公开(公告)号：US09715255B2

公开(公告)日：2017-07-25

申请号：US14318257

申请日：2014-06-27

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Russell S. Aoki ,  Shawn McEuen ,  Mark MacDonald ,  David Pidwerbecki

IPC: G06F1/16

CPC classification number: G06F1/1681 ,  G06F1/1616 ,  H04M1/022

Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a housing, a first shaft rotatable about a first axis, a second shaft rotatable about a second axis, a belt drive assembly to couple the first shaft to the second shaft, and a tension assembly to apply a tension to the belt drive assembly. Other examples may be described.

公开(公告)号：US09612634B2

公开(公告)日：2017-04-04

申请号：US14732519

申请日：2015-06-05

Applicant: Intel Corporation

Inventor： Mark MacDonald ,  Shawn S. McEuen

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1688 ,  H05K7/20 ,  H05K7/20145

Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.

公开(公告)号：US20160252934A1

公开(公告)日：2016-09-01

申请号：US15150728

申请日：2016-05-10

Applicant: Intel Corporation

Inventor： Mark MacDonald

IPC: G06F1/16 ,  G01L19/00 ,  H04B5/00

CPC classification number: G06F1/1654 ,  G01L19/00 ,  G06F1/1616 ,  G06F1/1626 ,  G06F1/1669 ,  G06F1/1679 ,  H04B5/0031

Abstract: Particular embodiments described herein provide for an electronic device that could include a keyboard portion, an attachment mechanism, and a pump located in the keyboard portion that creates a pressure differential in the attachment mechanism such that a display portion can be attached to the keyboard portion. Other particular embodiments described herein provide for an electronic device that could include a display portion, an attachment mechanism located on the display portion, and a pump located in the display portion that can create a pressure differential in the attachment mechanism such that the display portion can be attached to a surface or device.

公开(公告)号：US20160192073A1

公开(公告)日：2016-06-30

申请号：US14583631

申请日：2014-12-27

Applicant: Intel Corporation

Inventor： Rajesh Poornachandran ,  David Gottardo ,  Swarnendu Kar ,  Saurabh Dadu ,  Mark MacDonald

IPC: H04R5/04 ,  H04S7/00 ,  G10L25/30

CPC classification number: H04R5/04 ,  G10L25/30 ,  G10L25/51 ,  H04R1/1008 ,  H04R1/1041 ,  H04R2420/01 ,  H04S7/40

Abstract: A wearable device for binaural audio is described. The wearable device includes a feedback mechanism, a microphone, an always on binaural recorder (AOBR), and a processor. The AOBR is to capture ambient noise via the microphone and interpret the ambient noise. An alert is issued by the processor to the feedback mechanism based on a notification detected via the microphone in the ambient noise.

Abstract translation: 描述了用于双耳音频的可佩戴装置。 可穿戴装置包括反馈机构，麦克风，始终在双耳录音机（AOBR）和处理器。 AOBR是通过麦克风捕获环境噪声并解释环境噪声。 基于在环境噪声中通过麦克风检测的通知，处理器向反馈机制发出警报。

公开(公告)号：US20150316967A1

公开(公告)日：2015-11-05

申请号：US14732519

申请日：2015-06-05

Applicant: Intel Corporation

Inventor： Mark MacDonald ,  Shawn S. McEuen

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F1/1688 ,  H05K7/20 ,  H05K7/20145

Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.

Abstract translation: 对于隐藏的排气热解决方案描述了装置，系统和方法的一些实施例。 装置可以包括围绕一个或多个发热部件布置的外壳，围绕外壳的内周边布置的管道和围绕外壳的外周设置的允许气流进入管道的接缝入口。 描述其他实施例。

公开(公告)号：US09152190B2

公开(公告)日：2015-10-06

申请号：US13710819

申请日：2012-12-11

Applicant: Intel Corporation

Inventor： Douglas Heymann ,  Jered H. Wikander ,  Mark MacDonald

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1616 ,  G06F1/1681 ,  H05K7/20127

Abstract: In one embodiment a housing for an electronic device comprises a first section, a second section, and a collapsible chimney coupled to the first section and the second section to provide an airflow path from a portion of the first section. Other embodiments may be described.

Abstract translation: 在一个实施例中，用于电子设备的壳体包括耦合到第一部分和第二部分的第一部分，第二部分和可折叠烟囱，以从第一部分的一部分提供气流路径。 可以描述其他实施例。

公开(公告)号：US09134757B2

公开(公告)日：2015-09-15

申请号：US13630947

申请日：2012-09-28

Applicant: INTEL CORPORATION

Inventor： Yoshifumi Nishi ,  Mark MacDonald ,  Douglas Heymann

IPC: G06F1/16 ,  G06F1/20

CPC classification number: G06F1/1616 ,  G06F1/203

Abstract: An electronic device is provided that includes a base having a first side and a second side, and a lid having a first side and a second side. The electronic device may also include a heat exchanger provided at the base. The heat exchanger may have a first surface exposed to outside the base.

Abstract translation: 提供了一种电子设备，其包括具有第一侧和第二侧的基座，以及具有第一侧和第二侧的盖。 电子设备还可以包括设置在基座处的热交换器。 热交换器可以具有暴露于基部外部的第一表面。