公开(公告)号：US11328938B2

公开(公告)日：2022-05-10

申请号：US17008075

申请日：2020-08-31

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice

IPC: B01D46/70 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677

Abstract: A system includes a filter purge apparatus configured to supply a flushing gas to a portion of a factory interface chamber located upstream of a chamber filter to minimize moisture contamination of the chamber filter by ambient air. The filter purge apparatus is configured to supply the flushing gas in association with breach of the factory interface chamber which compromises controlled environment of the factory interface chamber.

公开(公告)号：US20220084794A1

公开(公告)日：2022-03-17

申请号：US17023186

申请日：2020-09-16

Applicant: Applied Materials, Inc.

Inventor： Kenneth S. Collins ,  Michael R. Rice ,  James D. Carducci ,  Kartik Ramaswamy ,  Ajit Balakrishna ,  Shahid Rauf ,  Jason Kenney

IPC: H01J37/32 ,  H01L21/67 ,  C23C16/52 ,  C23C16/505 ,  C23C16/455

Abstract: Embodiments disclosed herein include a plasma treatment chamber, comprising one or more sidewalls. A support surface within the one or more sidewalls holds a workpiece. A first gas injector along the one or more sidewalls injects a first gas flow in a first direction generally parallel to and across a surface of the workpiece. A first pump port along the one or more sidewalls generally opposite of the first gas injector pumps out the first gas flow. A second gas injector along the one or more sidewalls injects a second gas flow in a second direction generally parallel to and across the surface of the workpiece. A second pump port along the one or more sidewalls generally opposite of the second gas injector pumps out the second gas flow.

公开(公告)号：US20220081762A1

公开(公告)日：2022-03-17

申请号：US17532693

申请日：2021-11-22

Applicant: Applied Materials, Inc.

Inventor： Xiaowei Wu ,  Jennifer Y. Sun ,  Michael R. Rice

IPC: C23C16/40 ,  C23C16/455

Abstract: Certain embodiments of the present disclosure relate to methods of forming coated articles. In one embodiment, a method comprises depositing one or more rare earth metal-containing ceramic compounds on an article by atomic layer deposition, for example, to coat surfaces of high aspect ratio internal channels.

公开(公告)号：US11049740B1

公开(公告)日：2021-06-29

申请号：US16812214

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice

IPC: B65G47/90 ,  H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: A mainframe of a device fabrication system includes a base, a plurality of facets on the base, an a lid over the plurality of facets. A first facet of the plurality of facets includes a frame. The base, the lid and the plurality of facets together define an interior volume that includes a robot arm. A first replaceable interface plate is attached to the first frame of the first facet. The first replaceable interface plate includes a plurality of substrate access ports. A first substrate access port of the plurality of substrate access ports is configured to provide access for the robot arm to a first process chamber. A second substrate access port of the plurality of substrate access ports is configured to provide access for the robot arm to a second process chamber.

公开(公告)号：US20210183676A1

公开(公告)日：2021-06-17

申请号：US16839012

申请日：2020-04-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael R. Rice ,  Juan Carlos Rocha-Alvarez ,  Jeffrey C. Hudgens

IPC: H01L21/677 ,  H01L21/67

Abstract: The disclosure describes devices, systems, and methods for causing a factory interface of an electronic device manufacturing system to be moveable between a first position and a second position. An electronic device manufacturing system can include a transfer chamber, processing chambers connected to the transfer chamber, a load lock connected to the transfer chamber, and a factory interface connected to the load lock. The factory interface can be moveable between a first position and a second position. The factory interface, while oriented in the first position, is positioned for transfer of one or more substrates between the factory interface and the load lock, where at least one of the transfer chamber or the load lock are inaccessible for maintenance while the factory interface is oriented at the first position. The factory interface, while oriented in the second position, is positioned to provide maintenance access to at least one of the transfer chamber or the load lock. The factory interface can include one or more moveable components that cause the factory interface to be moveable between the first position and the second position.

公开(公告)号：US10943805B2

公开(公告)日：2021-03-09

申请号：US15983834

申请日：2018-05-18

Applicant: Applied Materials, Inc.

Inventor： Jeffrey C. Hudgens ,  Michael R. Rice ,  Karuppasamy Muthukamatchi ,  Nir Merry

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an upper arm and three blades B1, B2, B3 that are independently rotatable. The three blades are configured to service a first dual load lock and second dual load lock wherein each dual load lock includes a different pitch. In some embodiments, a first pitch P1 is smaller than a second pitch P2. Blades B2 and B3 (or optionally blades B1 and B2) can service the first dual load lock with Pitch P1 and blades B1 and B3 can service the second dual load lock including the second pitch P2. Methods of operating the electronic device manufacturing apparatus and the robot apparatus are provided, as are numerous other aspects.

公开(公告)号：US10763134B2

公开(公告)日：2020-09-01

申请号：US15905959

申请日：2018-02-27

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice

IPC: H01L21/67 ,  B01D46/00 ,  H01L21/673 ,  H01L21/677

Abstract: Electronic device processing apparatus including factory interface chamber with environmental controls and a purge control apparatus allowing purge of a chamber filter. The filter purge apparatus includes a chamber filter and a flushing gas supply configured to supply flushing gas to the chamber filter when an access door to the factory interface chamber is open to allow personnel safe servicing access to the factory interface chamber. The supply of flushing gas to the chamber filter minimizes moisture contamination of the chamber filter by factory ambient air when the access door is open thereby allowing rapid resumption of substrate processing after factory interface servicing. Purge control methods and apparatus are described, as are numerous other aspects.

公开(公告)号：US20190310593A1

公开(公告)日：2019-10-10

申请号：US16442187

申请日：2019-06-14

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice ,  Dean C. Hruzek

IPC: G05B15/02 ,  H01L21/677

Abstract: Electronic device processing systems including environmental control of the factory interface, a carrier purge chamber, and one or more substrate carriers are described. One electronic device processing system has a factory interface having a factory interface chamber, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface, the carrier purge chamber, and the one or more substrate carriers and operational to control an environment at least within the factory interface chamber, carrier purge chamber, and the one or more substrate carriers. Methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US10395964B2

公开(公告)日：2019-08-27

申请号：US15792596

申请日：2017-10-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Matthew J. Busche ,  Vijay D. Parkhe ,  Michael R. Rice

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/67 ,  G01N21/95

Abstract: An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus ha a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.

公开(公告)号：US10217650B2

公开(公告)日：2019-02-26

申请号：US15264082

申请日：2016-09-13

Applicant: APPLIED MATERIALS, INC.

Inventor： James Matthew Holden ,  Song-Moon Suh ,  Todd Egan ,  Kalyanjit Ghosh ,  Leon Volfovski ,  Michael R. Rice ,  Richard Giljum

IPC: B08B7/00 ,  H01L21/67 ,  H01L21/02 ,  B01D39/12 ,  B08B5/00

Abstract: A substrate cleaning apparatus may include a substrate support having a support surface to support a substrate to be cleaned, wherein the substrate support is rotatable about a central axis normal to the support surface; a first nozzle to provide a first cleaning gas to a region of the inner volume corresponding to the position of an edge of the substrate when the substrate is supported by the support surface of the substrate support; a first annular body disposed opposite and spaced apart from the support surface of the substrate support by a gap, the first annular body having a central opening defined by an inner wall shaped to provide a reducing size of the gap between the first annular body and the support surface in a radially outward direction; and a first gas inlet to provide a first gas to the central opening of the first annular body.