公开(公告)号：US07332359B2

公开(公告)日：2008-02-19

申请号：US10082593

申请日：2002-02-22

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama

IPC分类号： H01L31/26

CPC分类号： H01L21/67271 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/95615

摘要： Techniques for inspecting semiconductor devices. An inspection condition using chip matrix data and chip size data is set. The intricate circuit patterns of at least one semiconductor device is inspected with the inspection condition. In an embodiment of the present invention, inspection uses images formed by the irradiation of white light, a laser light, or an electron beam. Data obtained from the inspection is used to generate a revised inspection condition. Semiconductor devices are inspected using the revised inspection condition.

摘要翻译： 检查半导体器件的技术。 设置使用芯片矩阵数据和芯片尺寸数据的检查条件。 在检查条件下检查至少一个半导体器件的复杂电路图案。 在本发明的实施例中，检查使用通过照射白光，激光或电子束形成的图像。 使用从检查获得的数据来生成修订的检查条件。 使用修订的检查条件检查半导体器件。

公开(公告)号：US06731384B2

公开(公告)日：2004-05-04

申请号：US09973000

申请日：2001-10-10

申请人： Yoshimasa Ohshima ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Kenji Mitomo ,  Takashi Okawa ,  Akira Hamamatsu ,  Shinichi Suzuki

发明人： Yoshimasa Ohshima ,  Minori Noguchi ,  Hidetoshi Nishiyama ,  Kenji Mitomo ,  Takashi Okawa ,  Akira Hamamatsu ,  Shinichi Suzuki

IPC分类号： G01N2100

CPC分类号： G01N21/94 ,  G01N21/8806

摘要： An apparatus and method for detecting foreign particle and defect on an object in detection by means of a laser beam, in which the laser beams of different wavelengths are irradiated onto the surface of the object in detection from different angles and the state of foreign particle and defect is separately detected according to the output level of the scattered light reflected from that surface. Further, it is arranged such that the scattered light reflected from the object onto which the laser beam is irradiated from the sole source or the plurality of sources is detected in plural directions, which detecting result is compared for the detection of the directivity of said scattered light in reflection.

摘要翻译： 一种用于通过激光束检测物体中的异物和在物体上的缺陷的装置和方法，其中不同波长的激光束从不同的角度和外来粒子的状态被检测到被检测物体的表面，并且 根据从该表面反射的散射光的输出电平分别检测缺陷。 另外，从多个方向检测从单个源或多个源照射激光束的物体所反射的散射光，将该检测结果进行比较，以检测所述散射的方向性 光反射。

公开(公告)号：US06650409B1

公开(公告)日：2003-11-18

申请号：US08617270

申请日：1996-03-14

申请人： Minori Noguchi ,  Yukio Kembo ,  Hiroshi Morioka ,  Hidetoshi Nishiyama ,  Hideaki Doi ,  Masataka Shiba ,  Yoshiharu Shigyo ,  Kazuhiko Matsuoka ,  Kenji Watanabe ,  Yoshimasa Ohshima ,  Fumiaki Endo ,  Yuzo Taniguchi

发明人： Minori Noguchi ,  Yukio Kembo ,  Hiroshi Morioka ,  Hidetoshi Nishiyama ,  Hideaki Doi ,  Masataka Shiba ,  Yoshiharu Shigyo ,  Kazuhiko Matsuoka ,  Kenji Watanabe ,  Yoshimasa Ohshima ,  Fumiaki Endo ,  Yuzo Taniguchi

IPC分类号： G01N2189

CPC分类号： H01L21/67288 ,  G01N21/9501 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/681

摘要： A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.

摘要翻译： 半导体器件制造方法和半导体器件制造系统采用具有灰尘粒子检测装置的处理装置。 尘埃粒子检测装置至少在工件加工之前或之后测量附着在工件上的灰尘颗粒的附着状态，管理灰尘颗粒对于每批工件或每个工件的加工产生的增加粘附的条件 基于在处理工件之前或之后测量的粉尘颗粒的粘附测量条件，并根据管理的粘附条件确定处理设备要清洁的时间或清洁处理设备的循环 灰尘颗粒。

公开(公告)号：US07511806B2

公开(公告)日：2009-03-31

申请号：US11931120

申请日：2007-10-31

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/00

CPC分类号： G01N21/9501

摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concave-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

摘要翻译： 一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸， 其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比值表示，其中第二方向与第 第一个方向。

公开(公告)号：US20070153264A1

公开(公告)日：2007-07-05

申请号：US11714196

申请日：2007-03-06

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/88

CPC分类号： G01N21/9501

摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concavo-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

摘要翻译： 一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸， ，其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比率指示，其中第二方向与第 第一个方向。

公开(公告)号：US07187438B2

公开(公告)日：2007-03-06

申请号：US10050776

申请日：2002-01-18

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/00

CPC分类号： G01N21/9501

摘要： The present invention is characterized by the following: incident illumination and oblique illumination are performed on a scratch and a foreign material, which have been made on a surface of a polished or a ground insulating layer, with substantially the same luminous flux; and on the basis of a correlation such as a ratio of intensity of scattered light generated by the shallow scratch and the foreign material between the incident illumination and the oblique illumination, the shallow scratch is discriminated from the foreign material.

摘要翻译： 本发明的特征在于：在具有基本上相同的光通量的在抛光或接地绝缘层的表面上制成的划痕和异物进行入射照明和倾斜照明; 并且基于由浅划痕产生的散射光的强度与入射照明与倾斜照明之间的异物的比例的相关性，浅色划痕被鉴别为异物。

公开(公告)号：US20080117415A1

公开(公告)日：2008-05-22

申请号：US11931120

申请日：2007-10-31

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/898

CPC分类号： G01N21/9501

摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concavo-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

摘要翻译： 一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸， ，其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比率指示，其中第二方向与第 第一个方向。

公开(公告)号：US07315366B2

公开(公告)日：2008-01-01

申请号：US11714196

申请日：2007-03-06

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Hidetoshi Nishiyama ,  Tetsuya Watanabe

IPC分类号： G01N21/00

CPC分类号： G01N21/9501

摘要： A defect-inspecting apparatus including an arrangement to convert detected light into a first signal corresponding to light illuminated by a high-angle illumination optical system and/or a second signal corresponding to light illuminated by a low-angle illumination optical system; and a classification unit which utilizes the first and second signal and classifies defects on the object to be inspected, wherein a defect size is estimated by changing a correction coefficient of the defect size on a basis of a concave-convex level (b/a), where the concavo-convex level (b/a) of a defect is indicated by a ratio of a size b of a first direction of the defect to a size a of a second direction of the defect, where the second direction is lateral to the first direction.

摘要翻译： 一种缺陷检查装置，包括将检测到的光转换成对应于由高角度照明光学系统照射的光的第一信号和/或对应于由低角度照明光学系统照射的光的第二信号的装置; 以及分类单元，其利用所述第一信号和所述第二信号并对所检查的物体进行缺陷分类，其中通过基于凹凸水平（b / a）改变所述缺陷尺寸的校正系数来估计缺陷尺寸， ，其中缺陷的凹凸级（b / a）由缺陷的第一方向的尺寸b与缺陷的第二方向的尺寸a的比率指示，其中第二方向与第 第一个方向。

公开(公告)号：US20050206887A1

公开(公告)日：2005-09-22

申请号：US11128352

申请日：2005-05-13

申请人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

发明人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

IPC分类号： G01N21/00 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01R31/308 ,  H01J37/00 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68

CPC分类号： H01L21/681 ,  B82Y15/00 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/95623 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/12

摘要： An apparatus and method for detecting defects on a specimen includes an illumination optical unit which obliquely projects a laser onto a region which is longer in one direction on a surface of a specimen than in a transverse direction, a table unit which mounts the specimen and which is movable, a detection optical unit which detects light from the specimen illuminated by the laser with an image sensor while the table is moving, and a signal processor. The signal processor processes a signal outputted from the image sensor of the detection optical unit and converted to a digital signal and extracts defects of the specimen by comparing the converted digital signal with a reference digital signal. A display unit displays information of defects extracted by the signal processor.

摘要翻译： 用于检测试样缺陷的装置和方法包括照射光学单元，其将激光倾斜地突出到在一个方向上在一个方向上比在横向方向上更长的区域，安装样本的台单元， 可移动的检测光学单元，检测光学单元，其在桌子移动时利用图像传感器检测由激光照射的样本的光，以及信号处理器。 信号处理器处理从检测光学单元的图像传感器输出的信号并转换为数字信号，并通过将转换的数字信号与参考数字信号进行比较来提取样本的缺陷。 显示单元显示由信号处理器提取的缺陷的信息。

公开(公告)号：US06894773B2

公开(公告)日：2005-05-17

申请号：US09805188

申请日：2001-03-14

申请人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

发明人： Hiroshi Morioka ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Yukio Kembo ,  Hidetoshi Nishiyama ,  Kazuhiko Matsuoka ,  Yoshiharu Shigyo

IPC分类号： G01N21/00 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01R31/308 ,  H01J37/00 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68

CPC分类号： H01L21/681 ,  B82Y15/00 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/95623 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/12

摘要： A processing method for semiconductor devices in a semiconductor fabrication line includes processing a substrate in a first processing apparatus, transferring the substrate processed in the first processing apparatus to a detecting apparatus without removal of the substrate from the semiconductor fabrication line while continuing fabrication of the semiconductor devices, detecting foreign particle defects on the substrate transferred to the detecting apparatus, and determining a foreign particle generation condition of the processing apparatus based on a data from the detecting.

摘要翻译： 半导体制造线中的半导体器件的处理方法包括在第一处理设备中处理衬底，将在第一处理设备中处理的衬底转移到检测设备，而不从半导体制造线移除衬底，同时继续制造半导体 检测转移到检测装置的基板上的异物缺陷，以及根据来自检测的数据确定处理装置的异物生成条件。