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61.发明申请METHOD AND STRUCTURE FOR FORMING HIGH PERFORMANCE MOS CAPACITOR ALONG WITH FULLY DEPLETED SEMICONDUCTOR ON INSULATOR DEVICES ON THE SAME CHIP 有权在完全绝缘的半导体上形成高性能MOS电容器的方法和结构在相同芯片上的绝缘体器件上公开(公告)号：US20110175152A1
公开(公告)日：2011-07-21
申请号：US12689743
申请日：2010-01-19
CPC分类号： H01L21/845 , H01L27/1211 , H01L28/40
摘要： An integrated circuit is provided that includes a fully depleted semiconductor device and a capacitor present on a semiconductor on insulator (SOI) substrate. The fully depleted semiconductor device may be a finFET semiconductor device or a planar semiconductor device. In one embodiment, the integrated circuit includes a substrate having a first device region and a second device region. The first device region of the substrate includes a first semiconductor layer that is present on a buried insulating layer. The buried insulating layer that is in the first device region is present on a second semiconductor layer of the substrate. The second device region includes the second semiconductor layer, but the first semiconductor layer and the buried insulating layer are not present in the second device region. The first device region includes the fully depleted semiconductor device. A capacitor is present in the second device region.
摘要翻译： 提供了一种集成电路，其包括完全耗尽的半导体器件和存在于半导体绝缘体（SOI））衬底上的电容器。 完全耗尽的半导体器件可以是finFET半导体器件或平面半导体器件。 在一个实施例中，集成电路包括具有第一器件区域和第二器件区域的衬底。 衬底的第一器件区域包括存在于掩埋绝缘层上的第一半导体层。 在第一器件区域中的掩埋绝缘层存在于衬底的第二半导体层上。 第二器件区域包括第二半导体层，但是第二器件区域中不存在第一半导体层和掩埋绝缘层。 第一器件区域包括完全耗尽的半导体器件。 电容器存在于第二器件区域中。
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62.发明授权Electrically programmable π-shaped fuse structures and design process therefore 失效因此电气可编程和形状的熔断器结构和设计过程公开(公告)号：US07784009B2
公开(公告)日：2010-08-24
申请号：US11923833
申请日：2007-10-25
IPC分类号： G06F17/50
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： Electrically programmable fuses for an integrated circuit and design structures thereof are presented, wherein the electrically programmable fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The first terminal portion and the second terminal portion reside over a first support and a second support, respectively, with the first support and the second support being spaced apart, and the fuse element bridging the distance between the first terminal portion over the first support and the second terminal portion over the second support. The fuse, first support and second support define a π-shaped structure in elevational cross-section through the fuse element. The first terminal portion, second terminal portion and fuse element are coplanar, with the fuse element residing above a void. The design structure for the fuse is embodied in a machine-readable medium for designing, manufacturing or testing a design of the fuse.
摘要翻译： 提出了用于集成电路的电可编程保险丝及其设计结构，其中电可编程熔丝具有由熔丝元件互连的第一端子部分和第二端子部分。 第一端子部分和第二端子部分分别驻留在第一支撑件和第二支撑件上，第一支撑件和第二支撑件间隔开，并且熔丝元件将第一端子部分之间的距离跨越第一支撑件和 在第二支撑件上方的第二端子部分。 保险丝，第一支撑件和第二支撑件通过保险丝元件在垂直截面中限定了一个“形”结构。 第一端子部分，第二端子部分和熔丝元件是共面的，其中熔丝元件位于空隙之上。 保险丝的设计结构体现在用于设计，制造或测试保险丝设计的机器可读介质中。
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公开(公告)号：US07759766B2
公开(公告)日：2010-07-20
申请号：US11843047
申请日：2007-08-22
IPC分类号： H01L29/00
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： A thin semiconductor layer is formed and patterned on a semiconductor substrate to form a thin semiconductor fuselink on shallow trench isolation and between an anode semiconductor region and a cathode semiconductor region. During metallization, the semiconductor fuselink is converted to a thin metal semiconductor alloy fuselink as all of the semiconductor material in the semiconductor fuselink reacts with a metal to form a metal semiconductor alloy. The inventive electrical fuse comprises the thin metal semiconductor alloy fuselink, a metal semiconductor alloy anode, and a metal semiconductor alloy cathode. The thin metal semiconductor alloy fuselink has a smaller cross-sectional area compared with prior art electrical fuses. Current density within the fuselink and the divergence of current at the interface between the fuselink and the cathode or anode comparable to prior art electrical fuses are obtained with less programming current than prior art electrical fuses.
摘要翻译： 薄半导体层在半导体衬底上形成并图案化以在浅沟槽隔离上以及在阳极半导体区域和阴极半导体区域之间形成薄的半导体熔丝。 在金属化期间，由于半导体软管中的所有半导体材料与金属反应而形成金属半导体合金，所以将半导体熔融金属转换为薄金属半导体合金熔丝。 本发明的电熔丝包括薄金属半导体合金熔丝，金属半导体合金阳极和金属半导体合金阴极。 与现有技术的电熔丝相比，薄金属半导体合金熔体具有较小的横截面积。 与现有技术的电熔丝相比，可以获得与现有技术的电熔丝相当的在熔丝中的电流密度和在熔丝与阴极或阳极之间的界面处的电流发散度，而不是现有技术的电熔丝。
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公开(公告)号：US07700466B2
公开(公告)日：2010-04-20
申请号：US11828740
申请日：2007-07-26
IPC分类号： H01L21/425 , H01L21/76 , H01L21/20 , H01L21/36 , H01L21/3205 , H01L21/4763 , H01L21/302 , H01L21/461
CPC分类号： H01L29/7391 , H01L23/485 , H01L29/66356 , Y10S438/926 , Y10S438/979
摘要： In one embodiment, a mandrel and an outer dummy spacer may be employed to form a first conductivity type region. The mandrel is removed to form a recessed region wherein a second conductivity type region is formed. In another embodiment, a mandrel is removed from within shallow trench isolation to form a recessed region, in which an inner dummy spacer is formed. A first conductivity type region and a second conductivity region are formed within the remainder of the recessed region. An anneal is performed so that the first conductivity type region and the second conductivity type region abut each other by diffusion. A gate electrode is formed in self-alignment to the p-n junction between the first and second conductivity regions. The p-n junction controlled by the gate electrode, which may be sublithographic, constitutes an inventive tunneling effect transistor.
摘要翻译： 在一个实施例中，可以使用心轴和外部虚拟间隔件来形成第一导电类型区域。 去除心轴以形成其中形成第二导电类型区域的凹陷区域。 在另一个实施例中，心轴从浅沟槽隔离中移除以形成凹陷区域，其中形成内部虚拟间隔物。 第一导电类型区域和第二导电区域形成在凹陷区域的其余部分内。 进行退火，使得第一导电类型区域和第二导电类型区域通过扩散彼此邻接。 栅电极形成为与第一和第二导电区域之间的p-n结自对准。 由栅电极控制的可能是亚光刻的p-n结构成本发明的隧道效应晶体管。
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65.发明授权Electrically programmable π-shaped fuse structures and methods of fabrication thereof 有权电气可编程的pi形熔丝结构及其制造方法公开(公告)号：US07288804B2
公开(公告)日：2007-10-30
申请号：US11372380
申请日：2006-03-09
IPC分类号： H01L27/10
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： Electrically programmable fuse structures for an integrated circuit and methods of fabrication thereof are presented, wherein the electrically programmable fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The first terminal portion and the second terminal portion reside over a first support and a second support, respectively, with the first support and the second support being spaced apart, and the fuse element bridging the distance between the first terminal portion over the first support and the second terminal portion over the second support. The fuse, first support and second support define a α-shaped structure in elevational cross-section through the fuse element. The first terminal portion, second terminal portion and fuse element are coplanar, with the fuse element residing above a void, which in one embodiment is filed by a thermally insulating dielectric material that surrounds the fuse element.
摘要翻译： 提出了用于集成电路的电可编程熔丝结构及其制造方法，其中电可编程熔丝具有由熔丝元件互连的第一端子部分和第二端子部分。 第一端子部分和第二端子部分分别驻留在第一支撑件和第二支撑件上，第一支撑件和第二支撑件间隔开，并且熔丝元件将第一端子部分之间的距离跨越第一支撑件和 在第二支撑件上方的第二端子部分。 保险丝，第一支撑件和第二支撑件在通过熔断元件的正面横截面中限定了α形结构。 第一端子部分，第二端子部分和熔丝元件是共面的，其中熔丝元件位于空隙上方，在一个实施例中，熔断元件由围绕熔丝元件的绝热介电材料覆盖。
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66.发明授权Self aligned impact-ionization MOS (I-MOS) device and methods of manufacture 失效自对准冲击电离MOS（I-MOS）器件及其制造方法公开(公告)号：US08652916B2
公开(公告)日：2014-02-18
申请号：US13426966
申请日：2012-03-22
IPC分类号： H01L21/336
CPC分类号： H01L21/26586 , H01L29/66356 , H01L29/7391
摘要： A method of forming a semiconductor structure, including forming a gate structure on a substrate; performing a first angled implantation on a first side of the gate structure to form a first doped region in the substrate, the first doped region partially extends within a channel of the gate structure and the gate structure blocks the first angled implantation from affecting the substrate on a second side of the gate structure; forming sidewall spacers on sidewalls of the gate; and forming a second doped region in the substrate on the second side of the gate, spaced apart from the channel.
摘要翻译： 一种形成半导体结构的方法，包括在衬底上形成栅极结构; 在所述栅极结构的第一侧上执行第一成角度的注入以在所述衬底中形成第一掺杂区域，所述第一掺杂区域在所述栅极结构的沟道内部分地延伸，并且所述栅极结构阻挡所述第一成角度注入以影响所述衬底 门结构的第二面; 在所述浇口的侧壁上形成侧壁间隔物; 以及在所述栅极的所述衬底的第二侧上形成与所述沟道间隔开的第二掺杂区域。
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公开(公告)号：US20110291166A1
公开(公告)日：2011-12-01
申请号：US12789013
申请日：2010-05-27
IPC分类号： H01L27/06 , H01L21/8242 , H01L21/02
CPC分类号： H01L27/0629 , H01L21/823821 , H01L21/823842 , H01L21/823857 , H01L21/845 , H01L27/1211 , H01L28/91
摘要： An integrated circuit having finFETs and a metal-insulator-metal (MIM) fin capacitor and methods of manufacture are disclosed. A method includes forming a first finFET comprising a first dielectric and a first conductor; forming a second finFET comprising a second dielectric and a second conductor; and forming a fin capacitor comprising the first conductor, the second dielectric, and the second conductor.
摘要翻译： 公开了一种具有finFET和金属 - 绝缘体 - 金属（MIM）鳍片电容器及其制造方法的集成电路。 一种方法包括形成包括第一电介质和第一导体的第一finFET; 形成包括第二电介质和第二导体的第二finFET; 以及形成包括所述第一导体，所述第二电介质和所述第二导体的散热片电容器。
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公开(公告)号：US07875919B2
公开(公告)日：2011-01-25
申请号：US12059174
申请日：2008-03-31
IPC分类号： H01L27/108
CPC分类号： H01L27/0629
摘要： Forming a shallow trench capacitor in conjunction with an FET by forming a plurality of STI trenches; for the FET, implanting a first cell well having a first polarity between a first and a second of the STI trenches; for the capacitor, implanting a second cell well having a second polarity in an area of a third of the STI trenches; removing dielectric material from the third STI trench; forming a gate stack having a first portion located between the first and the second of the STI trenches and a second portion located over and extending into the third trench; and performing a source/drain implant of the same polarity as the second cell well, thereby forming a FET in the first cell well, and a capacitor in the second cell well. The second polarity may be opposite from the first polarity. An additional implant may reduce ESR in the second cell well.
摘要翻译： 通过形成多个STI沟槽与FET结合形成浅沟槽电容器; 对于FET，在第一和第二STI沟槽之间注入具有第一极性的第一单元阱; 对于电容器，在第三个STI沟槽的区域中注入具有第二极性的第二单元阱; 从第三STI沟槽去除电介质材料; 形成具有位于所述STI沟槽的所述第一和第二STI沟槽之间的第一部分和位于所述第三沟槽中并延伸到所述第三沟槽中的第二部分的栅极堆叠; 并且执行与第二单元阱相同极性的源极/漏极注入，从而在第一单元阱中形成FET，以及在第二单元阱中形成电容器。 第二极性可以与第一极性相反。 额外的植入物可以减少第二细胞中的ESR。
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公开(公告)号：US20100230781A1
公开(公告)日：2010-09-16
申请号：US12537473
申请日：2009-08-07
IPC分类号： H01L23/525 , H01L21/768
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： Trench anti-fuse structures, design structures embodied in a machine readable medium for designing, manufacturing, or testing a programmable integrated circuit. The anti-fuse structure includes a trench having a plurality of sidewalls that extend into a substrate, a doped region in the semiconductor material of the substrate proximate to the sidewalls of the trench, a conductive plug in the trench, and a dielectric layer on the sidewalls of the trench. The dielectric layer is disposed between the conductive plug and the doped region. The dielectric layer is configured so that a programming voltage applied between the doped region and the conductive plug causes a breakdown of the dielectric layer within a region of the trench. The trench sidewalls are arranged with a cross-sectional geometrical shape that is independent of position between a bottom wall of the deep trench and a top surface of the substrate.
摘要翻译： 沟槽反熔丝结构，设计结构体现在用于设计，制造或测试可编程集成电路的机器可读介质中。 反熔丝结构包括具有延伸到衬底中的多个侧壁的沟槽，靠近沟槽侧壁的衬底的半导体材料中的掺杂区域，沟槽中的导电插塞以及沟槽中的介电层 沟槽的侧壁。 电介质层设置在导电插塞和掺杂区域之间。 电介质层被配置为使得施加在掺杂区域和导电插塞之间的编程电压导致沟槽区域内的电介质层的击穿。 沟槽侧壁布置成具有与深沟槽的底壁和基板的顶表面之间的位置无关的横截面几何形状。
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70.发明授权Embedded trench capacitor having a high-k node dielectric and a metallic inner electrode 有权具有高k节点电介质和金属内电极的嵌入式沟槽电容器公开(公告)号：US07671394B2
公开(公告)日：2010-03-02
申请号：US11873728
申请日：2007-10-17
IPC分类号： H01L27/106 , H01L21/8242
CPC分类号： H01L27/1087
摘要： A deep trench is formed in a semiconductor substrate and a pad layer thereupon, and filled with a dummy node dielectric and a dummy trench fill. A shallow trench isolation structure is formed in the semiconductor substrate. A dummy gate structure is formed in a device region after removal of the pad layer. A first dielectric layer is formed over the dummy gate structure and a protruding portion of the dummy trench fill and then planarized. The dummy structures are removed. The deep trench and a cavity formed by removal of the dummy gate structure are filled with a high dielectric constant material layer and a metallic layer, which form a high-k node dielectric and a metallic inner electrode of a deep trench capacitor in the deep trench and a high-k gate dielectric and a metal gate in the device region.
摘要翻译： 在半导体衬底和衬垫层中形成深沟槽，并填充有虚拟节点电介质和虚设沟槽填充物。 在半导体衬底中形成浅沟槽隔离结构。 去除焊盘层之后，在器件区域中形成虚拟栅极结构。 在虚拟栅极结构上形成第一电介质层，并且填充虚拟沟槽的突出部分，然后进行平坦化。 虚拟结构被去除。 深沟槽和通过去除伪栅极结构形成的空腔填充有高介电常数材料层和金属层，其形成深沟槽中的高k节点电介质和深沟槽电容器的金属内电极 以及在器件区域中的高k栅极电介质和金属栅极。
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