Method for manufacturing a semiconductor device and semiconductor device with overlay mark
    63.
    发明申请
    Method for manufacturing a semiconductor device and semiconductor device with overlay mark 审中-公开
    用于制造具有覆盖标记的半导体器件和半导体器件的方法

    公开(公告)号:US20050026385A1

    公开(公告)日:2005-02-03

    申请号:US10932032

    申请日:2004-09-02

    CPC分类号: G03F7/70633

    摘要: In a method for forming a semiconductor device and a semiconductor device having an overlay mark, a first pattern for the semiconductor device is formed in a semiconductor device formation region of a semiconductor substrate and simultaneously in a first mark formation region of the semiconductor substrate. A second pattern for the semiconductor device is formed on a resultant structure in the semiconductor device formation region of the semiconductor substrate and simultaneously in a second mark formation region of the semiconductor substrate. The first and second patterns in the first and second mark formation regions, respectively, are inspected for misalignments using overlay marks formed to have shapes and sizes identical to those of real patterns in the semiconductor device formation region of the semiconductor substrate. By measuring misalignments of real patterns using the overlay marks, overlay mismatch between the semiconductor device formation region and the overlay mark may be prevented.

    摘要翻译: 在用于形成半导体器件的方法和具有覆盖标记的半导体器件中,半导体器件的第一图案形成在半导体衬底的半导体器件形成区域中,同时在半导体衬底的第一标记形成区域中形成。 在半导体衬底的半导体器件形成区域中的合成结构上形成半导体器件的第二图案,并且同时在半导体衬底的第二标记形成区域中形成半导体器件的第二图案。 使用形成为具有与半导体衬底的半导体器件形成区域中的实际图案的形状和尺寸相同的形状和尺寸的覆盖标记来分别检查第一和第二标记形成区域中的第一和第二图案的未对准。 通过使用覆盖标记测量实际图案的不对准,可以防止半导体器件形成区域和覆盖标记之间的覆盖不匹配。

    Overlay mark and method of forming the same
    69.
    发明授权
    Overlay mark and method of forming the same 有权
    叠加标记和形成方法

    公开(公告)号:US07736844B2

    公开(公告)日:2010-06-15

    申请号:US11826745

    申请日:2007-07-18

    IPC分类号: G03F1/00 H01L23/544

    CPC分类号: G03F7/70633

    摘要: An overlay mark may include a main overlay pattern and an auxiliary overlay pattern, wherein the main overlay pattern may have an opening exposing a substrate and the auxiliary overlay pattern may be formed in the opening. The auxiliary overlay pattern may be spaced apart from a sidewall of the main overlay pattern defining the opening. The thickness ratio of the auxiliary overlay pattern to the main overlay pattern may be about 0.05:1 to about 0.30:1. Accordingly, overlay accuracy measurements may be improved using the clearer overlay mark according to example embodiments.

    摘要翻译: 覆盖标记可以包括主覆盖图案和辅助覆盖图案,其中主覆盖图案可以具有暴露基板的开口,并且可以在开口中形成辅助覆盖图案。 辅助覆盖图案可以与限定开口的主覆盖图案的侧壁间隔开。 辅助覆盖图案与主覆盖图案的厚度比可以为约0.05:1至约0.30:1。 因此,可以使用根据示例性实施例的更清晰的覆盖标记来改善覆盖精度测量。