摘要:
In one example, a data center may be built in modular components that may be pre-manufactured and separately deployable. Each modular component may provide functionality such as server capacity, cooling capacity, fire protection, resistance to electrical failure. Some components may be added to the data center by connecting them to the center's utility spine, and others may be added by connecting them to other components. The spine itself may be a modular component, so that spine capacity can be expanded or contracted by adding or removing spine modules. The various components may implement functions that are part of standards for various levels of reliability for data centers. Thus, the reliability level that a data center meets may be increased or decreased to fit the circumstances by adding or removing components.
摘要:
According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.
摘要:
An exemplary cooling method may comprise thermally coupling a network of cooling lines to each of a plurality of heat exchangers in a cooling system. The method may also comprise providing a first connection from a network of cooling lines to a first fluid source and a second connection from the network of cooling lines to an optional second fluid source. The method may also comprise delivering cooling fluid through the network of cooling lines to each of the plurality of heat exchangers whether the network of cooling lines is connected only to the first fluid source or to both the first and second fluid sources.
摘要:
According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.
摘要:
In one example, a data center may be built in modular components that may be pre-manufactured and separately deployable. Each modular component may provide functionality such as server capacity, cooling capacity, fire protection, resistance to electrical failure. Some components may be added to the data center by connecting them to the center's utility spine, and others may be added by connecting them to other components. The spine itself may be a modular component, so that spine capacity can be expanded or contracted by adding or removing spine modules. The various components may implement functions that are part of standards for various levels of reliability for data centers. Thus, the reliability level that a data center meets may be increased or decreased to fit the circumstances by adding or removing components.
摘要:
A computer server is configured to electrically and mechanically couple with a plurality of different power modules. These power modules are interchangeable, and all fit within the form factor of the server, eliminating the use of PDUs within the server rack. The server may be configured in the factory or in the field to use either the single-phase AC power configuration, the 3-phase AC power configuration, or any other power configuration, such as DC, desired.
摘要:
An illustrative power-efficient data center is described for operating in an uncontrolled environment in one scenario. The data center includes an air moving system that applies unconditioned air to resource items. The resource items are stripped down to provide a substantially minimum set of components for performing the data center'core functions. Various illustrative techniques for managing a power-efficient data center are also described.
摘要:
A system has a plurality of electronic components that are powered by a power source, and each of the components is associated with a respective power cap. The system further has logic configured to monitor power consumption of the electronic components over a duration and dynamically adjust at least one power cap associated with at least one of the electronic components based on the monitored power consumption.
摘要:
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要:
A system and method for dynamic storage based on performance throttling. The method comprises providing an array of storage devices coupled to a computing device. The method comprises determining a status of a system condition, such as ambient temperature. The method comprises throttling the operating speed of one or more storage devices in the array based on the status of the system condition. The method comprises determining relative frequency of access to data to be stored by the computing device in the array of storage devices. The method comprises optimizing storage of data by the computing device in the array of storage devices based at least in part on 1) relative frequency of access to data and 2) which of the one or more storage devices are throttled.