OMEGA. at low voltage and current as initial performance, with the added characteristic that the terminals will experience not more than 20% stress relaxation are also provided. The alloy is superior to the conventional bronze, phosphor bronze and Cu-Sn-Fe-P alloys for terminals in terms of tensile strength, spring limits, stress relaxation characteristic and conductivity and, hence, the terminals manufactured from those alloys have higher performance and reliability than the terminals made of the conventional copper base alloys for terminals.

摘要翻译： 用于Cu-Ni-Sn-P或Cu-Ni-Sn-P-Zn系的端子用铜基合金，其拉伸强度为至少50kgf / mm 2，弹簧极限为至少40kgf / mm2，应力松弛不大于10％，电导率至少为30％IACS。 端子弹簧部分或其整个部分由该铜基合金制成，其具有0.2-3kgf的插入/拉伸力和在低电压和电流下不超过3m欧姆电阻作为初始性能，其中 还提供了终端将经历不超过20％的应力松弛的特征。 在拉伸强度，弹簧极限，应力松弛特性和导电性方面，该合金优于常规的青铜，磷青铜和Cu-Sn-Fe-P合金，因此，由这些合金制造的端子具有更高的性能和 可靠性高于由常规铜基合金端子制成的端子。

公开(公告)号：US20120279618A1

公开(公告)日：2012-11-08

申请号：US13552939

申请日：2012-07-19

申请人： Weilin Gao ,  Hisashi Suda ,  Hiroto Narieda ,  Akira Sugawara

发明人： Weilin Gao ,  Hisashi Suda ,  Hiroto Narieda ,  Akira Sugawara

IPC分类号： C22F1/08

CPC分类号： C22C9/00 ,  C22F1/08 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 μm and (maximum crystal grain size−minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I0{420}>1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I0{420}, respectively.

摘要翻译： 铜合金的片材具有包含1.2〜5.0重量％的钛，余量为铜和不可避免的杂质的化学组成，该材料的平均结晶粒径为5〜25μm，（最大结晶粒径 - 最小值） 晶粒尺寸）/（平均晶粒尺寸）为0.20以下，假设平均值的最大值，最小值和平均值均为多个区域中的相应一个区域中的晶粒尺寸的平均值， 分别选自具有相同形状和大小的片材的表面，分别为最大，最小和平均晶粒尺寸，并且具有满足I {420} / I0 {420}的晶体取向的材料， > 1.0，假设材料表面的{420}晶面上的X射线衍射强度和纯铜的标准粉末分别为I {420}和I0 {420}。

公开(公告)号：US20120241612A1

公开(公告)日：2012-09-27

申请号：US13514654

申请日：2010-12-06

申请人： Ken Harada ,  Akira Sugawara ,  Noboru Moriya

发明人： Ken Harada ,  Akira Sugawara ,  Noboru Moriya

IPC分类号： H01J37/26 ,  H01J3/26

CPC分类号： H01J37/26 ,  H01J37/1478 ,  H01J2237/1514 ,  H01J2237/2614

摘要： Disclosed are an electron beam biprism device and an electron beam device, in which, in order to implement a fringe scan method in an electron beam interferometer, a deflection function in one direction is added to the function of an electron beam biprism, and electron beams passing the left and right sides of a filament electrode can be respectively deflected at different angles.

摘要翻译： 公开了一种电子束双棱镜装置和电子束装置，其中为了在电子束干涉仪中实现边缘扫描方法，将一个方向的偏转函数加到电子束双棱镜的功能上，并且电子束 通过灯丝电极的左右两侧可以分别以不同的角度偏转。

公开(公告)号：US08193494B2

公开(公告)日：2012-06-05

申请号：US12850961

申请日：2010-08-05

申请人： Ken Harada ,  Akira Sugawara

发明人： Ken Harada ,  Akira Sugawara

IPC分类号： H01J37/26 ,  H01J37/04 ,  G01B15/00

CPC分类号： H01J37/28 ,  H01J37/295 ,  H01J2237/1514 ,  H01J2237/2611 ,  H01J2237/2614

摘要： A first electron biprism is disposed in a condenser optical system and an observation region of a specimen is irradiated simultaneously with two electron beams of different angles. The two electron beams that have simultaneously transmitted the specimen are spatially separated and focused with a second electron biprism disposed in an imaging optical system and two electron microscopic images of different irradiation angles are obtained. The two picture images are obtained by a detecting unit. Based on the two picture images, a stereoscopic image or two images having different kinds of information of the specimen is/are produced and displayed on a display device.

摘要翻译： 第一电子双棱镜设置在聚光镜系统中，并且与两个不同角度的电子束同时照射样本的观察区域。 同时透射样品的两个电子束在空间上分离并且与设置在成像光学系统中的第二电子双棱镜聚焦，并且获得两个不同照射角度的电子显微镜图像。 两个图像由检测单元获得。 基于两个图像，产生并显示具有样本的不同种类的信息的立体图像或两个图像并显示在显示装置上。

公开(公告)号：US08131973B2

公开(公告)日：2012-03-06

申请号：US12389016

申请日：2009-02-19

申请人： Akira Sugawara

发明人： Akira Sugawara

IPC分类号： G06F12/10

CPC分类号： G06F11/0778 ,  G06F11/0706

摘要： A computer dumps information stored in a storage space used by a program, into a file when the program ends abnormally, by determining a priority representative of an order in which the information is dumped into the file, for storage areas which are predetermined areas into which the storage space is divided; compressing the information stored in each storage area in decreasing the order of priority and outputting the compressed information to the file in an order in which the information is compressed.

摘要翻译： 当程序异常地结束时，计算机将存储在程序使用的存储空间中的信息转储到文件中，通过确定代表将信息转储到文件中的顺序的优先级，作为预定区域的存储区域 存储空间分开; 以降低优先级的顺序压缩存储在每个存储区域中的信息，并以压缩信息的顺序将压缩信息输出到文件。

公开(公告)号：US20120049130A1

公开(公告)日：2012-03-01

申请号：US12671259

申请日：2009-05-21

申请人： Tomotsugu Aoyama ,  Akira Sugawara

发明人： Tomotsugu Aoyama ,  Akira Sugawara

IPC分类号： H01B1/02 ,  C22F1/08

CPC分类号： C22C9/02 ,  C22C9/06 ,  C22F1/08

摘要： A copper alloy sheet has a chemical composition comprising 0.1 to 5 wt % of nickel, 0.1 to 5 wt % of tin, 0.01 to 0.5 wt % of phosphorus and the balance being copper and unavoidable impurities, and has a crystal orientation satisfying 2.9≦(f{220}+f{311}+f{420})/(0.27·f{220}+0.49·f{311}+0.49·f{420})≦4.0, assuming that the degree of orientation of a {hkl} crystal plane measured by the powder X-ray diffraction method on the rolled surface of the copper alloy sheet is f{hkl}.

摘要翻译： 铜合金板具有0.1〜5重量％的镍，0.1〜5重量％的锡，0.01〜0.5重量％的磷，余量为铜和不可避免的杂质的化学组成，其结晶取向为2.9＆nlE; （f {220} + f {311} + f {420}）/（0.27·f {220} + 0.49·f {311} + 0.49·f {420}）＆nlE; 4.0，假设 在铜合金板的轧制表面上通过粉末X射线衍射法测量的{hkl}晶面为f {hkl}。

公开(公告)号：US08097102B2

公开(公告)日：2012-01-17

申请号：US12314281

申请日：2008-12-08

申请人： Weilin Gao ,  Hisashi Suda ,  Hiroto Narieda ,  Akira Sugawara

发明人： Weilin Gao ,  Hisashi Suda ,  Hiroto Narieda ,  Akira Sugawara

IPC分类号： C22F1/08 ,  C22C9/00

CPC分类号： C22C9/00 ,  C22C1/002 ,  C22F1/08

摘要： Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition containing, by mass, from 1.0 to 5.0% of Ti, and optionally containing at least one of at most 0.5% of Fe, at most 1.0% of Co and at most 1.5% of Ni, and further optionally containing at least one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in an amount within a suitable range, with the balance of Cu and inevitable impurities, and having a crystal orientation satisfying the following expression (1) and preferably also satisfying the following expression (2). The mean crystal grain size of the material is controlled to be from 10 to 60 μm. I{420}/I0{420}>1.0  (1) I{220}/I0{220}≦3.0  (2)

摘要翻译： 提供了一种满足高强度，优异的弯曲加工性，耐应力松弛性等全部要求的Cu-Ti系铜合金板材，具有优异的耐回弹性。 铜合金板材的组成为，含有1.0〜5.0质量％的Ti，并且任选地含有至多0.5％的Fe，至多1.0％的Co和至多1.5％的Ni中的至少一种，以及 进一步任选地含有适当范围内的量的Sn，Zn，Mg，Zr，Al，Si，P，B，Cr，Mn和V中的至少一种，余量为Cu和不可避免的杂质，并且具有晶体取向 满足以下表达式（1），并且优选满足以下表达式（2）。 材料的平均结晶粒径控制在10〜60μm。 I {420} / I0 {420}> 1.0（1）I {220} / I0 {220}＆nlE; 3.0（2）