公开(公告)号：US20090086432A1

公开(公告)日：2009-04-02

申请号：US11862328

申请日：2007-09-27

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28D15/00

CPC分类号： H05K7/20754

摘要： A docking station is provided for cooling an electronics rack of a data center. The docking station includes an enclosure having at least one wall, a cover coupled to the at least one wall, and a central opening sized to receive the electronics rack therein through an access opening in the wall. The enclosure is separate and freestanding from the electronics rack, and when the electronics rack is operatively positioned within the central opening, the enclosure surrounds the electronics rack and facilitates establishing a closed loop airflow path passing through air inlet and outlet sides of the rack and through an air return pathway of the enclosure. The docking station further includes an air-to-liquid heat exchange assembly disposed within the air return pathway of the enclosure for cooling circulating air passing through the closed loop airflow path.

摘要翻译： 提供对接站用于冷却数据中心的电子机架。 对接站包括具有至少一个壁的壳体，耦合到至少一个壁的盖，以及大小适于通过壁中的进入开口将电子机架接纳到其中的中心开口。 外壳与电子机架分开独立，并且当电子机架可操作地定位在中央开口内时，外壳围绕电子机架，并有助于建立通过机架的空气入口和出口侧的闭环气流路径，并通过 外壳的空气返回路径。 对接站还包括设置在外壳的空气返回路径内的空气 - 液体热交换组件，用于冷却通过闭环气流路径的循环空气。

公开(公告)号：US20080307806A1

公开(公告)日：2008-12-18

申请号：US11762822

申请日：2007-06-14

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28C1/00 ,  F28D15/00 ,  H05K7/20

CPC分类号： F28D20/021 ,  F24F5/0017 ,  H05K7/2079 ,  H05K7/20836 ,  Y02E60/145 ,  Y02E60/147

摘要： A cooling system and method are provided which include a facility cooling unit, a cooling tower, and one or more thermal capacitor units. The facility cooling unit, which includes a heat dissipation coolant loop, facilitates thermal energy extraction from a facility, such as a data center, for expelling of the energy to coolant within the heat dissipation coolant loop. The cooling tower is in fluid communication with the coolant loop, and includes a liquid-to-air heat exchanger for expelling thermal energy from coolant of the heat dissipation coolant loop to the surrounding environment. The thermal capacitor unit is in fluid communication with the heat dissipation coolant loop to facilitate efficient thermal energy transfer from coolant with in the coolant loop to the surrounding environment with variation in ambient temperature about the cooling tower.

摘要翻译： 提供了一种冷却系统和方法，其包括设备冷却单元，冷却塔和一个或多个热电容器单元。 包括散热冷却剂回路的设备冷却单元有助于从诸如数据中心的设备的热能提取，以将能量排出到散热冷却剂回路内的冷却剂。 冷却塔与冷却剂回路流体连通，并且包括用于将热能从散热冷却剂回路的冷却剂排出到周围环境的液体 - 空气热交换器。 热电容器单元与散热冷却剂回路流体连通，以便在冷却剂回路中的冷却剂与围绕冷却塔周围环境温度变化的周围环境有效的热能传递。

公开(公告)号：US20130107447A1

公开(公告)日：2013-05-02

申请号：US13285105

申请日：2011-10-31

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G06F1/20 ,  F28F13/00

CPC分类号： H05K7/20709 ,  H05K7/20781

摘要： A multi-rack assembly is provided which includes adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

摘要翻译： 提供了一种多机架组件，其包括相邻的第一和第二电子机架，每个电子机架至少部分地是空气冷却的，以及与第一机架相关联的空气与液体热交换器，用于冷却通过 第一个机架。 该热交换器设置在第一齿条的空气入口或空气出口侧，并且与冷却剂回路流体连通地连接以接收来自回路的冷却剂并将冷却剂排出到回路，将来自经过其的空气的热量传递给冷却剂 通过 组件还包括与第一齿条相关联的冷却单元和冷却剂回路中的冷却冷却剂，以及与第二齿条相关联的气流引导件，并且便于管道通过第二齿条的至少一部分空气也穿过热 交换机与第一个机架相关联。

公开(公告)号：US20130105120A1

公开(公告)日：2013-05-02

申请号：US13281945

申请日：2011-10-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/02

CPC分类号： H05K7/203 ,  H05K7/20809

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s), and a boiling fluid mixture of first and second dielectric fluids within the fluid-tight compartment, with the electronic component(s) immersed within the mixture. A condensing fluid is also provided within the fluid-tight compartment, and is immiscible with the boiling fluid mixture. The condensing fluid has a lower specific gravity and a higher thermal conductivity than the boiling fluid mixture, and facilitates condensing of vaporized boiling fluid mixture. A cooling structure is provided within the compartment, and includes a condensing region and a sub-cooling region, with the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture. The cooling structure facilitates heat removal from the fluid-tight compartment.

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括至少部分围绕电子部件周围并形成流体密封的隔室的壳体，以及流体密封室内的第一和第二介电流体的沸腾流体混合物，其中电子部件 浸在混合物中。 冷凝流体也设置在流体密封室内，并与沸腾的流体混合物不混溶。 冷凝液具有比沸腾流体混合物更低的比重和更高的热导率，并且有助于蒸发的沸腾流体混合物的冷凝。 冷却结构设置在隔室内，并且包括冷凝区域和副冷却区域，其中冷凝区域与冷凝流体接触，并且副冷却区域与沸腾流体混合物接触。 冷却结构便于从流体密封隔室中的热量去除。

公开(公告)号：US20130091867A1

公开(公告)日：2013-04-18

申请号：US13271304

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B21/02 ,  B23P15/26

CPC分类号： F25B21/02 ,  B23P15/26 ,  F25B43/00 ,  F25B43/003 ,  F25B2400/01 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49359

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩式制冷系统，其包括膨胀部件，蒸发器，压缩机和流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通的污染物分离器。 分离器包括制冷剂冷滤器和热电阵列。 通过制冷剂流路的制冷剂的至少一部分通过冷过滤器，并且热电阵列向冷过滤器提供冷却以冷却通过过滤器的制冷剂。 通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在冷过滤器中。 分离器还可以包括耦合到热电阵列的热侧的制冷剂热过滤器，用于进一步过滤制冷剂。

公开(公告)号：US20130091866A1

公开(公告)日：2013-04-18

申请号：US13271275

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B21/02

CPC分类号： F25B21/02 ,  F25B2400/17 ,  H01L23/38 ,  H01L23/427 ,  H01L35/30 ,  H01L2924/0002 ,  H05K7/203 ,  H05K7/20809 ,  H01L2924/00

摘要： Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser, heat sink, and thermal conductive path are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.

摘要翻译： 提供冷却装置和方法用于浸入冷却一个或多个电子部件。 冷却装置包括壳体，其至少部分围绕电子部件围绕并形成流体密封的隔室，以及布置在流体密封隔室内的电介质流体，电子部件浸入介电流体内。 还提供蒸汽冷凝器，散热器和导热路径。 蒸汽冷凝器包括在流体密封室内延伸的多个导热冷凝器翅片，并且散热器包括第一区域和第二区域，散热片的第一区域与蒸气冷凝器热接触 。 热传导路径以热接触方式将流体密封室和散热器的第二区域耦合，并且包括热电阵列，其有助于将热量从流体密封隔室传导到散热器的第二区域，通过热 传导路径。

公开(公告)号：US20110058637A1

公开(公告)日：2011-03-10

申请号：US12556019

申请日：2009-09-09

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G21C9/004 ,  G21C15/00

CPC分类号： F28D15/00 ,  G05D16/202

摘要： A pressure control unit and method are provided for facilitating single-phase heat transfer within a liquid-based cooling system. The pressure control unit includes a pressure vessel containing system coolant, and a pressurizing mechanism associated with the pressure vessel. A coolant line couples system coolant in the pressure vessel in fluid communication with the coolant loop of the cooling system, and a regulator mechanism couples to the pressurizing mechanism to maintain pressure within the pressure vessel at or above a defined pressure threshold, thus maintaining pressure within the coolant loop above the pressure threshold. The defined pressure threshold is set to facilitate system coolant within the coolant loop remaining single-phase throughout an operational temperature range of the system coolant within the coolant loop. More particularly, the pressure threshold is set to ensure pressure of system coolant within the coolant loop remains above the coolant's saturation pressure at maximum operational temperature.

摘要翻译： 提供了一种压力控制单元和方法，用于促进在液体冷却系统内的单相热传递。 压力控制单元包括容纳系统冷却剂的压力容器和与压力容器相关联的加压机构。 冷却剂管线将压力容器中的系统冷却剂与冷却系统的冷却剂回路流体连通，并且调节器机构联接到加压机构，以将压力容器内的压力维持在或高于限定的压力阈值，从而保持在 冷却剂回路高于压力阈值。 设定的压力阈值被设定为便于在冷却剂回路内的系统冷却剂的整个工作温度范围内，冷却剂回路内的系统冷却剂保持单相。 更具体地，设定压力阈值以确保冷却剂回路内的系统冷却剂的压力在最大工作温度下保持高于冷却剂的饱和压力。

公开(公告)号：US20110056674A1

公开(公告)日：2011-03-10

申请号：US12556053

申请日：2009-09-09

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28F27/00 ,  F28D15/00 ,  F28F9/26

CPC分类号： H05K7/2079

摘要： A cooling system and method are provided for facilitating cooling of multiple liquid-cooled electronics racks. The cooling system includes a main system coolant supply loop with a plurality of system coolant supply branch lines for facilitating supply of cooled system coolant to the electronics racks, and a main system coolant return loop with a plurality of system coolant return branch lines for facilitating return of exhausted system coolant from the electronics racks. When operational, cooled system coolant circulates through the coolant supply loop and exhausted system coolant circulates through the coolant return loop. A plurality of modular cooling units are coupled to the coolant supply loop and coolant return loop. Each modular cooling unit includes a heat exchanger to facilitate cooling of a portion of the exhausted coolant circulating through the main system coolant return loop for return as cooled system coolant to the main system coolant supply loop.

摘要翻译： 提供了一种用于促进多个液冷电子机架的冷却的冷却系统和方法。 冷却系统包括主系统冷却剂供应回路，其具有多个系统冷却剂供应分支管线，以便于将冷却的系统冷却剂供应到电子机架，以及具有多个系统冷却剂返回分支管线以便于返回的主系统冷却剂回流回路 从电子机架排出的系统冷却液。 冷却系统冷却剂在运行时循环通过冷却剂供应回路，排气系统冷却剂循环通过冷却液回流回路。 多个模块化冷却单元联接到冷却剂供应回路和冷却剂回流回路。 每个模块化冷却单元包括热交换器，以便于冷却循环通过主系统冷却剂回流回路的排出冷却剂的一部分，以便作为冷却系统冷却剂返回到主系统冷却剂供应回路。

公开(公告)号：US20100328891A1

公开(公告)日：2010-12-30

申请号：US12491293

申请日：2009-06-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28D15/00 ,  F28F3/08

CPC分类号： F28D15/0266 ,  F28F3/02 ,  F28F3/12 ,  H05K7/20318 ,  H05K7/20809

摘要： Condenser structures and cooling apparatuses are provided which facilitate vapor condensation heat transfer of a coolant employed in cooling an electronic device. The condenser structure includes a thermally conductive condenser block with multiple exposed cavities therein extending from a first main surface towards a second main surface. The condenser block is a monolithic structure, and the first main surface is a coolant vapor condensate formation surface when the condenser structure is operationally facilitating cooling of an electronic device. The exposed cavities extend from the first main surface into the condenser block to increase a condensation surface area of the condenser block, thereby facilitating coolant vapor condensate formation on the condenser block, and thus cooling of the electronic device using a two-phase coolant. The condenser structure also includes coolant-carrying channels for facilitating cooling of the condenser block, and thus vapor condensate formation on the condenser block.

摘要翻译： 提供冷凝器结构和冷却装置，其有利于用于冷却电子设备的冷却剂的蒸气冷凝传热。 冷凝器结构包括其中从第一主表面朝向第二主表面延伸的多个暴露空腔的导热冷凝器块。 冷凝器块是整体结构，并且当冷凝器结构在操作上有助于电子设备的冷却时，第一主表面是冷却剂蒸气冷凝物形成表面。 暴露的空腔从第一主表面延伸到冷凝器块中以增加冷凝器块的冷凝表面积，从而有助于在冷凝器块上形成冷凝剂蒸汽冷凝物，从而使得使用两相冷却剂冷却电子设备。 冷凝器结构还包括用于促进冷凝器块的冷却的冷却剂输送通道，并且因此在冷凝器块上形成蒸汽冷凝物。

公开(公告)号：US20090133866A1

公开(公告)日：2009-05-28

申请号：US11944680

申请日：2007-11-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G05D23/00 ,  F28D15/02

CPC分类号： H05K7/2079 ,  G06F1/20 ,  G06F2200/201

摘要： A hybrid air and liquid coolant conditioning unit is provided for facilitating cooling of electronics rack(s) of a data center. The unit includes a first heat exchange assembly, including a liquid-to-liquid heat exchanger, a system coolant loop and a facility coolant loop, and a second heat exchange assembly, including an air-to-liquid heat exchanger, an air-moving device, and the facility coolant loop. The system coolant loop provides cooled system coolant to the electronics rack(s), and expels heat in the liquid-to-liquid heat exchanger from the electronics rack(s) to the facility coolant. The air-to-liquid heat exchanger extracts heat from the air of the data center and expels the heat to the facility coolant of the facility coolant loop. The facility coolant loop provides chilled facility coolant in parallel to the liquid-to-liquid heat exchanger and the air-to-liquid heat exchanger. In one implementation, the hybrid coolant conditioning unit includes a vapor-compression heat exchange assembly.

摘要翻译： 提供混合式空气和液体冷却剂调节单元以便于数据中心的电子机架的冷却。 该单元包括第一热交换组件，其包括液体 - 液体热交换器，系统冷却剂回路和设备冷却剂回路，以及第二热交换组件，其包括空气 - 液体热交换器，空气移动 设备和设备冷却液回路。 系统冷却剂回路将冷却的系统冷却剂提供给电子机架，并将液体 - 液体热交换器中的热量从电子机架排出到设备冷却剂。 空气 - 液体热交换器从数据中心的空气中提取热量，并将热量排出到设备冷却剂回路的设备冷却剂中。 设备冷却液回路提供与液体 - 液体热交换器和空气 - 液体热交换器并联的冷却设备冷却剂。 在一个实施方案中，混合冷却剂调节单元包括蒸汽压缩热交换组件。