公开(公告)号：US20120218698A1

公开(公告)日：2012-08-30

申请号：US13035921

申请日：2011-02-26

申请人： William L. Brodsky ,  Eric J. McKeever ,  John G. Torok

发明人： William L. Brodsky ,  Eric J. McKeever ,  John G. Torok

IPC分类号： G06F1/16

CPC分类号： G06F1/183

摘要： A system to mate electronic assemblies may include a computer backplane, and a first electronic interconnect carried by the computer backplane configured to operationally mate with a first electronic assembly. The system may also include a second electronic interconnect carried by the computer backplane that is physically separate from the first electronic interconnect, the second electronic interconnect configured to operationally mate with a second electronic assembly where the first electronic assembly and the second electronic assembly mate with the computer backplane at substantially a same time.

摘要翻译： 配合电子组件的系统可以包括计算机背板和由计算机背板承载的第一电子互连，其被配置为可操作地与第一电子组件交配。 该系统还可以包括由计算机背板承载的与第一电子互连物理分离的第二电子互连，第二电子互连配置成与第二电子组件可操作地配合，其中第一电子组件和第二电子组件与 计算机底板。

公开(公告)号：US20100221944A1

公开(公告)日：2010-09-02

申请号：US12781033

申请日：2010-05-17

申请人： Dennis R. Barringer ,  William L. Brodsky ,  Francesco Chiarella ,  John J. Loparco ,  Michael F. Scanlon ,  John G. Torok

发明人： Dennis R. Barringer ,  William L. Brodsky ,  Francesco Chiarella ,  John J. Loparco ,  Michael F. Scanlon ,  John G. Torok

IPC分类号： H01R13/62

CPC分类号： H05K7/1407

摘要： A mechanism for electrically connecting a first electronic component to a second electronic component includes an actuating member disposed in the first electronic component including a first connector half and an actuation screw having a head and a threaded end. The actuation screw is located in the first electronic component wherein rotation of the actuation screw urges the actuating member in a direction substantially perpendicular to an axis of the actuation screw thereby engaging the first connector half to a second connector half disposed in the second electronic component.

摘要翻译： 用于将第一电子部件电连接到第二电子部件的机构包括设置在第一电子部件中的致动部件，其包括第一连接器半部和具有头部和螺纹端部的致动螺钉。 致动螺钉位于第一电子部件中，其中致动螺杆的旋转沿着基本上垂直于致动螺钉的轴线的方向推动致动构件，从而将第一连接器半部接合到设置在第二电子部件中的第二连接器半体。

公开(公告)号：US07393244B1

公开(公告)日：2008-07-01

申请号：US11683519

申请日：2007-03-08

申请人： William L. Brodsky ,  Amanda E. E. Mikhail ,  Scott A. Shurson

发明人： William L. Brodsky ,  Amanda E. E. Mikhail ,  Scott A. Shurson

IPC分类号： H01R13/60

CPC分类号： H01R12/707 ,  H01R12/7029 ,  H01R12/7047

摘要： An apparatus for supporting at least one electrical connector body, the apparatus includes a connector housing mountable to a printed circuit board (PCB). The connector housing includes at least one base member for attachment to the PCB; and at least one support post each spaced apart from one another and extending from the at least one base member. The support posts inserted into one or more clearance holes in the PCB are configured to receive the one or more support posts. When a lateral force is applied to the connector body, the support posts acts as a support and transfers the lateral force to the PCB, thereby reducing a rotational moment at a base of each connector body connected to the PCB.

摘要翻译： 一种用于支撑至少一个电连接器主体的装置，该装置包括可安装到印刷电路板（PCB）的连接器壳体。 连接器壳体包括至少一个用于附接到PCB的基座构件; 以及至少一个支撑柱，每个支撑柱彼此间隔开并且从所述至少一个基部构件延伸。 插入到PCB中的一个或多个间隙孔中的支撑柱被配置为接收一个或多个支撑柱。 当侧向力施加到连接器主体时，支撑柱用作支撑件并将横向力传递到PCB，从而减少连接到PCB的每个连接器主体的基部处的旋转力矩。

公开(公告)号：US06665187B1

公开(公告)日：2003-12-16

申请号：US10198393

申请日：2002-07-16

申请人： David J. Alcoe ,  William L. Brodsky ,  Varaprasad V. Calmidi ,  Sanjeev B. Sathe ,  Randall J. Stutzman

发明人： David J. Alcoe ,  William L. Brodsky ,  Varaprasad V. Calmidi ,  Sanjeev B. Sathe ,  Randall J. Stutzman

IPC分类号： H05K720

CPC分类号： H01L23/10 ,  H01L23/36 ,  H01L23/42 ,  H01L23/427 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.

摘要翻译： 一种具有一个或多个部件的电子封装件，包括：具有第一热膨胀系数的基板; 盖子，附着在基板上，盖子包括蒸汽室，盖子具有第二热膨胀系数，第一热膨胀系数与第二膨胀系数匹配; 与每个部件的背面接触的热转印介质和盖的下壁的外表面; 并且每个部件电连接到基板的顶表面。