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公开(公告)号：US10168749B2
公开(公告)日：2019-01-01
申请号：US15366799
申请日：2016-12-01
申请人： Intel Corporation
发明人： Russell S. Aoki , Devdatta P. Kulkarni , Alan W. Tate , Robin A. Steinbrecher , Ralph W. Jensen
摘要： Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.
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公开(公告)号：US10109940B2
公开(公告)日：2018-10-23
申请号：US15377254
申请日：2016-12-13
申请人： INTEL CORPORATION
摘要： Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.
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公开(公告)号：US20170354031A1
公开(公告)日：2017-12-07
申请号：US15172102
申请日：2016-06-02
申请人： Intel Corporation
IPC分类号： H05K1/02 , H01L23/00 , H01L25/065 , H05K1/14 , H05K3/36 , H05K1/18 , H05K3/34 , H01L23/498 , G06F1/16
CPC分类号： H05K1/0271 , G06F1/16 , G06F1/206 , H01L23/49833 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L2224/16145 , H01L2224/73204 , H01L2225/06513 , H01L2225/0652 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/1434 , H01L2924/15311 , H01L2924/15313 , H01L2924/15323 , H05K1/0212 , H05K1/144 , H05K1/181 , H05K3/341 , H05K3/3436 , H05K3/3494 , H05K3/368 , H05K2201/041 , H05K2201/10189 , H05K2201/10325 , H05K2201/10378 , H05K2201/10409 , H05K2201/10734
摘要： An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.
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公开(公告)号：US09715255B2
公开(公告)日：2017-07-25
申请号：US14318257
申请日：2014-06-27
申请人： Intel Corporation
IPC分类号： G06F1/16
CPC分类号： G06F1/1681 , G06F1/1616 , H04M1/022
摘要： In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a housing, a first shaft rotatable about a first axis, a second shaft rotatable about a second axis, a belt drive assembly to couple the first shaft to the second shaft, and a tension assembly to apply a tension to the belt drive assembly. Other examples may be described.
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公开(公告)号：US09696754B2
公开(公告)日：2017-07-04
申请号：US14225933
申请日：2014-03-26
申请人： INTEL CORPORATION
发明人： Russell S. Aoki , Jeff Ku , Sheng-Chao Lin
IPC分类号： G06F1/16
CPC分类号： G06F1/162 , G06F1/1616 , G06F1/1681 , Y10T16/545 , Y10T16/5472 , Y10T29/24
摘要： Techniques for forming a hinge are described herein. The hinge is to couple a first housing of a computing device and a second housing of the computing device. The hinge is to cause the first housing to have three degrees of freedom in movement from the second housing.
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公开(公告)号：US09487981B1
公开(公告)日：2016-11-08
申请号：US14751752
申请日：2015-06-26
申请人： Intel Corporation
发明人： Russell S. Aoki
CPC分类号： G06F1/1618 , G06F1/1681
摘要： A cylindrical dual axis hinge for electronic devices is disclosed. A particular embodiment includes: a primary hinge having a primary pivot with a first axis of rotation, the primary hinge including a primary hinge bracket attachable to a portion of the electronic device; a cylindrical hinge subassembly including a secondary cylindrical hinge rotating portion and a secondary cylindrical hinge fixed portion, the cylindrical hinge subassembly including a secondary pivot with a second axis of rotation different from the first axis of rotation and enabling rotation of the secondary cylindrical hinge rotating portion around the secondary pivot, the cylindrical hinge subassembly being attachable to a portion of the electronic device; and a cylindrical electrical power storage receptacle configured to retain a plurality of electrical power storage elements, the electrical power storage elements being in electrical contact with the electronic device, the cylindrical electrical power storage receptacle being removably attachable to the electronic device.
摘要翻译： 公开了一种用于电子设备的圆柱形双轴铰链。 一个特定的实施例包括：主铰链，具有具有第一旋转轴线的主枢轴，所述主铰链包括可连接到电子设备的一部分的主铰链支架; 圆柱形铰链子组件，其包括次级圆柱形铰链旋转部分和次级圆柱形铰链固定部分，所述圆柱形铰链子组件包括具有不同于第一旋转轴线的第二旋转轴线的次枢轴，并且能够使次级圆柱形铰链旋转部分 围绕次枢轴，圆柱形铰链子组件可附接到电子设备的一部分; 以及圆柱形电力存储容器，其被配置为保持多个电力存储元件，所述电力存储元件与所述电子设备电接触，所述圆柱形电力存储容器可移除地附接到所述电子设备。
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公开(公告)号：US10310565B2
公开(公告)日：2019-06-04
申请号：US15577287
申请日：2015-06-27
申请人： Intel Corporation
摘要： Particular embodiments described herein provide for an electronic device that includes a flexible display and a support for the flexible display. The support includes a main support structure, at least one curve crease, and a curve region, wherein the curve region includes a curve support.
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公开(公告)号：US10260961B2
公开(公告)日：2019-04-16
申请号：US14975938
申请日：2015-12-21
申请人： Intel Corporation
发明人： Shelby Ferguson , Rashelle Yee , Russell S. Aoki , Michael Hui , Jonathon Robert Carstens , Joseph J. Jasniewski
IPC分类号： G01K7/00 , G01K1/00 , G01K7/16 , H01L23/34 , H01L23/00 , H01L23/31 , H01L23/473 , H01L25/065
摘要： Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.
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公开(公告)号：US20180352649A1
公开(公告)日：2018-12-06
申请号：US15777860
申请日：2016-06-02
申请人： Intel Corporation
IPC分类号： H05K1/02 , B23K1/00 , H01L23/498 , H05B1/02 , H05K1/14 , B23K101/42
CPC分类号： H05K1/0271 , B23K1/0016 , B23K2101/42 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L2224/16225 , H01L2924/15311 , H05B1/0233 , H05K1/0212 , H05K1/141 , H05K2201/041 , H05K2201/10378
摘要： An apparatus is provided which comprises: a processor substrate extended away from a processor die, wherein the processor substrate has at least one signal interface which is connectable to a connector; and an interposer coupled to the processor substrate and a motherboard. Described is an apparatus which comprises: a processor substrate extended away from a processor die, wherein the processor substrate has at least one signal interface; and a motherboard coupled to the processor substrate, wherein the motherboard is configured to have a hole which is large enough to place a connector at least partially in it to couple with the at least one signal interface.
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公开(公告)号：US20180350767A1
公开(公告)日：2018-12-06
申请号：US16054009
申请日：2018-08-03
申请人： Intel Corporation
IPC分类号： H01L23/00 , B23K1/00 , B23K1/008 , B23K1/19 , B23K1/20 , B23K3/06 , B23K3/08 , H01L23/34 , H01L23/498 , B23K101/42 , H05K3/12 , H05K3/34
CPC分类号： H01L24/81 , B23K1/0016 , B23K1/008 , B23K1/19 , B23K1/206 , B23K3/06 , B23K3/0638 , B23K3/082 , B23K2101/42 , H01L23/345 , H01L23/49816 , H01L24/75 , H01L2224/81007 , H01L2224/81024 , H01L2224/81035 , H01L2224/81234 , H01L2224/81815 , H01L2924/15321 , H05K3/1225 , H05K3/3436 , H05K2201/10378 , H05K2203/166
摘要： Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.
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