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    Power-based dynamic adjustment of memory module bandwidth
    1.
    发明授权
    Power-based dynamic adjustment of memory module bandwidth 有权

    公开(公告)号：US10969974B2

    公开(公告)日：2021-04-06

    申请号：US16112461

    申请日：2018-08-24

    Applicant: Intel Corporation

    Inventor： George Vergis ,  Douglas Heymann ,  Dat Le ,  John Goles

    IPC: G11C7/04 ,  G06F3/06 ,  G06F13/16 ,  G11C11/4074 ,  G11C5/14

    Abstract: A memory controller includes a sensor poller and a proportional integral controller (PIC) coupled to the sensor poller. The sensor poller is to obtain a temperature and a power of a memory module (MM) operated by the controller, and the PIC is to: dynamically set at least one bandwidth limit for the MM, based, at least in part, on a relationship between a temperature of the MM, a power of the MM and a bandwidth of the MM. The dynamically set bandwidth limit defines the power of the MM at which the MM operates for a predetermined temperature limit. A system includes a memory controller and a dual in-line memory module (DIMM) operated by it.

    Blower assembly for electronic device
    2.
    发明授权
    Blower assembly for electronic device 有权
    电子设备鼓风机总成

    公开(公告)号：US09291170B2

    公开(公告)日：2016-03-22

    申请号：US13930204

    申请日：2013-06-28

    Applicant: Intel Corporation

    Inventor： Douglas Heymann

    IPC: F04D29/44 ,  F04D29/42 ,  F04D29/28 ,  F04D5/00

    CPC classification number: F04D29/4226 ,  F04D5/00 ,  F04D17/167 ,  F04D29/282 ,  F04D29/283 ,  F04D29/441 ,  F04D29/666

    Abstract: In one embodiment a blower comprises a case comprising a first surface, a second surface opposite the first surface, and a side wall extending between portions of the first surface and the second surface, wherein the side wall comprises an air inlet and an air outlet, an impeller disposed in the case and rotatable about an axis of rotation extending through a hub, wherein the impeller comprises a plurality of blades which define a gap with the hub, wherein portions of the side wall are disposed at least a first distance from the axis of rotation and the impeller is to define a circumferential airflow path within the case, wherein the impeller is to create an airflow in the circumferential airflow path between the air inlet and the air outlet, and a feature disposed in the gap to impede recirculation of air in the case.

    Abstract translation: 在一个实施例中，鼓风机包括壳体，其包括第一表面，与第一表面相对的第二表面和在第一表面和第二表面的部分之间延伸的侧壁，其中侧壁包括空气入口和空气出口， 叶轮，其布置在壳体中并且可围绕延伸穿过轮毂的旋转轴线旋转，其中所述叶轮包括与所述轮毂限定间隙的多个叶片，其中所述侧壁的部分设置成距离所述轴线至少第一距离 并且叶轮将限定壳体内的圆周气流路径，其中叶轮将在空气入口和空气出口之间的圆周气流路径中产生气流，以及设置在间隙中以阻止空气再循环的特征 在这种情况下。

    Decoupling systems
    4.
    发明授权
    Decoupling systems 有权

    公开(公告)号：US10529600B2

    公开(公告)日：2020-01-07

    申请号：US15474171

    申请日：2017-03-30

    Applicant: Intel Corporation

    Inventor： Bassam M. Ziadeh ,  Nathan P. Heckathorne ,  Douglas Heymann

    IPC: H01L21/67 ,  H01L21/683 ,  H01L23/00

    Abstract: A decoupling system includes a deflection plate configured for coupling across a low pressure orifice of a low pressure chamber. The deflection plate includes one or more vacuum pores extending through the deflection plate. A peeling flange is coupled with a remainder of the deflection plate at a compliant joint. A die profile opening extends from the compliant joint around the peeling flange in the shape of a die profile. The die profile opening separates the peeling flange from the remainder of the deflection plate. The peeling flange includes relaxed and peeling configurations configured to decouple a die from a die media. In the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate. In the peeling configuration the peeling flange is deflected, and at least a portion of the flange is spaced from the remainder of the deflection plate.

    Apparatus and method for keeping mobile devices warm in cold climates
    5.
    发明授权
    Apparatus and method for keeping mobile devices warm in cold climates 有权
    在寒冷气候下保持移动设备温暖的设备和方法

    公开(公告)号：US09210991B2

    公开(公告)日：2015-12-15

    申请号：US14193507

    申请日：2014-02-28

    Applicant: Intel Corporation

    Inventor： Yoshifumi Nishi ,  Douglas Heymann

    IPC: A45F5/00 ,  F28D20/02 ,  H05K7/20

    CPC classification number: A45F5/00 ,  A45C5/02 ,  A45C11/00 ,  A45C2011/002 ,  A45F2005/002 ,  A45F2005/006 ,  A45F2200/0516 ,  F28D15/0233 ,  F28D20/02 ,  F28D2020/0004 ,  H05K7/20 ,  H05K7/2039 ,  Y02E60/145

    Abstract: An apparatus and method for keeping mobile devices warm in cold climates are disclosed. A particular embodiment includes: a frame structure wherein a first portion of the frame structure being in proximity to the body of a user to receive body heat from the user, the frame structure including a second portion to support electronic components of the apparatus; and a thermal conduit thermally coupled between the first and second portions of the frame structure, the thermal conduit transferring body heat received at the first portion to the electronic components of the apparatus at the second portion.

    Abstract translation: 公开了一种在寒冷气候中保持移动设备温暖的装置和方法。 一个特定实施例包括：框架结构，其中框架结构的第一部分靠近使用者的身体以从使用者接收身体热量，框架结构包括第二部分以支撑设备的电子部件; 以及热耦合在所述框架结构的所述第一和第二部分之间的热导管，所述热导管将在所述第一部分处接收的体热传递到所述第二部分处的所述设备的电子部件。

    Heat spreaders with staggered fins
    6.
    发明授权
    Heat spreaders with staggered fins 有权

    公开(公告)号：US10211124B2

    公开(公告)日：2019-02-19

    申请号：US15594213

    申请日：2017-05-12

    Applicant: INTEL CORPORATION

    Inventor： Douglas Heymann

    IPC: H01L23/40 ,  H01L23/467 ,  H01L23/433 ,  F28F21/08 ,  H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  G06F1/20

    Abstract: An apparatus is provided which comprises: a first heat spreader surface, a second heat spreader surface, and a plurality of heat spreading fins on, and extending substantially perpendicularly from, the first and second heat spreader surfaces, wherein the plurality of heat spreading fins are arranged substantially parallel to one another in a plurality of substantially linear columns, wherein the columns of heat spreading fins are separated by gap regions wider than the heat spreading fins, and wherein the columns of heat spreading fins on the first heat spreader surface are sited to line up with gap regions between columns of heat spreading fins on the second heat spreader surface when the first and second heat spreader surfaces are aligned. Other embodiments are also disclosed and claimed.

    Thermal solution on latch for sodimm connector
    7.
    发明授权
    Thermal solution on latch for sodimm connector 有权

    公开(公告)号：US10553974B2

    公开(公告)日：2020-02-04

    申请号：US15721546

    申请日：2017-09-29

    Applicant: INTEL CORPORATION

    Inventor： Xiang Li ,  George Vergis ,  Douglas Heymann

    IPC: H01R12/73 ,  H05K1/02 ,  H01R12/83 ,  H01R12/72

    Abstract: Embodiments include devices, systems, and methods relating to removing heat from a memory module in a connector. One embodiment relates to a memory module connector comprising a first arm, a second arm, and a body portion positioned between the first arm and the second arm, the body portion configured to accept a memory module therein. The memory module connector includes a structure coupled to the first arm and configured to be electrically coupled to a printed circuit board. The memory module connector also includes a heat spreader coupled to the first arm, the heat spreader configured to be brought into thermal contact with a memory module component. Other embodiments are described and claimed.

    DECOUPLING SYSTEMS AND METHODS FOR SAME
    10.
    发明申请
    DECOUPLING SYSTEMS AND METHODS FOR SAME 审中-公开

    公开(公告)号：US20180286832A1

    公开(公告)日：2018-10-04

    申请号：US15474171

    申请日：2017-03-30

    Applicant: Intel Corporation

    Inventor： Bassam M. Ziadeh ,  Nathan P. Heckathorne ,  Douglas Heymann

    IPC: H01L23/00

    Abstract: A decoupling system includes a deflection plate configured for coupling across a low pressure orifice of a low pressure chamber. The deflection plate includes one or more vacuum pores extending through the deflection plate. A peeling flange is coupled with a remainder of the deflection plate at a compliant joint. A die profile opening extends from the compliant joint around the peeling flange in the shape of a die profile. The die profile opening separates the peeling flange from the remainder of the deflection plate. The peeling flange includes relaxed and peeling configurations configured to decouple a die from a die media. In the relaxed configuration the peeling flange is coincident with the remainder of the deflection plate. In the peeling configuration the peeling flange is deflected, and at least a portion of the flange is spaced from the remainder of the deflection plate.

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