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公开(公告)号：US08058724B2
公开(公告)日：2011-11-15
申请号：US11948124
申请日：2007-11-30
申请人： Gamal Refai-Ahmed
发明人： Gamal Refai-Ahmed
IPC分类号： H01L23/373
CPC分类号： H01L23/427 , H01L23/3732 , H01L23/38 , H01L24/13 , H01L24/16 , H01L24/30 , H01L24/33 , H01L2224/73253 , H01L2924/01046 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15311
摘要： Various semiconductor chip thermal management systems and methods are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate and coupling a diamond heat spreader that has a thermoelectric cooler to the semiconductor chip. A vapor chamber is coupled to the diamond heat spreader.
摘要翻译： 公开了各种半导体芯片热管理系统和方法。 在一个方面，提供了一种制造方法，其包括将半导体芯片耦合到基板并将具有热电冷却器的金刚石散热器耦合到半导体芯片。 蒸气室耦合到金刚石散热器。
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公开(公告)号：US07911791B2
公开(公告)日：2011-03-22
申请号：US12490805
申请日：2009-06-24
CPC分类号： H01L23/467 , F28D15/02 , F28F1/34 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell.
摘要翻译： 公开了各种散热器，其使用方法和制造方法。 一方面，提供了一种为电路装置提供热管理的方法。 该方法包括将散热器放置成与电路装置热接触，其中散热器包括与电路装置热接触的基座部件，耦合到基部部件的第一壳体，其包括第一倾斜内表面，下端和 在下端的第一组多个孔以使流体能够转移第一壳体，以及至少一个额外的壳体，其联接到基部构件并嵌套在第一壳体内。 所述至少一个附加壳体包括第二倾斜内表面和第二多个孔口，以使流体能够转移至少一个附加壳体。 流体通过第一壳体和至少一个附加壳体移动。
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公开(公告)号：US20100314093A1
公开(公告)日：2010-12-16
申请号：US12795139
申请日：2010-06-07
申请人： Gamal Refai-Ahmed , Milnes David , Amy Marconnet , Josef Miler , Roger Flynn , Kenneth E. Goodson
发明人： Gamal Refai-Ahmed , Milnes David , Amy Marconnet , Josef Miler , Roger Flynn , Kenneth E. Goodson
CPC分类号： G05D23/192 , F28D15/0266 , F28D21/0015 , F28F27/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Various apparatus and methods for thermally managing a heat generating device. In one aspect, a method of thermally managing a heat generating device is provided that includes placing a heat exchanger in thermal communication with the heat generating device. The heat exchanger has an interior space. A membrane is in the interior space between a first chamber and a second chamber. The membrane has a gas impermeable portion and at least one gas permeable portion to enable vapor bubbles in the second chamber to pass through the membrane at the at least one gas permeable portion and into the first chamber. A liquid is moved through the second chamber.
摘要翻译： 用于热管理发热装置的各种装置和方法。 一方面，提供了一种热管理发热装置的方法，其包括将热交换器放置成与所述发热装置热连通。 热交换器具有内部空间。 膜位于第一室和第二室之间的内部空间中。 膜具有气体不可渗透部分和至少一个气体可渗透部分，以使第二腔室中的气泡能够在至少一个气体可渗透部分处穿过膜并进入第一腔室。 液体移动通过第二室。
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公开(公告)号：US20100103619A1
公开(公告)日：2010-04-29
申请号：US12582896
申请日：2009-10-21
申请人： Gamal Refai-Ahmed , Geoff Lyon , Khalid Sheltami
发明人： Gamal Refai-Ahmed , Geoff Lyon , Khalid Sheltami
IPC分类号： H05K7/20 , B23P11/00 , H01L23/367 , H01L23/473
CPC分类号： H01L23/473 , H01L23/4006 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： Various circuit board fluid cooling systems and methods of using the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a first member to a circuit board where the first member has a first opening with a first internal footprint. A heat exchanger is removably coupled to the first member to transfer heat from at least one component of the circuit board. The heat exchanger has an external footprint adapted so that at least a portion of the heat exchanger fits in the first opening. A plate is coupled to the circuit board to transfer heat from at least one component of the circuit board. A fluid supply line and a fluid return line are coupled to the heat exchanger such that one of the fluid supply line and the fluid return line is thermal contact with the plate to transfer heat therefrom.
摘要翻译： 公开了各种电路板流体冷却系统及其使用方法。 在一个方面，提供了一种制造方法，其包括将第一构件耦合到电路板，其中第一构件具有第一内部占地面积的第一开口。 热交换器可移除地联接到第一构件以传递来自电路板的至少一个部件的热量。 热交换器具有适于使得热交换器的至少一部分装配在第一开口中的外部尺寸。 板耦合到电路板以从电路板的至少一个部件传递热量。 流体供应管线和流体返回管线联接到热交换器，使得流体供应管线和流体返回管线中的一个与板热接触以传递热量。
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公开(公告)号：US20080253087A1
公开(公告)日：2008-10-16
申请号：US11733586
申请日：2007-04-10
IPC分类号： H05K7/20
CPC分类号： F04D25/08 , F04D25/082 , G06F1/206 , H05K7/20727
摘要： A configurable multiple inlet thermal management device, such as an air-mover or passive heat sink, for electronic devices. The thermal management device is arranged on a computing device or on a component of a computing device or similar, such as an expansion module or alike, so that incoming air flow decreases the temperature of the heat producing components. In order to provide best possible air flow the air-mover comprises blade design that pressurizes the air flow from at least one side of the air-mover component. The air-mover includes removable covers for providing the openings required for intake air from the desired direction and for providing a fan wind. Depending on the application the openings may be permanently opened or closed. The intake air flow is then directed in form of fan wind towards the heat producing elements.
摘要翻译： 用于电子设备的可配置的多入口热管理装置，例如空气推动器或被动散热器。 热管理装置布置在计算设备上或计算设备或类似部件的组件上，例如扩展模块或类似物，使得进入的空气流量降低了发热部件的温度。 为了提供最佳可能的空气流动，空气推动器包括对来自促动器部件的至少一侧的空气流加压的叶片设计。 空气推动器包括可移除的盖，用于提供从所需方向进入的空气所需的开口和用于提供风扇风。 根据应用，开口可以永久地打开或关闭。 然后将进气流以风扇风的形式引向发热元件。
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公开(公告)号：US20070047211A1
公开(公告)日：2007-03-01
申请号：US11162163
申请日：2005-08-31
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.
摘要翻译： 将热管理装置热耦合到电路基板的至少一个发热部件的装置包括至少第一部分，其适于耦合到热管理装置，以及至少第二部分，其适于耦合到 热管理装置。 第一部分和第二部分可以相对于彼此对称地布置。 第一部分和第二部分适于使热管理装置以第一弹簧偏压热耦合到发热部件。 第一部分和第二部分还适于将热管理装置与第二弹簧偏压热耦合到发热部件。
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公开(公告)号：US06915036B2
公开(公告)日：2005-07-05
申请号：US10269356
申请日：2002-10-11
申请人： Ketan Bhalla , Andre Lortie , Kyle Edginton , James Moser , Gamal Refai-Ahmed , Marc Nadeau , Ross Saunders , Lee Shyue Choong
发明人： Ketan Bhalla , Andre Lortie , Kyle Edginton , James Moser , Gamal Refai-Ahmed , Marc Nadeau , Ross Saunders , Lee Shyue Choong
CPC分类号： H04J14/02 , H04J3/04 , H04J3/1611 , H04J2203/0025 , H04J2203/0026 , H04Q11/0071
摘要： A field reconfigurable muxponder for use in an optical transport system. The muxponder includes one or more tributary cards, where each tributary card is adapted to receive an optical data signal and conditions the optical data signal into an intermediate data signal constituted in accordance with a tributary interface format. In this way, the muxponder is able to aggregate optical data signals having different protocols and/or different data rates. The muxponder further includes a chassis that is adapted to receive a predefined number of tributary cards and outputs an optical system signal independently from the availability of the optical data signals from the tributary cards. The tributary cards and the chassis integrally form one line card.
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