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公开(公告)号:US07218515B2
公开(公告)日:2007-05-15
申请号:US11132570
申请日:2005-05-19
申请人: Wade D. Vinson , John P. Franz
发明人: Wade D. Vinson , John P. Franz
IPC分类号: G06F1/20
CPC分类号: G06F1/20 , F04D25/0633 , F04D25/064 , F04D25/0646 , F04D25/166 , F04D27/00 , H05K7/20727 , H05K7/20836
摘要: A cooling fan comprising a housing, an electric motor, a blade assembly, and a first motor control circuit board. The housing is operable to connect to a computer chassis that supports an electronic component. An electric motor is fixably mounted within a volume formed by an inner surface of the housing. A blade assembly is rotatably mounted to the electric motor. A first motor control circuit board is coupled to the electric motor and is disposed externally to the volume formed by the inner surface of said housing.
摘要翻译: 一种冷却风扇,包括壳体,电动机,叶片组件和第一电动机控制电路板。 壳体可操作以连接到支持电子部件的计算机机箱。 电动机可固定地安装在由壳体的内表面形成的容积内。 叶片组件可旋转地安装到电动机上。 第一电动机控制电路板耦合到电动机并且设置在由所述壳体的内表面形成的体积的外部。
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公开(公告)号:US06982877B2
公开(公告)日:2006-01-03
申请号:US10783833
申请日:2004-02-20
申请人: Wade D. Vinson , John P. Franz
发明人: Wade D. Vinson , John P. Franz
IPC分类号: H05K7/20
CPC分类号: G06F1/20 , H01L23/367 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要: A system, comprising a circuit board having a heat sink spanning multiple components on the circuit board and at least one compliant pad flexibly interfacing the heat sink with the multiple components.
摘要翻译: 一种系统,包括具有横跨电路板上的多个部件的散热器的电路板和至少一个柔性接口将散热器与多个部件连接的柔性焊盘。
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公开(公告)号:US06858792B2
公开(公告)日:2005-02-22
申请号:US10324693
申请日:2002-12-19
申请人: John P. Franz , Wade D. Vinson , Joseph R. Allen , David W. Deis
发明人: John P. Franz , Wade D. Vinson , Joseph R. Allen , David W. Deis
CPC分类号: H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要: Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may include a plate and a lever coupled to the plate.
摘要翻译: 本发明的实施例通过提供一种无需工具的杠杆致动的,坚固但耐受的,高负荷传递的低轮廓部件保持组件来克服现有技术的缺陷,用于将部件耦合在一起。 组件可以包括板和耦合到板的杆。
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公开(公告)号:US06829146B2
公开(公告)日:2004-12-07
申请号:US10805901
申请日:2004-03-22
申请人: John P. Franz , Wade David Vinson
发明人: John P. Franz , Wade David Vinson
IPC分类号: H05K720
CPC分类号: H01L23/544 , H01L23/40 , H01L2223/54473 , H01L2924/0002 , H01L2924/00
摘要: An assembly comprising a circuit board, a socket, and an electronic device. The socket is connected to the circuit board and comprises a surface having a plurality of receptacles into which are disposed a plurality of connector pins from the electronic device. A heat sink is in thermal contact with the electronic device and has a footprint extending beyond both the electronic device and the socket. A locking lever pivotally connects to an arm extending from the socket to a position outside of the footprint of the heat sink.
摘要翻译: 一种组件,包括电路板,插座和电子设备。 插座连接到电路板,并且包括具有多个插座的表面,多个插座从电子设备设置有多个连接器针脚。 散热器与电子设备热接触,并且具有延伸超过电子设备和插座的覆盖区域。 锁定杆枢转地连接到从插座延伸到散热器的占地面积外的位置的臂。
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