Patent search ap:("Apple Inc.") AND inv:"Tang Yew Tan" Page 7

61.

发明申请
WIRELESS HANDHELD ELECTRONIC DEVICE 有权
Title translation: 无线手持电子设备

公开(公告)号：US20130162485A1

公开(公告)日：2013-06-27

申请号：US13773010

申请日：2013-02-21

Applicant: Apple Inc.

Inventor： Phillip M. Hobson , Stephen P. Zadesky , Erik L. Wang , Tang Yew Tan , Richard H. Dinh , Adam D. Mittleman , Kenneth A. Jenks , Robert J. Hill , Robert W. Schlub

IPC: H01Q1/24

CPC classification number: H01Q1/243 , H01Q1/24 , H01Q1/273 , H01Q1/38 , H01Q1/46 , H01Q1/48 , H01Q1/50 , H01Q5/371 , H01Q5/40 , H01Q7/00 , H01Q9/0421 , H01Q9/42 , H01Q13/10 , H01Q21/28

Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.

Abstract translation: 可以提供包含导电外壳和其它导电元件的手持电子设备。导电元件可形成天线接地平面。用于手持电子设备的一个或多个天线可以由接地平面和一个或多个相关联的天线谐振元件形成。收发器电路可以通过诸如同轴电缆的传输线连接到谐振元件。套圈可以压接到同轴电缆。具有延伸构件的托架可以压接在套圈上以将同轴电缆接地到壳体和接地平面中的其它导电元件。接地平面可能包含一个天线槽。坞站连接器和柔性电路可以以不影响槽的谐振频率的方式与槽重叠。电气部件可以使用隔离元件例如电感器和电阻器与天线隔离。

62.

发明申请
TECHNIQUES FOR MARKING PRODUCT HOUSINGS 审中-公开
Title translation: 标识产品外壳的技术

公开(公告)号：US20130129986A1

公开(公告)日：2013-05-23

申请号：US13746603

申请日：2013-01-22

Applicant: Apple Inc.

Inventor： Richard Walter Heley , Erming Luo , Adam Mittleman , John Payne , Tang Yew Tan , Erik Wang

IPC: H05K13/00 , G03F7/20

CPC classification number: H05K13/00 , G03F7/20 , G03F7/2014 , G03F7/2016 , G03F7/202 , Y10T428/2462

Abstract: Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface.

Abstract translation: 公开了在产品上提供标记的技术或工艺。产品上提供的标记可以是文字和/或图形。这些技术或工艺可以在平坦或弯曲的表面上提供高分辨率的标记。在一个实施例中，产品具有外壳，并且标记将设置在外壳上。例如，用于特定产品的壳体可以包括外部壳体表面，并且标记可以设置在外部壳体表面上。

63.

发明申请
COLD WORKED METAL HOUSING FOR A PORTABLE ELECTRONIC DEVICE 有权

公开(公告)号：US20240422926A1

公开(公告)日：2024-12-19

申请号：US18819502

申请日：2024-08-29

Applicant: Apple Inc.

Inventor： Stephen P. Zadesky , Phillip M. Hobson , Tang Yew Tan

IPC: H05K5/02 , H04M1/02 , H05K5/00

Abstract: A cold worked stainless steel bezel for a portable electronic device is provided. The bezel is secured flush to a housing to form part of the case of the portable electronic device. A brace that includes a slot for receiving a wall extending from the bezel is fixed to the housing. When the bezel engages the housing, the wall of the bezel is inserted in the slot of the brace and releasably held by a spring that engages both the brace and the wall. The bezel can be released by disengaging the spring, (e.g., using a special tool or a magnetic field). Because the bezel is manufactured from cold worked stainless steel, it is hard and resistant to impacts. Cold worked steel also facilitates manufacturing within design constraints and tolerances, and requires very little machining after manufacturing to comply with those constraints.

64.

发明公开
INSERT MOLDING AROUND GLASS MEMBERS FOR PORTABLE ELECTRONIC DEVICES 审中-公开

公开(公告)号：US20230337384A1

公开(公告)日：2023-10-19

申请号：US18211086

申请日：2023-06-16

Applicant: Apple Inc.

Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan

IPC: H05K5/03 , H04M1/02 , G06F1/16 , A45C11/00 , A45F5/00 , G06F3/041 , H05K5/00

CPC classification number: H05K5/03 , H04M1/0266 , H04M1/0249 , G06F1/1626 , G06F1/1656 , A45C11/00 , A45F5/00 , G06F3/041 , H05K5/0017

Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

65.

发明公开
HIGH TOLERANCE CONNECTION BETWEEN ELEMENTS 审中-公开

公开(公告)号：US20230176625A1

公开(公告)日：2023-06-08

申请号：US18106354

申请日：2023-02-06

Applicant: Apple Inc.

Inventor： Scott A. Myers , Mattia Pascolini , Richard Hung Minh Dinh , Trent Weber , Robert Schlub , Josh Nickel , Robert Hill , Nanbo Jin , Tang Yew Tan

IPC: G06F1/16 , H04M1/02 , H05K5/03 , H05K5/02 , H01Q1/22 , H01Q1/24 , H01Q1/42

CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1698 , H04M1/0249 , H05K5/03 , H05K5/02 , H04M1/026 , H05K5/0208 , G06F1/1684 , H01Q1/2258 , H01Q1/241 , H04M1/0274 , H01Q1/42 , H05K5/0247 , Y10T29/49002 , Y10T29/49169

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

66.

发明申请
OFFSET CONTROL FOR ASSEMBLING AN ELECTRONIC DEVICE HOUSING 有权

公开(公告)号：US20230007800A1

公开(公告)日：2023-01-05

申请号：US17943145

申请日：2022-09-12

Applicant: Apple Inc.

Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan

IPC: H05K7/14 , H04M1/02 , G06F1/16 , H05K5/03 , G02B7/02 , H05K5/00

Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.