公开(公告)号：US08323521B2

公开(公告)日：2012-12-04

申请号：US12853771

申请日：2010-08-10

Applicant: Jianping Zhao ,  Lee Chen ,  Merritt Funk ,  Toshihisa Nozawa

Inventor： Jianping Zhao ,  Lee Chen ,  Merritt Funk ,  Toshihisa Nozawa

IPC: H01L21/66

CPC classification number: H01J37/3244 ,  H01J37/32192 ,  H01L21/31116 ,  H01L21/32137

Abstract: The invention can provide apparatus and methods of processing a substrate using plasma generation by gravity-induced gas-diffusion separation techniques. By adding or using gases including inert and process gases with different gravities (i.e., ratio between the molecular weight of a gaseous constituent and a reference molecular weight), a two-zone or multiple-zone plasma can be formed, in which one kind of gas can be highly constrained near a plasma generation region and another kind of gas can be largely separated from the aforementioned gas due to differential gravity induced diffusion and is constrained more closer to a wafer process region than the aforementioned gas.

Abstract translation: 本发明可以提供使用通过重力引起的气体扩散分离技术的等离子体生成来处理衬底的装置和方法。 通过添加或使用气体，包括不同重量的惰性气体和工艺气体（即气态成分的分子量与参考分子量之间的比例），可以形成两区或多区等离子体，其中一种 气体可以在等离子体产生区域附近被高度约束，并且由于差分重力感应扩散，另一种气体可以与上述气体大大分离，并且比上述气体更受限于更接近于晶片工艺区域。

公开(公告)号：US20120253497A1

公开(公告)日：2012-10-04

申请号：US13077705

申请日：2011-03-31

Applicant: Daniel J. Prager ,  Merritt Funk ,  Peter Biolsi ,  Ryukichi Shimizu

Inventor： Daniel J. Prager ,  Merritt Funk ,  Peter Biolsi ,  Ryukichi Shimizu

IPC: H01L21/66 ,  G06F19/00

CPC classification number: H01L22/20 ,  H01J37/32082 ,  H01J37/3266 ,  H01L21/31116 ,  H01L21/823871 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention provides a systems and methods for creating Double Pattern (DP) structures on a patterned wafer in real-time using Dual Pattern Contact-Etch (DPCE) processing sequences and associated Contact-Etch-Multi-Input/Multi-Output (CE-MIMO) models. The DPCE processing sequences can include one or more contact-etch procedures, one or more measurement procedures, one or more contact-etch modeling procedures, and one or more contact-etch verification procedures. The CE-MIMO model uses dynamically interacting behavioral modeling between multiple layers and/or multiple contact-etch procedures. The multiple layers and/or the multiple contact-etch procedures can be associated with the creation of lines, trenches, vias, spacers, contacts, and gate structures that can be created during Double Patterning (DP) procedures.

Abstract translation: 本发明提供了一种用于在图案化晶片上实时使用双模式接触蚀刻（DPCE）处理序列和相关联的接触蚀刻多输入/多输出（CE- MIMO）模型。 DPCE处理序列可以包括一个或多个接触蚀刻程序，一个或多个测量程序，一个或多个接触蚀刻建模程序以及一个或多个接触蚀刻验证程序。 CE-MIMO模型使用多层和/或多个接触蚀刻程序之间的动态交互行为建模。 多层和/或多层接触蚀刻程序可以与在双重图案化（DP）程序期间可以创建的线，沟槽，通孔，间隔物，接触和门结构的创建相关联。

公开(公告)号：US20120248322A1

公开(公告)日：2012-10-04

申请号：US13433078

申请日：2012-03-28

Applicant: Merritt Funk ,  Lee Chen ,  Barton Lane ,  Jianping Zhao ,  Radha Sundararajan

Inventor： Merritt Funk ,  Lee Chen ,  Barton Lane ,  Jianping Zhao ,  Radha Sundararajan

IPC: G01T1/185

CPC classification number: H01J37/32935 ,  H01J49/488 ,  H05H1/0081 ,  Y10T29/49002

Abstract: A method of generating a signal representing with an ion energy analyzer for use in determining an ion energy distribution of a plasma. The ion energy analyzer, used for determining an ion energy distribution of a plasma, includes a first grid and a second grid that is spaced away from and electrically isolated from the first grid. The first grid forms a first surface of the ion energy analyzer and is positioned to be exposed to the plasma. The first grid includes a first plurality of openings, which are dimensioned to be less than a Debye length for the plasma. A voltage source and an ion current meter are operably coupled to the second grid, the latter of which is configured to measure an ion flux onto the ion collector and to transmit a signal that represents the measured ion flux. The method includes selectively and variably biasing the second grid relative to the first grid.

Abstract translation: 一种产生用离子能分析仪表示的信号的方法，用于确定等离子体的离子能量分布。 用于确定等离子体的离子能量分布的离子能量分析器包括与第一格栅隔开并与之隔离的第一格栅和第二栅格。 第一栅格形成离子能量分析器的第一表面并定位成暴露于等离子体。 第一栅格包括第一多个开口，其尺寸被设计成小于等离子体的德拜长度。 电压源和离子电流计可操作地耦合到第二栅极，第二栅极被配置为测量离子收集器上的离子通量并传输表示所测量的离子通量的信号。 该方法包括相对于第一格栅选择性地和可变地偏置第二格栅。

公开(公告)号：US07875555B2

公开(公告)日：2011-01-25

申请号：US11947038

申请日：2007-11-29

Applicant: Lee Chen ,  Merritt Funk

Inventor： Lee Chen ,  Merritt Funk

IPC: H01L21/302

CPC classification number: H01L21/32136 ,  H01J37/321 ,  H01J37/32357 ,  H01J37/32449 ,  H01L21/31116 ,  H01L21/32137

Abstract: A method for treating a substrate with plasma over a wide pressure range is described. The method comprises exposing the substrate to a low pressure plasma in a process chamber. Further, the method comprises exposing the substrate to a high pressure plasma in the process chamber.

Abstract translation: 描述了在宽压力范围内用等离子体处理衬底的方法。 该方法包括将基板暴露于处理室中的低压等离子体。 此外，该方法包括将衬底暴露于处理室中的高压等离子体。

公开(公告)号：US20100214545A1

公开(公告)日：2010-08-26

申请号：US12391410

申请日：2009-02-24

Applicant: Merritt Funk ,  Daniel J. Prager ,  Asao Yamashita ,  Radha Sundararajan

Inventor： Merritt Funk ,  Daniel J. Prager ,  Asao Yamashita ,  Radha Sundararajan

IPC: G03B27/42 ,  G03C5/00

CPC classification number: G03B27/42 ,  G03F7/70466

Abstract: The invention can provide apparatus and methods of creating metal gate structures on wafers in real-time using Lithography-Etch-Lithography-Etch (LELE) processing sequence. Real-time data and/or historical data associated with LELE processing sequences can be fed forward and/or fed back as fixed variables or constrained variables in internal-Integrated-Metrology modules (i-IMM) to improve the accuracy of the metal gate structures.

Abstract translation: 本发明可以提供使用光刻蚀刻光刻蚀刻（LELE）处理序列实时地在晶片上形成金属栅极结构的设备和方法。 与LELE处理序列相关联的实时数据和/或历史数据可以作为内部集成计量模块（i-IMM）中的固定变量或约束变量进​​行向前馈送和/或反馈，以提高金属门结构的精度 。

公开(公告)号：US07772544B2

公开(公告)日：2010-08-10

申请号：US11869656

申请日：2007-10-09

Applicant: Lee Chen ,  Merritt Funk

Inventor： Lee Chen ,  Merritt Funk

IPC: H05H3/02

CPC classification number: H05H3/06

Abstract: Method and system for producing a neutral beam source is described. The neutral beam source comprises a plasma generation system for forming a first plasma in a first plasma region, a plasma heating system for heating electrons from the first plasma region in a second plasma region to form a second plasma, and a neutralizer grid for neutralizing ion species from the second plasma in the second plasma region. Furthermore, the neutral beam source comprises a pumping system that enables use of the neutral beam source for semiconductor processing applications, such as etching processes.

Abstract translation: 描述了用于生产中性束源的方法和系统。 中性束源包括用于在第一等离子体区域中形成第一等离子体的等离子体产生系统，用于在第二等离子体区域中从第一等离子体区域加热电子以形成第二等离子体的等离子体加热系统，以及用于中和离子的中和器栅格 来自第二等离子体区域中的第二等离子体的物质。 此外，中性束源包括泵送系统，其能够使用中性束源用于半导体处理应用，例如蚀刻工艺。

公开(公告)号：US20100081285A1

公开(公告)日：2010-04-01

申请号：US12242065

申请日：2008-09-30

Applicant: Lee Chen ,  Merritt Funk ,  Radha Sundararajan

Inventor： Lee Chen ,  Merritt Funk ,  Radha Sundararajan

IPC: H01L21/3065

CPC classification number: H01L21/0273 ,  G03F7/40 ,  H01L21/32139

Abstract: The invention can provide apparatus and methods of processing a substrate in real-time using subsystems and processing sequences created to improve the etch resistance of photoresist materials. In addition, the improved photoresist layer can be used to more accurately control gate and/or spacer critical dimensions (CDs), to control gate and/or spacer CD uniformity, and to eliminate line edge roughness (LER) and line width roughness (LWR).

Abstract translation: 本发明可以提供使用子系统和制造的处理序列来实时处理衬底的装置和方法，以提高光致抗蚀剂材料的耐蚀刻性。 此外，改进的光致抗蚀剂层可用于更精确地控制栅极和/或间隔物临界尺寸（CD），以控制栅极和/或间隔区CD均匀性，并且消除线边缘粗糙度（LER）和线宽粗糙度（LWR ）。

公开(公告)号：US20100036514A1

公开(公告)日：2010-02-11

申请号：US12186668

申请日：2008-08-06

Applicant: Merritt Funk ,  Radha Sundararajan ,  Asao Yamashita ,  Daniel Prager ,  Hyung Joo Lee

Inventor： Merritt Funk ,  Radha Sundararajan ,  Asao Yamashita ,  Daniel Prager ,  Hyung Joo Lee

IPC: G06F19/00

CPC classification number: G05B17/02 ,  Y10S438/924

Abstract: The invention provides a method of processing a wafer using multilayer processing sequences and Multi-Layer/Multi-Input/Multi-Output (MLMIMO) models and libraries that can include one or more measurement procedures, one or more Poly-Etch (P-E) sequences, and one or more metal-gate etch sequences. The MLMIMO process control uses dynamically interacting behavioral modeling between multiple layers and/or multiple process steps. The multiple layers and/or the multiple process steps can be associated with the creation of lines, trenches, vias, spacers, contacts, and gate structures that can be created using isotropic and/or anisotropic etch processes.

Abstract translation: 本发明提供了一种使用多层处理序列和多层/多输入/多输出（MLMIMO）模型以及可以包括一个或多个测量程序，一个或多个聚蚀刻（PE）序列 ，以及一个或多个金属栅极蚀刻序列。 MLMIMO过程控制使用多层和/或多个过程步骤之间的动态交互行为建模。 多层和/或多个工艺步骤可以与可以使用各向同性和/或各向异性蚀刻工艺产生的线，沟槽，通孔，间隔物，接触和栅极结构的产生相关联。

公开(公告)号：US07576018B2

公开(公告)日：2009-08-18

申请号：US11684957

申请日：2007-03-12

Applicant: Merritt Funk

Inventor： Merritt Funk

IPC: H01L21/00

CPC classification number: H01L21/3065 ,  H01L21/02071 ,  H01L21/32136 ,  H01L21/32137 ,  H01L21/67253 ,  H01L21/6838 ,  Y10S438/905 ,  Y10S438/935

Abstract: A method is provided to cause deformation of a substrate during processing of the substrate. The method comprises supporting a substrate on a substrate support in a vacuum chamber for processing; providing backside gas through inlet ports of each of a plurality of groups of ports lying in a respective plurality of areas across the substrate support to a space between the substrate support and the substrate, each of said areas of the substrate support having at least one backside gas inlet port connected to a supply of backside gas and at least one outlet port connected to a vacuum exhaust system; and separately controlling the pressure of the backside gas at different ones of the ports of the plurality to control separately, in areas around the respective ones of said ports, the local pressure force exerted on the backside of the substrate, by separately dynamically controlling at least one valve affecting gas flow to a port of each of said areas while separately dynamically controlling at least one other valve affecting gas flow from the remaining plurality of ports of each of said areas surrounding said port to which gas is introduced.

Abstract translation: 提供了一种在衬底加工期间引起衬底变形的方法。 该方法包括将基板支撑在真空室中用于处理的基板支撑件上; 通过位于基板支撑件的相应多个区域中的多个端口中的每一个的入口端口到基板支撑件和基板之间的空间来提供背侧气体，基板支撑件的每个所述区域具有至少一个背面 连接到后侧气体供应的气体入口和连接到真空排气系统的至少一个出口; 并且分别控制多个端口中的不同端口处的背侧气体的压力，在各个端口周围的区域中分别控制施加在基板的背面上的局部压力，通过分别动态地控制至少 一个阀影响到每个所述区域的端口的气体流动，同时单独地动态地控制影响来自围绕所述引入气体的所述端口的每个所述区域的剩余多个端口的气体流的至少一个其他阀。

公开(公告)号：US07567700B2

公开(公告)日：2009-07-28

申请号：US11390469

申请日：2006-03-28

Applicant: Merritt Funk ,  Radha Sundararajan ,  Daniel Joseph Prager ,  Wesley Natzle

Inventor： Merritt Funk ,  Radha Sundararajan ,  Daniel Joseph Prager ,  Wesley Natzle

IPC: G06K9/00

CPC classification number: G03F7/70625 ,  G03F7/70525

Abstract: A method of processing a wafer is presented that includes creating a pre-processing measurement map using measured metrology data for the wafer including metrology data for at least one isolated structure on the wafer, metrology data for at least one nested structure on the wafer, or mask data. At least one pre-processing prediction map is calculated for the wafer. A pre-processing confidence map is calculated for the wafer. The pre-processing confidence map includes a set of confidence data for the plurality of dies on the wafer. A prioritized measurement site is determined when the confidence data for one or more dies is not within the confidence limits. A new measurement recipe that includes the prioritized measurement site is then created.

Abstract translation: 提出了一种处理晶片的方法，其包括使用测量的用于晶片的测量数据创建预处理测量图，包括晶片上的至少一个隔离结构的测量数据，晶片上的至少一个嵌套结构的度量数据，或 掩码数据。 为晶片计算至少一个预处理预测图。 计算晶片的预处理置信图。 预处理置信图包括晶片上的多个管芯的一组置信数据。 当一个或多个管芯的置信度数据不在置信限度内时，确定优先测量点。 然后创建包含优先测量站点的新测量配方。